BE551335A - - Google Patents
Info
- Publication number
- BE551335A BE551335A BE551335DA BE551335A BE 551335 A BE551335 A BE 551335A BE 551335D A BE551335D A BE 551335DA BE 551335 A BE551335 A BE 551335A
- Authority
- BE
- Belgium
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H01L2924/01015—Phosphorus [P]
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- H01L2924/01019—Potassium [K]
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- H01L2924/01023—Vanadium [V]
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- H01L2924/01024—Chromium [Cr]
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- H01L2924/01—Chemical elements
- H01L2924/01028—Nickel [Ni]
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- H01L2924/01032—Germanium [Ge]
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- H01L2924/01042—Molybdenum [Mo]
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- H01L2924/01049—Indium [In]
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- H01L2924/0105—Tin [Sn]
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- H01L2924/01051—Antimony [Sb]
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- H01L2924/01067—Holmium [Ho]
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- H01L2924/01072—Hafnium [Hf]
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- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- ing And Chemical Polishing (AREA)
- Contacts (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL842366X | 1955-09-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
BE551335A true BE551335A (da) |
Family
ID=19845047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE551335D BE551335A (da) | 1955-09-29 |
Country Status (5)
Country | Link |
---|---|
US (1) | US2917684A (da) |
BE (1) | BE551335A (da) |
DE (1) | DE1047317B (da) |
FR (1) | FR1157675A (da) |
GB (1) | GB842366A (da) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2982894A (en) * | 1960-01-12 | 1961-05-02 | Jr Thomas C Tweedie | Coaxial microwave diode and method of making the same |
DE1126513B (de) * | 1958-08-19 | 1962-03-29 | Intermetall | Verfahren zur Bearbeitung von Halbleiteranordnungen |
FR1217793A (fr) * | 1958-12-09 | 1960-05-05 | Perfectionnements à la fabrication des éléments semi-conducteurs | |
NL122782C (da) * | 1959-08-14 | 1900-01-01 | ||
NL113528C (da) * | 1959-08-27 | |||
US3168687A (en) * | 1959-12-22 | 1965-02-02 | Hughes Aircraft Co | Packaged semiconductor assemblies having exposed electrodes |
GB928110A (en) * | 1960-01-06 | 1963-06-06 | Pacific Semiconductors Inc | Semiconductor devices and methods for assembling them |
US3147779A (en) * | 1960-09-16 | 1964-09-08 | Gen Electric | Cutting and forming transistor leads |
US3025439A (en) * | 1960-09-22 | 1962-03-13 | Texas Instruments Inc | Mounting for silicon semiconductor device |
DE1123406B (de) * | 1960-09-27 | 1962-02-08 | Telefunken Patent | Verfahren zur Herstellung von legierten Halbleiteranordnungen |
US3159775A (en) * | 1960-11-30 | 1964-12-01 | Sylvania Electric Prod | Semiconductor device and method of manufacture |
DE1289188B (de) * | 1964-12-15 | 1969-02-13 | Telefunken Patent | Metallbasistransistor |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2485069A (en) * | 1944-07-20 | 1949-10-18 | Bell Telephone Labor Inc | Translating material of silicon base |
GB635690A (en) * | 1946-07-31 | 1950-04-12 | Gen Electric Co Ltd | Improvements in and relating to crystal rectifiers |
US2677079A (en) * | 1949-06-11 | 1954-04-27 | Automatic Elect Lab | Concentric translating device |
US2541832A (en) * | 1949-07-22 | 1951-02-13 | Gen Electric | Electric current rectifier |
CA478611A (en) * | 1949-12-29 | 1951-11-13 | Western Electric Company, Incorporated | Etching processes and solutions |
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0
- BE BE551335D patent/BE551335A/xx unknown
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1956
- 1956-09-05 US US608067A patent/US2917684A/en not_active Expired - Lifetime
- 1956-09-25 DE DEN12762A patent/DE1047317B/de active Pending
- 1956-09-26 GB GB29393/56A patent/GB842366A/en not_active Expired
- 1956-09-27 FR FR1157675D patent/FR1157675A/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR1157675A (fr) | 1958-06-02 |
GB842366A (en) | 1960-07-27 |
DE1047317B (de) | 1958-12-24 |
US2917684A (en) | 1959-12-15 |