FR1157675A - Système d'électrodes à semi-conducteur - Google Patents

Système d'électrodes à semi-conducteur

Info

Publication number
FR1157675A
FR1157675A FR1157675DA FR1157675A FR 1157675 A FR1157675 A FR 1157675A FR 1157675D A FR1157675D A FR 1157675DA FR 1157675 A FR1157675 A FR 1157675A
Authority
FR
France
Prior art keywords
electrode system
semiconductor electrode
semiconductor
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of FR1157675A publication Critical patent/FR1157675A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • ing And Chemical Polishing (AREA)
  • Contacts (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
FR1157675D 1955-09-29 1956-09-27 Système d'électrodes à semi-conducteur Expired FR1157675A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL842366X 1955-09-29

Publications (1)

Publication Number Publication Date
FR1157675A true FR1157675A (fr) 1958-06-02

Family

ID=19845047

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1157675D Expired FR1157675A (fr) 1955-09-29 1956-09-27 Système d'électrodes à semi-conducteur

Country Status (5)

Country Link
US (1) US2917684A (fr)
BE (1) BE551335A (fr)
DE (1) DE1047317B (fr)
FR (1) FR1157675A (fr)
GB (1) GB842366A (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2982894A (en) * 1960-01-12 1961-05-02 Jr Thomas C Tweedie Coaxial microwave diode and method of making the same
DE1126513B (de) * 1958-08-19 1962-03-29 Intermetall Verfahren zur Bearbeitung von Halbleiteranordnungen
FR1217793A (fr) * 1958-12-09 1960-05-05 Perfectionnements à la fabrication des éléments semi-conducteurs
NL122782C (fr) * 1959-08-14 1900-01-01
NL113528C (fr) * 1959-08-27
US3168687A (en) * 1959-12-22 1965-02-02 Hughes Aircraft Co Packaged semiconductor assemblies having exposed electrodes
GB928110A (en) * 1960-01-06 1963-06-06 Pacific Semiconductors Inc Semiconductor devices and methods for assembling them
US3147779A (en) * 1960-09-16 1964-09-08 Gen Electric Cutting and forming transistor leads
US3025439A (en) * 1960-09-22 1962-03-13 Texas Instruments Inc Mounting for silicon semiconductor device
DE1123406B (de) * 1960-09-27 1962-02-08 Telefunken Patent Verfahren zur Herstellung von legierten Halbleiteranordnungen
US3159775A (en) * 1960-11-30 1964-12-01 Sylvania Electric Prod Semiconductor device and method of manufacture
DE1289188B (de) * 1964-12-15 1969-02-13 Telefunken Patent Metallbasistransistor

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2485069A (en) * 1944-07-20 1949-10-18 Bell Telephone Labor Inc Translating material of silicon base
GB635690A (en) * 1946-07-31 1950-04-12 Gen Electric Co Ltd Improvements in and relating to crystal rectifiers
US2677079A (en) * 1949-06-11 1954-04-27 Automatic Elect Lab Concentric translating device
US2541832A (en) * 1949-07-22 1951-02-13 Gen Electric Electric current rectifier
CA478611A (fr) * 1949-12-29 1951-11-13 Western Electric Company, Incorporated Procedes et solutions pour graver

Also Published As

Publication number Publication date
GB842366A (en) 1960-07-27
DE1047317B (de) 1958-12-24
US2917684A (en) 1959-12-15
BE551335A (fr)

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