GB842366A - Improvements in or relating to scmi-conductor devices - Google Patents

Improvements in or relating to scmi-conductor devices

Info

Publication number
GB842366A
GB842366A GB29393/56A GB2939356A GB842366A GB 842366 A GB842366 A GB 842366A GB 29393/56 A GB29393/56 A GB 29393/56A GB 2939356 A GB2939356 A GB 2939356A GB 842366 A GB842366 A GB 842366A
Authority
GB
United Kingdom
Prior art keywords
supply wire
sept
chromium
nickel
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB29393/56A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electrical Industries Ltd
Original Assignee
Philips Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electrical Industries Ltd filed Critical Philips Electrical Industries Ltd
Publication of GB842366A publication Critical patent/GB842366A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/48091—Arched
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
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    • H01L2224/73265—Layer and wire connectors
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01005—Boron [B]
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    • H01L2924/01015—Phosphorus [P]
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    • H01L2924/01028—Nickel [Ni]
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    • H01L2924/01032—Germanium [Ge]
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    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
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    • H01L2924/0105—Tin [Sn]
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    • H01L2924/01067—Holmium [Ho]
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Contacts (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Abstract

842,366. Semi-conductor devices &c. PHILIPS ELECTRICAL INDUSTRIES Ltd. Sept. 26, 1956 [Sept. 29, 1955], No. 29393/56. Class 37. In a semi-conductor device, at least the part adjacent the electrode of a current supply wire comprises at least 5 % of chromium and at least 5% of nickel, to render it etch resistant, the Figure shows an N-type germanium crystal 1 soldered by a tin-antimony solder to a giltmolybdenum plate 3 and an indium alloy electrode 3 having a supply wire 5 consisting of 20% chromium and 80% nickel. The supply wire is resistant to etching solutions such as a solution of hydrogen peroxide and hydrofluoric acid, and a solution of nitric, hydrofluoric and acetic acids and bromine.
GB29393/56A 1955-09-29 1956-09-26 Improvements in or relating to scmi-conductor devices Expired GB842366A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL842366X 1955-09-29

Publications (1)

Publication Number Publication Date
GB842366A true GB842366A (en) 1960-07-27

Family

ID=19845047

Family Applications (1)

Application Number Title Priority Date Filing Date
GB29393/56A Expired GB842366A (en) 1955-09-29 1956-09-26 Improvements in or relating to scmi-conductor devices

Country Status (5)

Country Link
US (1) US2917684A (en)
BE (1) BE551335A (en)
DE (1) DE1047317B (en)
FR (1) FR1157675A (en)
GB (1) GB842366A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2982894A (en) * 1960-01-12 1961-05-02 Jr Thomas C Tweedie Coaxial microwave diode and method of making the same
DE1126513B (en) * 1958-08-19 1962-03-29 Intermetall Process for processing semiconductor arrangements
FR1217793A (en) * 1958-12-09 1960-05-05 Improvements in the manufacture of semiconductor elements
NL254841A (en) * 1959-08-14 1900-01-01
NL242762A (en) * 1959-08-27
US3168687A (en) * 1959-12-22 1965-02-02 Hughes Aircraft Co Packaged semiconductor assemblies having exposed electrodes
GB928110A (en) * 1960-01-06 1963-06-06 Pacific Semiconductors Inc Semiconductor devices and methods for assembling them
US3147779A (en) * 1960-09-16 1964-09-08 Gen Electric Cutting and forming transistor leads
US3025439A (en) * 1960-09-22 1962-03-13 Texas Instruments Inc Mounting for silicon semiconductor device
DE1123406B (en) * 1960-09-27 1962-02-08 Telefunken Patent Process for the production of alloyed semiconductor devices
US3159775A (en) * 1960-11-30 1964-12-01 Sylvania Electric Prod Semiconductor device and method of manufacture
DE1289188B (en) * 1964-12-15 1969-02-13 Telefunken Patent Metal base transistor

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2485069A (en) * 1944-07-20 1949-10-18 Bell Telephone Labor Inc Translating material of silicon base
GB635690A (en) * 1946-07-31 1950-04-12 Gen Electric Co Ltd Improvements in and relating to crystal rectifiers
US2677079A (en) * 1949-06-11 1954-04-27 Automatic Elect Lab Concentric translating device
US2541832A (en) * 1949-07-22 1951-02-13 Gen Electric Electric current rectifier
CA478611A (en) * 1949-12-29 1951-11-13 Western Electric Company, Incorporated Etching processes and solutions

Also Published As

Publication number Publication date
FR1157675A (en) 1958-06-02
BE551335A (en)
DE1047317B (en) 1958-12-24
US2917684A (en) 1959-12-15

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