BE456802A - - Google Patents

Info

Publication number
BE456802A
BE456802A BE456802DA BE456802A BE 456802 A BE456802 A BE 456802A BE 456802D A BE456802D A BE 456802DA BE 456802 A BE456802 A BE 456802A
Authority
BE
Belgium
Prior art keywords
alloys
copper
heat
beryllium
magnetic
Prior art date
Application number
Other languages
English (en)
French (fr)
Publication of BE456802A publication Critical patent/BE456802A/fr

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
BE456802D BE456802A (https=)

Publications (1)

Publication Number Publication Date
BE456802A true BE456802A (https=)

Family

ID=110386

Family Applications (1)

Application Number Title Priority Date Filing Date
BE456802D BE456802A (https=)

Country Status (1)

Country Link
BE (1) BE456802A (https=)

Similar Documents

Publication Publication Date Title
KR100762084B1 (ko) 동 또는 동합금 타겟트/동합금 백킹 플레이트 조립체
US4159909A (en) Cathode target material compositions for magnetic sputtering
Ding et al. Preparation and arc erosion properties of Ag/Ti2SnC composites under electric arc discharging
JP6640435B1 (ja) 銅合金板材およびその製造方法ならびに電気電子機器用放熱部品およびシールドケース
JP5524905B2 (ja) パワー半導体素子用Al合金膜
JPS59208070A (ja) ア−ク安定化装置
JP2010242177A (ja) 電気・電子部品用銅合金材
JP2011052304A (ja) Cu電極保護膜用NiCu合金ターゲット材
WO2017209279A1 (ja) 表面処理材およびその製造方法ならびに表面処理材を用いて形成した部品
Kai et al. Arc erosion resistance of CuCrMo films deposited via magnetron sputtering
BE456802A (https=)
Chang et al. Comparison of the microstructural characteristics and the electrothermal fracture mechanism of Au-Pd-coated copper wire and Cu-Ti micro-alloyed wire
WO2019130511A1 (ja) 析出硬化型Ag-Pd-Cu-In-B系合金
Semboshi et al. Microstructural subsequence and phase equilibria in an age-hardenable Cu-Ni-Si alloy
JP2020002439A (ja) ヒューズ用銅合金
Zhu et al. New insights into the precipitation behavior of Cu–Ni–P alloy driven by crystallographic transformation of nano-precipitates with different heat treatments: Y.-Q. Zhu et al.
JP4143010B2 (ja) 銅合金導体の製造方法
JP2017106078A (ja) 真空バルブ用接点材料、その製造方法、この接点材料を有する接点ならびに真空バルブ
JP5207052B2 (ja) 接合体およびその製造方法
JP4188299B2 (ja) フラットパネルディスプレイ用Ag基合金配線電極膜及びAg基合金スパッタリングターゲット並びにフラットパネルディスプレイ
JPH01222047A (ja) 銅又は銅合金製バッキングプレート
JP2015227481A (ja) 銅合金材およびその製造方法
JPWO2007142352A1 (ja) めっき膜の形成方法および材料
JP2005314764A (ja) Cu−Ni−Si−Mg系銅合金条
JP2024037196A (ja) プローブピン用合金材料