AU773042B2 - Bonded products and methods of fabrication therefor - Google Patents

Bonded products and methods of fabrication therefor Download PDF

Info

Publication number
AU773042B2
AU773042B2 AU17172/01A AU1717201A AU773042B2 AU 773042 B2 AU773042 B2 AU 773042B2 AU 17172/01 A AU17172/01 A AU 17172/01A AU 1717201 A AU1717201 A AU 1717201A AU 773042 B2 AU773042 B2 AU 773042B2
Authority
AU
Australia
Prior art keywords
components
bonded
silicon
bonded product
nanomaterial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU17172/01A
Other languages
English (en)
Other versions
AU1717201A (en
Inventor
Leigh Trevor Canham
Christopher Leslie Reeves
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Psimedica Ltd
Original Assignee
Psimedica Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Psimedica Ltd filed Critical Psimedica Ltd
Publication of AU1717201A publication Critical patent/AU1717201A/en
Application granted granted Critical
Publication of AU773042B2 publication Critical patent/AU773042B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/032—Gluing
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/16—Silicon interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/341—Silica or silicates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/52—Pre-treatment of the joining surfaces, e.g. cleaning, machining
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/55—Pre-treatments of a coated or not coated substrate other than oxidation treatment in order to form an active joining layer
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/59—Aspects relating to the structure of the interlayer
    • C04B2237/597—Aspects relating to the structure of the interlayer whereby the interlayer is continuous but porous, e.g. containing hollow or porous particles, macro- or micropores or cracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Micromachines (AREA)
  • Medicinal Preparation (AREA)
  • Materials For Medical Uses (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
AU17172/01A 1999-12-15 2000-11-30 Bonded products and methods of fabrication therefor Ceased AU773042B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9929521 1999-12-15
GBGB9929521.4A GB9929521D0 (en) 1999-12-15 1999-12-15 Bonded products and methods of fabrication therefor
PCT/GB2000/004552 WO2001044140A1 (en) 1999-12-15 2000-11-30 Bonded products and methods of fabrication therefor

Publications (2)

Publication Number Publication Date
AU1717201A AU1717201A (en) 2001-06-25
AU773042B2 true AU773042B2 (en) 2004-05-13

Family

ID=10866282

Family Applications (1)

Application Number Title Priority Date Filing Date
AU17172/01A Ceased AU773042B2 (en) 1999-12-15 2000-11-30 Bonded products and methods of fabrication therefor

Country Status (7)

Country Link
US (2) US6832716B2 (enExample)
EP (1) EP1242334A1 (enExample)
JP (1) JP2003528737A (enExample)
AU (1) AU773042B2 (enExample)
CA (1) CA2394136C (enExample)
GB (1) GB9929521D0 (enExample)
WO (1) WO2001044140A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6717212B2 (en) * 2001-06-12 2004-04-06 Advanced Micro Devices, Inc. Leaky, thermally conductive insulator material (LTCIM) in semiconductor-on-insulator (SOI) structure
US7083694B2 (en) * 2003-04-23 2006-08-01 Integrated Materials, Inc. Adhesive of a silicon and silica composite particularly useful for joining silicon parts
JP2005183903A (ja) * 2003-12-22 2005-07-07 Rohm & Haas Electronic Materials Llc 電子デバイスおよび電子デバイスを形成する方法
JP2005183904A (ja) * 2003-12-22 2005-07-07 Rohm & Haas Electronic Materials Llc 電子部品にはんだ領域を形成する方法及びはんだ領域を有する電子部品
US7569202B2 (en) 2005-05-09 2009-08-04 Vesta Research, Ltd. Silicon nanosponge particles
WO2006124625A2 (en) * 2005-05-12 2006-11-23 Nanosys, Inc. Use of nanoparticles in film formation and as solder
GB0515357D0 (en) * 2005-07-27 2005-08-31 Psimedica Ltd Silicon package material
US20080003778A1 (en) * 2006-06-13 2008-01-03 Rensselaer Polytechnic Institute Low-temperature welding with nano structures
JP5621262B2 (ja) * 2010-01-12 2014-11-12 大日本印刷株式会社 Ｍｅｍｓデバイスの製造方法
US8940616B2 (en) * 2012-07-27 2015-01-27 Globalfoundries Singapore Pte. Ltd. Bonding method using porosified surfaces for making stacked structures
CN104409343A (zh) * 2014-12-03 2015-03-11 复旦大学 一种具有光学边缘的氮化硅隔膜的制备方法
US12309537B2 (en) * 2022-09-30 2025-05-20 Huawei Technologies Co., Ltd. Assemblies and methods for managing spectral hole burning

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0461481A2 (de) * 1990-06-12 1991-12-18 Bayer Ag Verfahren zur Herstellung von Metall- und/oder Keramik Verbund-Teilen
DE4342527A1 (de) * 1993-12-15 1995-06-22 Forschungszentrum Juelich Gmbh Verfahren zum elektrischen Kontaktieren von porösem Silizium
WO1996006700A2 (en) * 1994-08-25 1996-03-07 Qqc, Inc. Nanoscale particles, and uses for same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8927709D0 (en) 1989-12-07 1990-02-07 Secretary Of The State For Def Silicon quantum wires
JPH06232236A (ja) * 1991-08-20 1994-08-19 Fujitsu Ltd 半導体装置の製造方法
EP1251556B1 (en) * 1992-01-30 2010-03-24 Canon Kabushiki Kaisha Process for producing semiconductor substrate
JP3191972B2 (ja) * 1992-01-31 2001-07-23 キヤノン株式会社 半導体基板の作製方法及び半導体基板
JP3237888B2 (ja) * 1992-01-31 2001-12-10 キヤノン株式会社 半導体基体及びその作製方法
DE4317174A1 (de) 1993-05-22 1994-11-24 Bosch Gmbh Robert Verbundsystem mit mindestens zwei anorganischen keramischen Schichten und Verfahren zu deren Herstellung
JPH07187836A (ja) * 1993-12-24 1995-07-25 Toshiba Ceramics Co Ltd レーザ光によるＳｉ含有セラミックスの接合方法
WO1996036990A1 (de) * 1995-05-19 1996-11-21 Hahn-Meitner-Institut Berlin Gmbh Halbleiterbauelement auf der basis von silizium mit einer porösen schicht und verfahren für die herstellung poröser siliziumschichten
DE69627252T2 (de) * 1995-08-02 2004-01-29 Canon Kk Halbleitersubstrat und Herstellungsverfahren
GB9611437D0 (en) 1995-08-03 1996-08-07 Secr Defence Biomaterial
GB2337255B (en) 1995-08-03 2000-03-15 Secr Defence Biomaterial
US6017773A (en) * 1997-04-04 2000-01-25 University Of Rochester Stabilizing process for porous silicon and resulting light emitting device
US6064149A (en) * 1998-02-23 2000-05-16 Micron Technology Inc. Field emission device with silicon-containing adhesion layer
TW469643B (en) * 1998-09-04 2001-12-21 Canon Kk Process for producing semiconductor substrate
AU5449900A (en) * 1999-06-03 2000-12-28 Penn State Research Foundation, The Deposited thin film void-column network materials

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0461481A2 (de) * 1990-06-12 1991-12-18 Bayer Ag Verfahren zur Herstellung von Metall- und/oder Keramik Verbund-Teilen
DE4342527A1 (de) * 1993-12-15 1995-06-22 Forschungszentrum Juelich Gmbh Verfahren zum elektrischen Kontaktieren von porösem Silizium
WO1996006700A2 (en) * 1994-08-25 1996-03-07 Qqc, Inc. Nanoscale particles, and uses for same

Also Published As

Publication number Publication date
EP1242334A1 (en) 2002-09-25
US7029986B2 (en) 2006-04-18
AU1717201A (en) 2001-06-25
WO2001044140A1 (en) 2001-06-21
US20050116247A1 (en) 2005-06-02
US20030040180A1 (en) 2003-02-27
CA2394136C (en) 2009-02-24
US6832716B2 (en) 2004-12-21
CA2394136A1 (en) 2001-06-21
JP2003528737A (ja) 2003-09-30
GB9929521D0 (en) 2000-02-09

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Legal Events

Date Code Title Description
DA3 Amendments made section 104

Free format text: THE NATURE OF THE AMENDMENT IS: AMEND APPLICANT'S NAME TO READ: PSIMEDICA LIMITED

FGA Letters patent sealed or granted (standard patent)
MK14 Patent ceased section 143(a) (annual fees not paid) or expired