AU7478400A - Trench dmos transistor having improved trench structure - Google Patents
Trench dmos transistor having improved trench structureInfo
- Publication number
- AU7478400A AU7478400A AU74784/00A AU7478400A AU7478400A AU 7478400 A AU7478400 A AU 7478400A AU 74784/00 A AU74784/00 A AU 74784/00A AU 7478400 A AU7478400 A AU 7478400A AU 7478400 A AU7478400 A AU 7478400A
- Authority
- AU
- Australia
- Prior art keywords
- trench
- improved
- dmos transistor
- trench structure
- trench dmos
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/4238—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the surface lay-out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4916—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39583299A | 1999-09-14 | 1999-09-14 | |
US09395832 | 1999-09-14 | ||
PCT/US2000/024876 WO2001020684A1 (en) | 1999-09-14 | 2000-09-11 | Trench dmos transistor having improved trench structure |
Publications (1)
Publication Number | Publication Date |
---|---|
AU7478400A true AU7478400A (en) | 2001-04-17 |
Family
ID=23564716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU74784/00A Abandoned AU7478400A (en) | 1999-09-14 | 2000-09-11 | Trench dmos transistor having improved trench structure |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU7478400A (en) |
WO (1) | WO2001020684A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7183610B2 (en) * | 2004-04-30 | 2007-02-27 | Siliconix Incorporated | Super trench MOSFET including buried source electrode and method of fabricating the same |
US20060163650A1 (en) * | 2005-01-27 | 2006-07-27 | Ling Ma | Power semiconductor device with endless gate trenches |
US7524726B2 (en) | 2005-08-17 | 2009-04-28 | International Rectifier Corporation | Method for fabricating a semiconductor device |
US7943990B2 (en) | 2005-08-17 | 2011-05-17 | International Rectifier Corporation | Power semiconductor device with interconnected gate trenches |
US11404567B2 (en) | 2018-07-23 | 2022-08-02 | Stmicroelectronics S.R.L. | Trench-gate field effect transistor with improved electrical performances and corresponding manufacturing process |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58176974A (en) * | 1982-04-09 | 1983-10-17 | Fujitsu Ltd | Preparation of semiconductor device |
KR920020763A (en) * | 1991-04-19 | 1992-11-21 | 김광호 | Semiconductor device and manufacturing method |
US5430324A (en) * | 1992-07-23 | 1995-07-04 | Siliconix, Incorporated | High voltage transistor having edge termination utilizing trench technology |
JP3167457B2 (en) * | 1992-10-22 | 2001-05-21 | 株式会社東芝 | Semiconductor device |
JP3396553B2 (en) * | 1994-02-04 | 2003-04-14 | 三菱電機株式会社 | Semiconductor device manufacturing method and semiconductor device |
JP3521628B2 (en) * | 1995-09-29 | 2004-04-19 | 株式会社デンソー | Semiconductor device |
-
2000
- 2000-09-11 WO PCT/US2000/024876 patent/WO2001020684A1/en active Application Filing
- 2000-09-11 AU AU74784/00A patent/AU7478400A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2001020684A1 (en) | 2001-03-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |