AU7164596A - Capped interlayer dielectric for chemical mechanical polishing - Google Patents

Capped interlayer dielectric for chemical mechanical polishing

Info

Publication number
AU7164596A
AU7164596A AU71645/96A AU7164596A AU7164596A AU 7164596 A AU7164596 A AU 7164596A AU 71645/96 A AU71645/96 A AU 71645/96A AU 7164596 A AU7164596 A AU 7164596A AU 7164596 A AU7164596 A AU 7164596A
Authority
AU
Australia
Prior art keywords
capped
mechanical polishing
chemical mechanical
interlayer dielectric
interlayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU71645/96A
Other languages
English (en)
Inventor
Peng Bai
Kenneth C Cadien
Lie-Yea Cheng
Matthew J. Prince
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of AU7164596A publication Critical patent/AU7164596A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76822—Modification of the material of dielectric layers, e.g. grading, after-treatment to improve the stability of the layers, to increase their density etc.
    • H01L21/76828—Modification of the material of dielectric layers, e.g. grading, after-treatment to improve the stability of the layers, to increase their density etc. thermal treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
AU71645/96A 1995-09-29 1996-09-23 Capped interlayer dielectric for chemical mechanical polishing Abandoned AU7164596A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US53600795A 1995-09-29 1995-09-29
US536007 1995-09-29
PCT/US1996/015201 WO1997012393A1 (en) 1995-09-29 1996-09-23 Capped interlayer dielectric for chemical mechanical polishing

Publications (1)

Publication Number Publication Date
AU7164596A true AU7164596A (en) 1997-04-17

Family

ID=24136721

Family Applications (1)

Application Number Title Priority Date Filing Date
AU71645/96A Abandoned AU7164596A (en) 1995-09-29 1996-09-23 Capped interlayer dielectric for chemical mechanical polishing

Country Status (8)

Country Link
EP (1) EP1008175A4 (de)
JP (1) JPH11512877A (de)
KR (1) KR19990063743A (de)
CN (1) CN1203697A (de)
AU (1) AU7164596A (de)
IL (1) IL123749A0 (de)
TW (1) TW304297B (de)
WO (1) WO1997012393A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6153935A (en) * 1999-09-30 2000-11-28 International Business Machines Corporation Dual etch stop/diffusion barrier for damascene interconnects
US7316972B2 (en) 2002-08-30 2008-01-08 Matsushita Electric Industrial Co., Ltd. Contact hole formation method
US7521364B2 (en) * 2005-12-02 2009-04-21 Macronix Internation Co., Ltd. Surface topology improvement method for plug surface areas
US8067762B2 (en) 2006-11-16 2011-11-29 Macronix International Co., Ltd. Resistance random access memory structure for enhanced retention
DE102007063271B4 (de) 2007-12-31 2009-11-26 Advanced Micro Devices, Inc., Sunnyvale Verfahren zur Herstellung eines dielektrischen Zwischenschichtmaterials mit unterschiedlichen Abtragsraten während eines CMP-Prozesses

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01293632A (ja) * 1988-05-23 1989-11-27 Nec Corp 半導体装置
JPH0680638B2 (ja) * 1990-07-05 1994-10-12 株式会社東芝 半導体装置の製造方法
EP0469214A1 (de) * 1990-07-31 1992-02-05 International Business Machines Corporation Verfahren zur Herstellung geschichteter Leiter- und/oder Widerstandsbereiche in Multiebenen-Halbleiterbauelementen und daraus resultierende Struktur
US5164340A (en) * 1991-06-24 1992-11-17 Sgs-Thomson Microelectronics, Inc Structure and method for contacts in cmos devices
KR940009599B1 (ko) * 1991-10-30 1994-10-15 삼성전자 주식회사 반도체 장치의 층간 절연막 형성방법
US5244837A (en) * 1993-03-19 1993-09-14 Micron Semiconductor, Inc. Semiconductor electrical interconnection methods
US5409858A (en) * 1993-08-06 1995-04-25 Micron Semiconductor, Inc. Method for optimizing thermal budgets in fabricating semiconductors
US5340370A (en) * 1993-11-03 1994-08-23 Intel Corporation Slurries for chemical mechanical polishing

Also Published As

Publication number Publication date
WO1997012393A1 (en) 1997-04-03
JPH11512877A (ja) 1999-11-02
EP1008175A4 (de) 2000-10-18
CN1203697A (zh) 1998-12-30
EP1008175A1 (de) 2000-06-14
KR19990063743A (ko) 1999-07-26
IL123749A0 (en) 1998-10-30
TW304297B (de) 1997-05-01

Similar Documents

Publication Publication Date Title
EP0706216A3 (de) Dielektrische Zwischenschicht für eine Halbleitervorrichtung
AU4589897A (en) Multi-oxidizer slurry for chemical mechanical polishing
AU5583996A (en) Insulated container
AU4729496A (en) Chemical apparatus
EP1338384A3 (de) Poliergerät
AU2755497A (en) Cover for beverage can
AUPN718195A0 (en) Laminate wafers
AU5461998A (en) Chemical vapor deposition apparatus
AU2093597A (en) Chemical compounds
AU6450496A (en) Chuck
AU1599795A (en) Cracking processes
AU2428895A (en) Keyless chuck
AU4632997A (en) Laminating apparatus
AU5450796A (en) Carbonated beverage
AU4359597A (en) Reforming apparatus
AU2227297A (en) Dispensing apparatus
AUPO063796A0 (en) Transfer apparatus
AU5551198A (en) Drinking receptacle
AU4027897A (en) Well servicing fluids
AU7164596A (en) Capped interlayer dielectric for chemical mechanical polishing
AU6741094A (en) Liquid-vapour contact apparatus
AU4898697A (en) Constant bottom contact thruster
AU5340998A (en) Packaging manufacturing apparatus
AU4888997A (en) Insulating bottle
AUPN915396A0 (en) Dispensing apparatus