AU5857000A - Transition between asymmetric stripline and microstrip in cavity - Google Patents

Transition between asymmetric stripline and microstrip in cavity

Info

Publication number
AU5857000A
AU5857000A AU58570/00A AU5857000A AU5857000A AU 5857000 A AU5857000 A AU 5857000A AU 58570/00 A AU58570/00 A AU 58570/00A AU 5857000 A AU5857000 A AU 5857000A AU 5857000 A AU5857000 A AU 5857000A
Authority
AU
Australia
Prior art keywords
microstrip
transition
cavity
asymmetric stripline
stripline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU58570/00A
Other languages
English (en)
Inventor
Bjorn Albinsson
Thomas Harju
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of AU5857000A publication Critical patent/AU5857000A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Waveguides (AREA)
  • Structure Of Printed Boards (AREA)
AU58570/00A 1999-06-17 2000-06-13 Transition between asymmetric stripline and microstrip in cavity Abandoned AU5857000A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9902301A SE514425C2 (sv) 1999-06-17 1999-06-17 Övergång mellan stripline och mikrostrip i kavitet i flerlagers mönsterkort
SE9902301 1999-06-17
PCT/SE2000/001021 WO2000079847A1 (en) 1999-06-17 2000-06-13 Transition between asymmetric stripline and microstrip in cavity

Publications (1)

Publication Number Publication Date
AU5857000A true AU5857000A (en) 2001-01-09

Family

ID=20416130

Family Applications (1)

Application Number Title Priority Date Filing Date
AU58570/00A Abandoned AU5857000A (en) 1999-06-17 2000-06-13 Transition between asymmetric stripline and microstrip in cavity

Country Status (8)

Country Link
US (1) US6417744B1 (https=)
EP (1) EP1195081B1 (https=)
JP (1) JP4278326B2 (https=)
AU (1) AU5857000A (https=)
DE (1) DE60030979T2 (https=)
IL (1) IL146909A (https=)
SE (1) SE514425C2 (https=)
WO (1) WO2000079847A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6881895B1 (en) 2003-09-30 2005-04-19 National Semiconductor Corporation Radio frequency (RF) filter within multilayered low temperature co-fired ceramic (LTCC) substrate
US6872962B1 (en) 2003-09-30 2005-03-29 National Semiconductor Corporation Radio frequency (RF) filter within multilayered low temperature co-fired ceramic (LTCC) substrate
US6873228B1 (en) 2003-09-30 2005-03-29 National Semiconductor Corporation Buried self-resonant bypass capacitors within multilayered low temperature co-fired ceramic (LTCC) substrate
US7348666B2 (en) * 2004-06-30 2008-03-25 Endwave Corporation Chip-to-chip trench circuit structure
US7411279B2 (en) * 2004-06-30 2008-08-12 Endwave Corporation Component interconnect with substrate shielding
CA2650496C (en) * 2006-04-26 2016-06-28 Ems Technologies, Inc. Planar mixed-signal circuit board
DE102006025098B4 (de) * 2006-05-19 2008-06-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Sensor zur Ermittlung der elektrischen Leitfähigkeit flüssiger Medien und ein Verfahren zu seiner Herstellung
JP4570607B2 (ja) * 2006-11-30 2010-10-27 株式会社住友金属エレクトロデバイス 高周波モジュール用パッケージ
KR100922576B1 (ko) 2007-12-06 2009-10-21 한국전자통신연구원 밀리미터파 대역에서의 전송 특성을 향상시키기 위한초고주파 전송 장치
US8536954B2 (en) * 2010-06-02 2013-09-17 Siklu Communication ltd. Millimeter wave multi-layer packaging including an RFIC cavity and a radiating cavity therein
US9583836B2 (en) * 2013-11-12 2017-02-28 Murata Manufacturing Co., Ltd. High-frequency transmission line and antenna device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766949B2 (ja) * 1990-09-28 1995-07-19 富士通株式会社 Ｉｃパッケージ
JPH04180401A (ja) * 1990-11-15 1992-06-26 Hitachi Ltd 高周波伝送線路
DE69318879T2 (de) * 1992-04-03 1998-10-08 Matsushita Electric Ind Co Ltd Keramisches Mehrschicht-Substrat für hohe Frequenzen
JP3023265B2 (ja) * 1992-09-26 2000-03-21 日本特殊陶業株式会社 集積回路用パッケージ本体
US5982250A (en) * 1997-11-26 1999-11-09 Twr Inc. Millimeter-wave LTCC package

Also Published As

Publication number Publication date
SE514425C2 (sv) 2001-02-19
US6417744B1 (en) 2002-07-09
EP1195081A1 (en) 2002-04-10
SE9902301D0 (sv) 1999-06-17
JP2003502969A (ja) 2003-01-21
IL146909A0 (en) 2002-08-14
JP4278326B2 (ja) 2009-06-10
DE60030979D1 (de) 2006-11-09
WO2000079847A1 (en) 2000-12-28
SE9902301L (sv) 2000-12-18
IL146909A (en) 2005-11-20
EP1195081B1 (en) 2006-09-27
DE60030979T2 (de) 2007-06-14

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase