AU5817999A - Dechucking method and apparatus for workpieces in vacuum processors - Google Patents

Dechucking method and apparatus for workpieces in vacuum processors

Info

Publication number
AU5817999A
AU5817999A AU58179/99A AU5817999A AU5817999A AU 5817999 A AU5817999 A AU 5817999A AU 58179/99 A AU58179/99 A AU 58179/99A AU 5817999 A AU5817999 A AU 5817999A AU 5817999 A AU5817999 A AU 5817999A
Authority
AU
Australia
Prior art keywords
workpieces
dechucking method
processors
vacuum
vacuum processors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU58179/99A
Other languages
English (en)
Inventor
John P. Holland
Arthur M. Howald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU5817999A publication Critical patent/AU5817999A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
AU58179/99A 1998-09-30 1999-09-10 Dechucking method and apparatus for workpieces in vacuum processors Abandoned AU5817999A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09163368 1998-09-30
US09/163,368 US6790375B1 (en) 1998-09-30 1998-09-30 Dechucking method and apparatus for workpieces in vacuum processors
PCT/US1999/020637 WO2000019592A1 (en) 1998-09-30 1999-09-10 Dechucking method and apparatus for workpieces in vacuum processors

Publications (1)

Publication Number Publication Date
AU5817999A true AU5817999A (en) 2000-04-17

Family

ID=22589739

Family Applications (1)

Application Number Title Priority Date Filing Date
AU58179/99A Abandoned AU5817999A (en) 1998-09-30 1999-09-10 Dechucking method and apparatus for workpieces in vacuum processors

Country Status (4)

Country Link
US (2) US6790375B1 (enExample)
JP (2) JP4414099B2 (enExample)
AU (1) AU5817999A (enExample)
WO (1) WO2000019592A1 (enExample)

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JP4986459B2 (ja) * 2006-01-24 2012-07-25 ルネサスエレクトロニクス株式会社 半導体集積回路装置
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JP4847909B2 (ja) * 2007-03-29 2011-12-28 東京エレクトロン株式会社 プラズマ処理方法及び装置
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US8344318B2 (en) * 2008-09-11 2013-01-01 Varian Semiconductor Equipment Associates, Inc. Technique for monitoring and controlling a plasma process with an ion mobility spectrometer
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US8313612B2 (en) * 2009-03-24 2012-11-20 Lam Research Corporation Method and apparatus for reduction of voltage potential spike during dechucking
CN101872733B (zh) * 2009-04-24 2012-06-27 中微半导体设备(上海)有限公司 感测和移除被加工半导体工艺件的残余电荷的系统和方法
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
US8879233B2 (en) 2009-05-15 2014-11-04 Entegris, Inc. Electrostatic chuck with polymer protrusions
JP5735513B2 (ja) * 2009-09-10 2015-06-17 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 基板位置及び基板電位へのプラズマ信号の結合に基づくプラズマデチャック最適化のための方法と装置
US20110060442A1 (en) * 2009-09-10 2011-03-10 Valcore Jr John C Methods and arrangement for detecting a wafer-released event within a plasma processing chamber
US8797705B2 (en) * 2009-09-10 2014-08-05 Lam Research Corporation Methods and arrangement for plasma dechuck optimization based on coupling of plasma signaling to substrate position and potential
CN105196094B (zh) 2010-05-28 2018-01-26 恩特格林斯公司 高表面电阻率静电吸盘
US8906164B2 (en) 2010-08-05 2014-12-09 Lam Research Corporation Methods for stabilizing contact surfaces of electrostatic chucks
US8580693B2 (en) * 2010-08-27 2013-11-12 Applied Materials, Inc. Temperature enhanced electrostatic chucking in plasma processing apparatus
US8832916B2 (en) * 2011-07-12 2014-09-16 Lam Research Corporation Methods of dechucking and system thereof
US8520360B2 (en) 2011-07-19 2013-08-27 Lam Research Corporation Electrostatic chuck with wafer backside plasma assisted dechuck
US10069443B2 (en) * 2011-12-20 2018-09-04 Tokyo Electron Limited Dechuck control method and plasma processing apparatus
US9101038B2 (en) 2013-12-20 2015-08-04 Lam Research Corporation Electrostatic chuck including declamping electrode and method of declamping
US10002782B2 (en) 2014-10-17 2018-06-19 Lam Research Corporation ESC assembly including an electrically conductive gasket for uniform RF power delivery therethrough
CN105590890B (zh) * 2014-10-21 2019-03-12 中微半导体设备(上海)有限公司 一种静电夹盘表层电荷的中和方法
WO2016137964A1 (en) 2015-02-25 2016-09-01 Corning Incorporated Apparatus and method to electrostatically chuck substrates to a moving carrier
CN106571317A (zh) * 2015-10-09 2017-04-19 北京北方微电子基地设备工艺研究中心有限责任公司 一种晶片粘片处理方法和装置
CN106571316A (zh) * 2015-10-09 2017-04-19 北京北方微电子基地设备工艺研究中心有限责任公司 一种晶片粘片处理方法和装置
JP7138418B2 (ja) * 2017-09-04 2022-09-16 東京エレクトロン株式会社 脱離制御方法及びプラズマ処理装置
US10546731B1 (en) 2018-10-05 2020-01-28 Applied Materials, Inc. Method, apparatus and system for wafer dechucking using dynamic voltage sweeping
WO2022168368A1 (ja) * 2021-02-04 2022-08-11 日本碍子株式会社 半導体製造装置用部材及びその製法
JP7060771B1 (ja) * 2021-02-04 2022-04-26 日本碍子株式会社 半導体製造装置用部材
KR20240057450A (ko) * 2021-09-23 2024-05-02 램 리써치 코포레이션 정전 클램핑을 사용한 리모트 플라즈마 증착
CN114400174B (zh) * 2022-01-18 2023-10-20 长鑫存储技术有限公司 一种等离子体处理装置及其处理晶片的方法
CN120303438A (zh) * 2022-12-07 2025-07-11 应用材料公司 处理基板的方法及处理设备

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Also Published As

Publication number Publication date
JP2010021559A (ja) 2010-01-28
JP2002526935A (ja) 2002-08-20
WO2000019592A1 (en) 2000-04-06
JP4414099B2 (ja) 2010-02-10
US20050036268A1 (en) 2005-02-17
US7196896B2 (en) 2007-03-27
US6790375B1 (en) 2004-09-14
JP5290083B2 (ja) 2013-09-18

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase