AU3755189A - Circuit writer - Google Patents

Circuit writer

Info

Publication number
AU3755189A
AU3755189A AU37551/89A AU3755189A AU3755189A AU 3755189 A AU3755189 A AU 3755189A AU 37551/89 A AU37551/89 A AU 37551/89A AU 3755189 A AU3755189 A AU 3755189A AU 3755189 A AU3755189 A AU 3755189A
Authority
AU
Australia
Prior art keywords
circuit writer
writer
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU37551/89A
Inventor
G. Graham Allen
Kenneth N. Bates
Gary A. Debardi
Robert B. Erley
Ramzi Hamade
Stephen J. Horne
Thomas L. Jacobs
Amar Neogi
Manu C. Patel
John E. Rose
Mark S. Schlosser
David P. Warden
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ariel Electronics Inc
Original Assignee
Ariel Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/193,291 external-priority patent/US5156772A/en
Application filed by Ariel Electronics Inc filed Critical Ariel Electronics Inc
Publication of AU3755189A publication Critical patent/AU3755189A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09581—Applying an insulating coating on the walls of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0763—Treating individual holes or single row of holes, e.g. by nozzle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AU37551/89A 1988-05-11 1989-05-11 Circuit writer Abandoned AU3755189A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US19252388A 1988-05-11 1988-05-11
US07/193,291 US5156772A (en) 1988-05-11 1988-05-11 Circuit writer materials
US193291 1988-05-11
US192523 2002-07-11

Publications (1)

Publication Number Publication Date
AU3755189A true AU3755189A (en) 1989-11-29

Family

ID=26888146

Family Applications (1)

Application Number Title Priority Date Filing Date
AU37551/89A Abandoned AU3755189A (en) 1988-05-11 1989-05-11 Circuit writer

Country Status (4)

Country Link
EP (1) EP0418313A4 (en)
JP (1) JPH0817269B2 (en)
AU (1) AU3755189A (en)
WO (1) WO1989011209A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5146308B2 (en) 2008-12-26 2013-02-20 ブラザー工業株式会社 Development device
EP3334263B1 (en) * 2016-12-12 2019-08-21 OSRAM GmbH Printed circuit board, corresponding lighting module, lighting system and method for implementing lighting modules

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3240624A (en) * 1962-03-07 1966-03-15 Corning Glass Works Method of forming a patterned electroconductive coating
USRE30274E (en) * 1974-09-27 1980-05-13 General Electric Company Method for making a circuit board and article made thereby
US4075301A (en) * 1976-01-22 1978-02-21 Owens-Corning Fiberglas Corporation Method and apparatus for depositing material into a moving receptacle
JPS5328266A (en) * 1976-08-13 1978-03-16 Fujitsu Ltd Method of producing multilayer ceramic substrate
FR2402379A1 (en) * 1977-08-31 1979-03-30 Cayrol Pierre Henri IMPROVEMENTS TO PRINTED CIRCUITS
JPS5660092A (en) * 1979-10-19 1981-05-23 Matsushita Electric Ind Co Ltd Method of treating penetrating wall for bothhside printed circuit board
DE3014041C2 (en) * 1980-04-11 1982-04-08 Braun Ag, 6000 Frankfurt Method for applying electrically conductive tracks to a carrier made of insulating material
JPS56164598A (en) * 1980-05-21 1981-12-17 Fujitsu Ltd Automatic miniature circuit forming device
GB2123739B (en) * 1982-04-30 1986-01-15 James Christopher Ernes Harper Profile forming apparatus
JPS5964685A (en) * 1982-10-05 1984-04-12 Shin Etsu Polymer Co Ltd Anisotropically conductive, heat-bondable film
JPS59171191A (en) * 1983-03-17 1984-09-27 松下電器産業株式会社 Method of printing thick film circuit
JPS60134495A (en) * 1983-11-28 1985-07-17 タム・セラミツクス・インコーポレーテツド Method of producing electric circuit element
GB2152060B (en) * 1983-12-02 1987-05-13 Osaka Soda Co Ltd Electrically conductive adhesive composition
JPS6174205A (en) * 1984-09-17 1986-04-16 ダイソー株式会社 Anisotropically electroconductive composition
JPS60167491A (en) * 1984-02-10 1985-08-30 株式会社東芝 Method of forming conductor path
JPS60219793A (en) * 1984-04-17 1985-11-02 松下電器産業株式会社 Method of drawing thick film circuit
JPS60249387A (en) * 1984-05-24 1985-12-10 日本電気株式会社 Method of forming wiring pattern of printed circuit board
US4557860A (en) * 1984-07-06 1985-12-10 Stauffer Chemical Company Solventless, polyimide-modified epoxy composition
DE3477633D1 (en) * 1984-07-26 1989-05-11 Matsushita Electric Ind Co Ltd Method of and apparatus for forming thick-film circuit
JPS6164188A (en) * 1984-09-05 1986-04-02 松下電器産業株式会社 Thick film circuit forming device
US4604230A (en) * 1984-10-15 1986-08-05 Stauffer Chemical Company Thermally stable adhesive
US4759970A (en) * 1984-10-25 1988-07-26 Amoco Corporation Electronic carrier devices and methods of manufacture
US4654956A (en) * 1985-04-16 1987-04-07 Protocad, Inc. Drill apparatus for use with computer controlled plotter
DE3518975A1 (en) * 1985-05-25 1986-11-27 Bayer Ag, 5090 Leverkusen PLASTIC PART
US4749347A (en) * 1985-08-29 1988-06-07 Viljo Valavaara Topology fabrication apparatus
US4652398A (en) * 1985-09-12 1987-03-24 Stauffer Chemical Company Rapid curing, thermally stable adhesive composition comprising epoxy resin, polyimide, reactive solvent, and crosslinker
US4775573A (en) * 1987-04-03 1988-10-04 West-Tronics, Inc. Multilayer PC board using polymer thick films

Also Published As

Publication number Publication date
WO1989011209A1 (en) 1989-11-16
EP0418313A1 (en) 1991-03-27
JPH0817269B2 (en) 1996-02-21
EP0418313A4 (en) 1992-01-15
JPH03504909A (en) 1991-10-24

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