JPH03504909A - circuit lighter - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] b. Extruding an insulating, polymerizable thick film material from the orifice to the first hole. step, C polymerizing the insulating thick film material to form an insulating plug in the first hole; floor, d. A second hole is formed in the insulating plug, leaving a ring of insulating material in the first hole. stage, e　A second polymerizable thick film material that becomes conductive after polymerization is inserted into the second hole. the second material is extruded through an orifice so that the second material covers the insulating material on each side of the circuit board. the second material is in contact with each of the conductive pads, and the second material is in contact with the insulating material. f being electrically isolated from said inner conductive layer by an annular body of polymerizing the second polymerizable thick film material to form an electrical connection between the pads; and the second material is electrically isolated from the inner conductive layer. Law.

110a A circuit board support having an internal conductive layer and conductive pads on each side. : b. A connection between the pads on both sides of the circuit board, 1) drilled through the circuit board and through conductive pads on each side of the circuit board; a first hole penetrating the inner conductive layer; 11) Extrude an insulating polymerizable material from an orifice into the first hole to an insulating plug passing through the first hole formed by polymerizing an edge material; 111) Leaving a ring of insulating material penetrating the circuit board and passing the light through the insulating plug. jv) Extrude the polymerizable material into the second hole, and in contact with the pads on both sides of the circuit board, and by the ring of insulating material. polymerizing the polymerizable material that is isolated from the inner conductive layer and becomes conductive after polymerization; a conductive trace through the second hole formed by; With connections including: A circuit board for holding electrical components, including

111 conductive pads on one side of the circuit board having an internal conductive layer. make an electrical connection to a conductive pad on the opposite side of the circuit board without contacting the The method is: a through the circuit board and through the conductive pads on both sides of the circuit board; forming an elongate penetrating the inner conductive layer; b Along a part of the elongated hole (ζ within the thickness of the insulating polymerizable layer that intersects the internal conductive layer) extruding the film material subgrade from the orifice; The first trace of the thick film material that becomes conductive after C polymerization is Extruded from an orifice into a hole, a first trace of the conductive material The first material has a narrower width than the material roadbed and overlaps the insulating roadbed. The traces do not contact the internal conductive layer and the first traces are on both sides of the circuit board. d contacting each of said conductive pads in said polymerizable pad; A method comprising: polymerizing the material.

112 Before the step of polymerizing the polymerizable thick film, an insulating polymerizable thick film is added. Extrude a coated trace of thick film material onto the first trace, and comprising the additional step of masking the first trace at a height of the inner conductive layer of The method described in Section ill.

118g Circuit board support having an internal conductive layer and conductive pads on each side; b. A connection between the pads on both sides of the circuit board, 1 1) formed through the circuit board and through conductive pads on each side of the circuit board; and a long diameter penetrating the inner conductive layer; ! 1) Formed by extruding an insulating polymerizable material from the orifice into the elongated hole. an insulating subgrade in the slot, intersecting the internal conductive layer of the circuit board, 1i i) formed by extruding a polymerizable material into the elongated hole, and contacting the pads on both sides of the circuit board and disconnecting the insulation from the internal conductive layer of the circuit board; Connections with conductive traces separated by edge subgrade: A circuit board for holding electrical components, including

115 orifice extruded from said internal conductor of said circuit board. A covering trace covering the conductive trace at the top of the conductive layer is placed between the pads. for holding an electrical component as claimed in claim 114, wherein the connection of additionally comprises: circuit board.

Align and install the differentiated device lead wires on the 1180 circuit board support shrine. The mounting for forming the pad is: a) extruding a pad of insulating polymerizable material onto the circuit board support; b. Polymerizing the insulating material, C. aligning the lead wires of the electrical components. forming an opening in the polymerized insulating pad for attachment; A polymerizable material that becomes post-aligned after dffi is extruded into the opening; The electrically conductive attachment for said leads of electrical components is performed before the step of forming the surface, e. A method comprising: polymerizing a conductive polymerizable feed.

117a　Circuit board support material, b. Extrude an insulating polymerizable material, polymerize the insulating material, and form an electrical component. An opening is formed in the insulating pad to align and attach the lead wire of the key. extruding a second polymerizable material into the formed opening that becomes conductive after curing; a conductive attachment for said lead wire forming a surface of said second polymerizable material; The multiple mounts on the circuit board support formed by kinearing the dd; A circuit board for holding electrical components, including

Engraving (no changes to the content) Specification circuit lighter Comparison with related patent applications This application was filed on May 11, 1988. Ji No. 193.291 “Circuit Lie It is a partial continuation of CIRCUIT WRITER J, and was published on May 1, 1988. U.S. Patent Application No. 192.523 filed on the 1st “Circuit lighter material (CIRCUIT W) RITERMATERIALS) is a partial continuation of J.

field of invention The present invention relates to the fabrication of circuit boards, and more particularly to the manufacture of circuit boards by extruding conductive circuits between points on the board. equipment, methods and materials for forming Regarding the board.

Background of the invention For at least the past 25 years, there has been rapid growth in the electronics industry in the United States and around the world. An essential area was the development and manufacture of printed circuit boards. these Printed circuit boards typically contain electrical and electronic components such as resistors, capacitors, integrated circuits, transistors, etc., to produce electrical circuits that incorporate these elements , supported by a non-conductive substrate (i.e. plate) in such a manner that it can be mounted formed from m conductive traces (trajectories). Conductive traces are the “wires” in a circuit. ”, the plate provides structural integrity, convenience for installation in the chassis frame and Provides support for connecting to other circuits. Printed circuit boards are used for almost all electronic An integral part of a product and often the most complex and expensive part of the overall device . For example, many computer operating components and electronic memory all reside on one or more integrated on the lint circuit board.

Tabletop convenience stores are a good example of products that make extensive use of printed circuit boards. integrated circuit The development of the computer aided in the development of the desktop combi computer, but the basis of this computer was Powerful central processing unit (CPU) and memory chip that can store large amounts of digital information It is a pool. More powerful processing power, such as forming and displaying complex shapes The motivation was miniaturization technology to incorporate more devices onto a single integrated circuit chip. brought the law. Based on the same motivation, innovative techniques for increasing the density of printed circuits According to the law, in a limited space environment such as the chassis of a tabletop convenience store, a large number of It was decided to operate the memory chip and processor of .

As in the development of all products, many products have been found to be useful and effective. Consisting seeds for producing printed circuit boards that have come to be used by manufacturers techniques have emerged in recent years. 1985 Van Nostr and) Published by RaylOndN, CIark Printed circuit production handbook (Handbook orPrlnted C1 Such a process as described in rcnit Manufacturing) According to one of the It starts with a thin sheet of lath fiber-reinforced epoxy. The material that ultimately forms the traces is copper. A thin plate of copper foil is typically bonded to glass fiber using epoxy resin as an adhesive. It is attached to one or both sides of a thin plate and becomes a blank (semi-finished product). This stratified bra The link is usually perforated. Holes allow this plate to be adapted to other elements of the assembly. Although the holes are for purposes such as centering, centering, and mounting, many holes are used in the final product. It is intended to receive the lead wires of electrical components that are to be finally installed on the board. and touch the final trace on one side to the trace on the other side through the laminate. There are many holes for

If the hole needs to be plated with a conductive metal, usually copper, after drilling. An electroless plating operation is used. After this, define the circuit traces to be formed. Visual techniques are used to develop the pattern onto the copper foil. widely used 2 Two techniques are silkscreen and dry film photoresist. each of them In the process, a pattern called a hanshita is determined separately and applied to the mask as part of the process. be done. In the silk screen process, plating resist material is passed through the opening of the mask. is applied to copper foil. In the dry film photoresist process, the entire copper area The pattern is then cut through a mask using radiation such as ultraviolet light. It is cured (baked). After that, the uncured photoresist is washed away. be done. In either case, the result is a pattern of plating resist material on the copper foil, This pattern covers the area of foil that will eventually be removed leaving the circuit pattern. Ru. The resist will never match a pattern in a circuit trace (it will not match a pattern that is not a circuit). This corresponds to the negative image of the trace.

The next step in the typical process is plating the circuit pattern. Appropriate Place exposed copper foil on circuit traces to provide current carrying cross-section and structural integrity. Conventional plating techniques are used to thicken to a certain thickness.

Plating operations typically involve tracing layers of materials such as tin-lead alloys (solders). Finished by layering on top. Next, the register is usually washed with a solvent. The foil under the resist is removed by chemical etching. solder Over-plating the material protects the circuit traces from corrosive fluids. There is a conductive circuit on the surface of the board. left behind.

Products such as reflow and solder masks that are not detailed in this description , there is a lot of work to be done. The purpose of this discussion is to It's not about teaching people how to make road plates; it's about teaching them how to make road plates, which is a really complicated, time-consuming, expensive process. The purpose is to show that it is reasonable. Even if one board is mass-produced, the number of If you apply these techniques to a limited amount of boards, each board can cost up to $00. It can cost up to several thousand dollars.

In the development of circuit board fabrication techniques, many new innovations have been introduced, especially to increase complexity and density. The axis was made. The path of development involves stacking boards to create the inner layers of complex circuits. This includes:

Connections to circuit elements of the plate and other layers are via holes and vias (v) of the non-conductive plate. ia). These are known to those skilled in the art as multilayer boards and have equal board space The amount of circuitry that can be accommodated has increased several times.

Another development is the use of polymeric thick film materials for the preparation of printed circuit boards, especially multilayer boards. was to be used. Thick films of polymers are coated with conductive materials (e.g. silver granules). The use of additives, such as when mixed with silica) or thixotropic additives (e.g. fused silica) It becomes thixotropic. It is a polymeric material (i.e. plastic resin). these is silk-screened directly onto the surface of the non-conductive plate and directly onto the conductive tray. form a gap. Used in multi-layer technology, one layer of silkscreen printed circuitry is connected to another. They are stacked together in alternating layers with materials and printed circuits, and connections between layers are Made with iron and drilled and plated holes. Generally, the thickness of the polymer The price of meat film multilayer board can be half of the price of layered copper multilayer.

A serious problem that remains unsolved even with this or that new development. , problems that are carried over from one technology and plague the next. One of them is The purpose is to apply block printing to trace formation on a board. The first step in manufacturing the board is the engineering It is a stage. A theoretical circuit is devised and circuit performance is calculated. Next, representatively CPU from one manufacturer, DRAM from another manufacturer, and other products from another manufacturer. A component is specified from an off-the-shelf item, such as an element of is calculated. For example, when extremely high speeds are required for signal transmission, the length of the conductor, or its cross-sectional area and conductivity if it has to withstand high current loads. There may be restrictions imposed. Expansion/contraction relationships between traces and supports, and There are also other engineering considerations, such as cooling and heat dissipation requirements. These calculations depending on the nature of the prototype development and production equipment used to implement the design. design engineers are also constrained.

In today's working environment, all design rules are taken into account, calculated and traced. A new powerful computer pro to create turn-by-turn graphic displays Design engineers are often helped by graphics. pattern made is called a route, and the software tool is called a router. Numerous possible alternatives Basics that allow you to quickly perform layouts while still adhering to the general rules of all routers. The computing tool is a router engine.

After the routing and iterative process of selecting computer-generated options, , the route must be incorporated into the board prototype or the version to be transferred to the mass production process. The fact that there is no such thing is important. Traditional processes are photoresist or plating Requires a mask for silkscreen printing. Polymer thick wall fill The process requires a silk screen to coat uncured materials onto the board surface. shall be.

The use of drafts introduces expensive and time-consuming intermediate steps and also introduces errors such as inconsistencies. increase opportunities for

Another problem that still exists and becomes even more complex is the costly . The imperative of validating a design before moving it through the laborious mass production process It is a necessity. This process is known as the pletboard process and is believed to work. and that the circuits that engineering calculations have shown should work actually work in the real world. the practice of producing a limited number of plates, preferably in a relatively inexpensive manner, in order to verify the It is. One method used on breadboards is to have no circuit traces. However, the circuit elements can be mounted on a standard board with edge pads and other somewhat standard characteristics. , using thin wire or other trace material that can be handled by hand, for soldering or wire wrapping. It is more about connecting elements. This process is of course cumbersome and error-prone. easy. Other breadboarding techniques are essentially equivalent to those used in mass production. including small plating tanks for processing one or several plates at a time. Yes, we use smaller facilities and hand-operated equipment than those dedicated to mass production.

This process is also expensive and time consuming.

When the breadboarding process is finished, the iterative modification process is completed, and a large number of boards have been manufactured. , another very typical problem arises. Added one or two elements to improve performance. Technical changes are often required, such as adding The result is a large amount of finished board. stock and must be scrapped or repaired at unacceptable cost. This means a large amount of expense. This stock can be used or commercially available The manufacturing process includes cutting traces and adding jumper wires. cutting The process of making jumpers and jumpers is generally manual and therefore prone to errors and Therefore, it becomes extremely expensive. Moreover, the bureau removal that is done is often amenable to mass production processes. The existence of the bar, which is done in an unscrupulous manner, is due to the technical foresight of the company that manufactures printed circuit boards. Many people think this is a good way to judge power. Many product verifiers also , partially evaluate the product by the cuts and jumpers present on the printed circuit board used. worth it.

Computer-aided engineering and computer-generated routing and related production directly Printed circuits can be printed on a control combinator or loaded into a control computer. A computer-controlled device that allows the device to directly produce It becomes necessary. such as a mask for applying photoresist or plating resist Eliminates the intermediate stage of realizing the block copy in other forms, resist and plating finish Work will also be deleted. For maximum utility, such devices should Even though it is supposed to produce traces that can intersect with each other (i.e. give a crossover) , so the density of the multilayer board will be increased as well. From digital data The direct writing of traces integrates all the complex stages of printed circuit board fabrication, It will especially help with the breadboarding process. Such a direct circuit writing device is It would also significantly improve the process of making repairs in the form of cuts and jumpers. the On a board made by a circuit writer, program the disconnects and jumpers. 0 and would be difficult to distinguish from the original trace. Like that equipment, if properly programmed and automated, can replace traditional boards (accessible It is also used to install jumpers (with traces of It would be possible to eliminate the same manual repairs.

Summary of the invention According to a preferred embodiment of the present invention, the additive technique is used instead of the removal technique in wet method 1. An apparatus and method for preparing conductive traces on a circuit board using a technique is disclosed.

Tracing is a continuous process rather than a parallel process as in silkscreen techniques. Written directly, each trace can be individually isolated. Therefore, cross-o electrical contact to the element without wires became commonplace, allowing electrical contact to elements without wires, and at the same time Additionally, multilayer plates prepared by other processes can be simulated. originally prepared The degree of freedom to trace virtually any pattern makes it easy to create complex circuits. Also, it is possible to quickly create a pellet board, usually in units of hours rather than days or departures. This is particularly important in the sense that it is possible to Furthermore, the apparatus in a preferred embodiment is computer controlled and uses a combinator-generated routing program and a computer. can be operated by instructions given by a computer aids engineering program. Wear.

Additionally, jumpers for existing boards can be easily programmed. Also , with automated direct writing capabilities, parallel production processes typically reduce the Small-scale production work, which is always expensive, can be done quickly and at an extremely low price.

The method of the invention includes two steps: (1) Stage calibration. For example, the location on the board is trace routing engine. 01) Calibrate the stage to match the pre-programmed position; to the first extrusion element under programmed control of the base routing engine. By extruding traces onto the board.

This trace consists of a first material; (Iil) Curing of the trace: (iv) Cured tray under programmed control of the trace routing engine Place the second material on top of the surface. A second material encases the cured trace: (V) (vi) curing of the material of 2; (vi) determined by the trace routing engine; repeating steps (11) to (v) until the circuit is completed; (vii) Cure the first and second materials to form a circuit of insulated conductive traces. What to do: The stratification stage is the trace routing engine's programmed Preferably this is done by a second extrusion element operated under control.

The result of this method is an isolated conductive trace on the substrate. Typically, insulation The conductive traces made by curing the first material are Made by curing a core material consisting of a thick film of polymer and a second material. between the exterior material, which is made of a thick film of insulating polymer, and the core material and exterior material. an interfacial material that is impermeable to water and solvents within the second material.

In an alternative approach, the conductive traces are not completely covered with insulation; Instead, a plurality of locations where crossover occurs overlaps the first polymerizable material. A second polymerizable material is then applied over the circuit board support. In this way , a second or subsequent layer is applied that intersects the first set of traces at the point to be insulated; A multilayer board is produced.

The device according to the invention includes one stage and a first pusher for extruding a first material. Includes an out element. preselected on the surface of the circuit board to produce conductive traces. The extrusion element and the circuit board are placed in relative proximity to extrude the first material along a path that holding the first extruded element in contact with the circuit board and causing relative movement between the first extruded element and the circuit board. This is the purpose of the page. The conductive traces are then covered with an insulating material and the insulated conductive traces are It is desirable to give a trace. Additionally, the apparatus includes a method for applying a second material to a conductive tray. a second extruded element extruded onto the base to produce an insulated conductive trace; More desirable. The first and second materials form a thick film of polymer after a curing step. Most preferably, it is a polymer solution that forms.

In accordance with a preferred embodiment of the invention, the circuit board support material includes a circuit board support and a plurality of conductive traces. A circuit board for holding electrical components is disclosed. Traces are electrical elements During the process, the traces are glued to the circuit board support and traced along a path that defines the location of the trace. By extruding from the orifice onto the support, the trace is formed into a thick film of polymer. It is formed from In a preferred embodiment, the trace has a maximum thickness in one pass. at least 25% of its minimum width, preferably at least 50% of its minimum width. It's the thickness. Additionally, continuous layers of conductive material can be applied without any insulation between the layers. It can even be made thicker by laying traces. one wish In a new embodiment, the substrate support comprises a plurality of electrically conductive materials that electrically connect the electrical elements. Has a pad. That is, the trace begins and ends on the top of the pad, and form an electrical path.

An important feature of the invention is that the combined operation of the device and the atomic properties of the first and second materials It is. Preferably, the first and second materials exhibit thixotropic hysteresis as stress increases and decreases. The rate of change in shear rate is a non-decreasing function of the applied stress. It is pseudoplastic in that it is.

These properties simplify the control of the first and second materials during extrusion and Valve activation timing, pumping flow rate, pressure head and/or the like in the extrusion element of 2. A predetermined coating speed can be achieved by the R node.

Another important feature of the invention is that the first and second materials are cured immediately after extrusion. Before that, the viscosity increases. Preferably, the increase in viscosity is due to evaporation of the solvent. The degree of increase achieved is that the applied trace requires curing between coats. It is sufficient to support the weight of the oats without straining. most also preferably includes one or more solvents, at least one of which has a high vaporization rate. The first material includes conductive particles and a polymeric precursor material in a mixed solvent.

Another important feature of the invention is that the second material is coated or formed on the first material. When layering, the water and solvent of the second material are passed through the interface between the first material and the second material. There is no hydrophobic polymer layer that forms clearly and rapidly. Below, this solution The agent-impermeable hydrophobic polymer layer is called an interfacial layer. The interfacial layer is such that the components within the first material are is believed to be formed by reacting with components within the material. This serves two functions (i) Keep moisture out of conductive traces and prevent electrolysis of metal components. Preventing deterioration of conductivity due to material movement: (eye) from newly applied second material Prevents transfer of solvent to conductive traces, allowing resolvation of conductive traces and possible Prevent deformation. Desirably, the interface is formed by a reaction between polycyanate and polyamine. A layer is formed.

Brief description of the drawing FIG. 1 is a block diagram of a first preferred embodiment of the present invention; FIG. 2A shows a typical base plate and rail arrangement for the first preferred embodiment, with the circuit Precise X necessary for writing.

Only the main framework elements and bearing/rail mechanisms for providing y- and z-axis motion are shown. perspective view, Figure 2B is next to the saddle carriage, perpendicular to the length of the rail assembly, looking in the X direction. 2 is a cross-sectional view of the adjacent rail assembly showing the elements that make up the saddle carriage; Figure C is a sectional view taken along line A-A in Figure 2B, and Figure 2D is a cross-rail according to the present invention. end view of the assembly; FIG. 2E shows the shaft and spacer rails adjacent to the writing carriage according to the present invention. cross section, FIG. 2F shows the passage through the base block of the writing carriage according to the invention in FIG. 2E. FIG. 2G is a cross-sectional view of plane A-A of FIG. 2G, and FIG. 2D is the opposite end of the close rail assembly. end view, similar to FIG. 2H together with a preferred embodiment of the invention showing elements not shown in the other figures. Plan view of the writing table when in use, FIGS. 3A and 3B show an example of an optical system that allows the writing carriage to be moved in the y direction. FIG. 3C shows a front view of the y-drive device according to the invention, showing a preferred method. Figure 3A is a view taken along line B-B, and Figure 3D is a cross-section taken along C-0 plane in Figure 3C. 3E is a sectional view taken along the c'-c' plane of FIG. 3C, and mJA is a cross-sectional view of the present invention. A top view of the X-motion assembly according to Figure 4B is used for the X-motion assembly of Figure 4A. An enlarged view of the drive motor and drum showing the cable wrapping around the drum; Figure 4C is a view from the A-A plane in Figure 4B, and Figure 4D is a view from the B-B plane in Figure 4B. Figure 4E is a view seen from the C-0 plane of Figure 4B, and Figure 4F is a view of Figure 4A. FIG. 4G, a view seen from plane A-A in the figure, shows a portion of one end of a preferred embodiment of the present invention. A perspective view of FIG. 4H is a perspective view of a portion of the other end of the preferred embodiment shown in FIG. 4G; Figure i41 shows the touchpad as used in the preferred embodiment for setup purposes. A perspective view of the pad, FIG. 5, shows one of the traces that can be written by the device of the invention. A diagram showing an example, Figure 6A is a side view of the writing carriage, taken from the same direction as Figure 2E; Figure 6B is a view at 90° relative to the view in Figure 6A, viewed in the direction of line A-A in Figure 6A. Elevation of the writing carriage at an angle, FIG. 6C is a view of a portion of the writing carriage seen from the A-A side of FIG. 6B; FIG. 6D shows the rotational motion used to convert rotational motion into linear motion along the two axes of the device. a perspective view of a portion of the tongue strip shown in Figure 6C; Figures 6E and 6F show how to control the flow of extrusion material while writing the circuit. Figure 2 shows two positions of the three-way valve according to the invention used; FIG. 6G is a diagram of the elements constituting the writing chip according to the present invention; Figure 6H is a hypodermic syringe-like tubular tip for extruding traces of conductive PTF material. Figure 61 shows the desired shape for extruding traces of non-conductive PTP material. A diagram of the desired shape of the hypodermic syringe-like tubular tip, Figure 6J, shows how to draw the trace. A diagram showing the use of the chip of FIG. 6H, Figure i6 shows how to use the chip in Figure 6 when writing traces, FIG. 7A is a plan view of a preferred alternative embodiment of the present invention; FIG. 7B is a top view of a preferred alternative embodiment of the invention; - a cross-sectional view of the preferred alternative embodiment along plane A; FIG. 7C is a view of the Talos rail assembly seen from the B-B plane of FIG. 7A; Figure 7D is a view of the writing carriage as seen in the direction of line A--A of Figure 7C; FIG. 7E shows an alternative embodiment of the pulley mechanism as viewed in the direction of line C--C of FIG. 7A. Figure, FIG. 7F shows the cable path of an alternative embodiment, looking in the direction of line C-C of FIG. 7A. The other figures, Figures 8A, 8B and 8C, show how to automate the invention. Figure 9, a block diagram showing the broad information flow used in the A block diagram showing the process control functions used, Figure 810 shows typical pads on a printed circuit board used in accordance with the present invention. Figure, FIG. 11 shows a representative diagram between pads on a printed circuit board used in accordance with the present invention. A diagram showing the relationship, FIG. 12A, has pads and traces written according to the present invention. A diagram showing a portion of a printed circuit board,! The f512B diagram shows a two-layer printer according to the invention. Figure 12C shows two pads and extruded traces on one side of a lint circuit board. is a cross-sectional view taken along line A-A in Figure 12B, and Figure 12D is a print of Figure 12B. Diagram showing two pads and traces on opposite sides of the circuit board, FIG. 12E shows two pads on one side of a four-layer printed circuit board according to the present invention. and a diagram showing the extruded trace, Figure 12F is a sectional view taken along line A-A in Figure 12E, Figure 12G is Figure 12E. Diagram showing two pads and traces on opposite sides of a four-layer circuit board, Figure 12H is a top view of two pads and one composite trace; FIG. 121 is a cross-sectional view of the composite trace of FIG. 12H along line A-A; FIG. 13A shows an alternative to the present invention, referred to as the Mlnjbung embodiment. side view of the writing carriage according to an alternative embodiment; FIG. 13B is a view of the writing carriage shown in FIG. 13A from the A-A plane; FIG. 14A is a cross-sectional view of a portion of the minibang embodiment, and FIG. 14B is a cross-sectional view of a portion of the minibang embodiment. A cross-sectional view similar to FIG. 14A in a different position; FIG. 15 is a side view of a carriage for holding a machining head; FIG. 1BA is a partial cross-sectional view of the circuit board; FIG. 16B is a plan view of a portion of a circuit board with milled pads; Factor 18C is a partial cross-section through the pad of FIG. 16B, and FIG. 16D is a supplementary section. A cross-sectional view of a portion of Figure 16C after the floor; FIG. 17A is a cross-sectional view of the circuit board blank, and FIG. 17B is a cross-sectional view of the circuit board blank after the supplementation step. A cross-sectional view of the circuit board of FIG. 17A; FIG. 17c is a cross-sectional view of the conductive trace shown in FIG. 17B; Figure 17D shows a cross-section of the insulating traces above the conductive traces of Figure 17c. , FIG. 111A is a top view of an alternative approach to forming traces between pads; FIG. 18B is a partial cross-sectional view of the plate shown in FIG. 111A at an intermediate stage; FIG. 18c is a partial cross-sectional view of the finished board using the alternative procedure of FIG. 18A; Figure 19A is a plan view of a polymer pad formed by extrusion; FIG. 19B is a partial cross-sectional view of the polymer pad of FIG. 19A; Figure 19C is the first Another section of the polymeric pad of Figure 9A, viewed orthogonally to Figure 19B. The cross-sectional view, FIG. A cross-sectional view of a clad plate electrically connected to its opposite sides, Figure 21A shows an alternative method of making electrical connections from one side of the board to the opposite side of the board. cross section, FIG. 21B is a plan view of the plate shown in FIG. 21A, and FIG. 22A is a plan view of the plate shown in FIG. Polymer buds showing how to provide lead matching to separate devices to be plan view of FIG. 22B is a cross-sectional view of the polymer pad of FIG. 22A, FIG. 23A, and FIG. 23B. is a step-by-step process for making a Riet wire-aligned polymer pad according to an alternative embodiment. A cross-sectional view of the plate showing the continuation, FIG. 23C shows the intermediate step of the process of FIGS. 23A and 23B. A plan view of the FIG. 23D is a cross-sectional view of the pad of FIGS. 23A to 23C when completed. .

DESCRIPTION OF THE PREFERRED EMBODIMENT Figure 1 shows the placement of a conductive material, such as a metal-mixed epoxy, on the surface of a support blank. Example for writing traces on a circuit board by applying a fixed pattern The circuit board f (hereinafter referred to as a circuit writer) is shown. In a preferred embodiment, electrically conductive The material is applied by extrusion in paste or semi-liquid form and cured after application. , forming a permanent conductive path between circuit elements. Circuit elements are added later and pre-processed. A component circuit board (PCB) is completed. In some cases, the circuit writer also It is also used to apply electrical insulation in liquid or semi-liquid form. Support material blank is typically a thin sheet of reinforced plastic, such as glass-reinforced epoxy; In other words, it is non-conductive. Blanks are drilled with holes of different small diameters The metal lead wire of the circuit element is passed through the hole, and then the lead wire is inserted into the circuit. It is fixed to a portion of the conductive path applied by the lighter. newer pc Setting B: In t, the circuit elements can be mounted on the surface and the element leads are inserted into the holes in the plate. It is a method that does not pass through, and the finished board is STM (surface mounting technology, 5ur4ac e mount technology). In either case, on the board Securing the element leads to a portion of the conductive path may be by soldering or is done with a conductive adhesive, such as a metal-mixed epoxy material.

In the first preferred embodiment shown in FIG. 15) includes two parallel rail assemblies (11,l1l) installed on the rails. Sade The saddle carriage (17) straddles the rail assembly (11) and (19) straddles the rail assembly (+3) and connects the saddle carriage and rail assembly. The solid forms an X-direction rail/bearing subassembly. Saddle carriage (17, 19) It is rigidly connected by a cross-rail silk solid body (21) and a writing carriage (23). ) straddles the rail assembly (21) and the bearing in the write carriage Together with the crossrail introduction body, it forms a y-direction rail/bearing subassembly. two rails / As a result of this right-angled arrangement of the bearing subdevices, the old loading carriage (23) has two automatic movement in the X direction indicated by arrow (25) and the y direction indicated by arrow (27) Can be done. The X drive unit (29) moves the combined saddle carriage (17, 19) in the X direction. and the X drive (31) propels the write carriage in the y direction. x-y The table (33) in the system serves to carry the blank (41) on which the circuit is written. vinegar. A small metering device is provided that can start, stop, and adjust the flow of PTF. is carried along with the write carriage (23) and extends from the carriage in an approximately vertical direction. quantified by other elements (not shown) through the existing writing extension (37). Contains a tank (35) of uncured PTF. In other embodiments, the material tank is stationary relative to the frame of the device and the material is guided through the flexible tubing into the writing carriage. can be The writing extension (37) is located on the writing table (33). It is vertically movable in the direction of the arrow (39) within the immediate vicinity of the cb blank (41). .

A computerized control system (48) is connected to the mechanical system and programmed with information. In response to the information, the movement of the writing element and the starting, stopping and metering of the material are controlled by sending power. control. In Figure 1, the control system and its connections to the mechanical system are shown in detail. do not have.

The perspective view of FIG. 2A illustrates a typical base plate and rail arrangement of the preferred embodiment. , main framework elements and bearings to provide the precise X+YrZ movement necessary for writing the circuit / Shows only the mechanism of the rail. In a preferred embodiment, the length is Size Dl) approx. 99011■, width (D2) approx. 8401111, thickness D3) approx. 25 A base plate (15) is cut from a single blank steel plate having a diameter of mm. Preferred implementation In the example, a cutout is made in the body of the base plate to reduce the weight of the component. child The cutout is not shown in FIG. 2A and has no other function. By circuit writer The traces made on printed circuit boards typically have very small cross-sections. It will be clear to a person skilled in the art that this must be the case. In the device of the present invention, 12si wide, although narrower or wider traces can be written. A typical trace is 1 (0,30m+*) and a height of 6all (0,15mm). be. Traces typically have an arcuate cross-section, and are generally semicircular or semielliptical in cross-section. shape, sometimes with a thickness somewhat less than 50% of the width, but generally desirable In embodiments, the thickness is typically at least 25% of the width, and desirably more than 25%. The ribs are also much thicker. By making the traces narrower and thicker , trace density on the circuit board surface can be increased. elements mounted on the board In circuit design for electrical connections, a single trace is required to be extremely long. may require separate traces to be in close proximity. be. Traces that should not touch in wiring diagrams are 10all (0,2 It is not uncommon for them to be within 5 m). Typical geometric shapes of printed circuit boards Because of its small and precise dimensions, the mechanism for transporting the writing carriage is flat and stable. installed on a foundation, or if there is a change in the flatness or stability of the foundation. It is very important to compensate within the operating equipment. Therefore, in the preferred embodiment The I&F and other framework elements are relatively massive to provide the necessary stability. ing. Another advantage of using chunky framework elements is that they It exhibits a large heat capacity and therefore changes slowly in size in response to changes in ambient temperature. .

In the exemplary arrangement shown in Figure 2A, the rail assembly (11) is T-shaped (45). , a hardened and ground shaft (47) and three supports (49, 51, 53). nothing. The support base (49, 51, 53) is cut from a single steel block to ensure dimensional stability. It is relatively heavy to give it a certain quality. The support base is a zipper (not shown) The T-shaped bars are supported by fasteners (not shown). It is installed on a stand. The ground axle (47) is placed so that the axle is laterally centered on the rail. It is mounted to the top of the T-shape by bolts (not shown) as shown. shaft( 47) is typically 125 mm (D4) upward from the top surface of the base plate (15). , are assembled so that the center line of the shaft is parallel to the long side of the base plate.

The rail assembly (13) is similar to the rail assembly (11) and includes a T-shaped rule (55), It includes a ground shaft (57) and a support stand (59, 61, 63). The axis (57) is the base The shaft (47) is located at the same height as the shaft (47) D4) above the top surface of the foundation plate (15) ), and the two axes are aligned together to constrain the write carriage in the X direction. Forms parallel double orbits. The shaft spacing D5 is typically about 840 am, Thos+pson Industries case (cas) e) Commercially available ground shafts such as EtO shafts are suitable, but other shapes of shafts may also be used. be able to. The sets of X direction rails are respectively indicated by arrows (85, 67). It is approximately at the center of the base plate (15) in both the X and X directions.

As mentioned earlier, there are two There is a saddle carriage (17, 19). Saddle carriage (17) is a rail assembly (11) and the saddle carriage (19) is connected to the rail assembly (13). . Each saddle carriage supports a mounting block. For installation, block (B9) is supported. The block (70) is fixedly attached to the saddle carriage (17), and the block (70) is It is fixedly attached to the rigid body (19). Both crossrail assemblies (21) are installed By joining the blocks, both blocks are firmly held together to form a cross rail assembly. (21) and move together in the X direction.

The rail adjacent to the saddle carriage, perpendicular to the length of the rail assembly, viewed in the X direction As shown in figure ff12B showing a cross section through the assembly (11), the saddle carrier The hole (17) has a longitudinal opening with a round through-hole cavity (17) and a rectangular notch (77). It has a mouth (73).

AA cross-sectional view of FIG. 2B along the length of the through-hole cavity (75) and the rectangular notch (77) As illustrated in FIG. 2C, which corresponds to 75) and engages with the shaft (47) to move the saddle carriage (17). It is constrained to move along the axis (47). Bearings (79, 81) are Thompson Industrially manufactured series XR, split ball bushings like ultra-rigid open ball bushings. However, other similar parts may also be used. The open ball bushing completes the shaft. Since the shaft is not completely enclosed and has an open part, the shaft that the bearing engages with is located along the entire length of the shaft. It is supported by the mechanical system and supplements the rigidity of the mechanical system. Figure 2B shows the bearing (79) viewed from the end. The bearing is shown open by the width of the notch (77). The notch (77) is T-shaped. - The carriage (17) is wider than the vertical part of the wheel (45) so that it cannot be interfered with. It is possible to move along the length of the axis (47) without any movement. Saddle key to shaft (57) The installation of the saddle carriage (19) is similar to the assembly shown for the saddle carriage (17). It is done by 3D.

In the end view of the cross rail assembly (21) shown in Figure a2D, the saddle carriage (19) (not shown) is mounted on a support firmly attached to the block (71). A post saddle (97) is shown. The crossrail support (93) is connected to the fastener (1). 07) to the post saddle (97), and is attached to the post saddle (97) by Adjustment screws (101°99) screwed into the straight parts are on both sides of the column (93). It comes into contact with the lower surface of. The hole in the post (93) through which the fastener (107, 109) passes is sufficiently larger than the diameter of the fastener, so within the limits imposed by the saddle , the position of the strut (93) can be adjusted relative to the saddle (97). this The use of adjustment is coupled to the saddle carriage (17) on the opposite X-direction rail assembly. With a similar mechanism to It is to make it a corner. If this position is correct, the pillar (93〉) and the X direction on the opposite side Tighten the fasteners that hold similar posts on the rail assembly to ensure a strong assembly. be able to. Figure 2G shows the crossrail seen in the direction of arrow (84) in Figure 2A. View from the opposite side of the assembly, showing the elements that make up that end of the crossrail assembly. shows.

The cross rail assembly (21) is similar to the axis (47, 57) of the X direction rail assembly. , with two hardened and precision ground shafts. The axes are one above the other, The directional rail assembly is disposed perpendicular to the assembly and horizontally within the assembly.

The axis (85) is the upper of the two, and the axis (87) is the lower. The two axes are pillars ( vertical window (129) with rounded upper and lower edges ground through 93); Get stuck in it. The radius of each rounded end is substantially the radius of the shaft (85, 87). be equivalent to. The shaft is spaced apart by two spacer rails (89, 91) and held in place. The rail itself is held in place by set screws (103°, 105). held. The strut (95) carried by the saddle carriage (17) (Fig. 2A) is Since it supports the opposite end of the shaft < 115.87) and the spacer rail (89, 91) , the axes (85, 87) form upper and lower cross rail assemblies perpendicular to the X direction rail assembly. to be accomplished. The longitudinal movement of the crossrail assembly is (by definition) in the y direction.

The shaft (85°87) and spacer adjacent to the writing carriage (23) (Fig. 2A) FIG. 2E, which is a cross-sectional view of the sensor rail (89, 91), shows two round hole cavities (12 3,125) and a cut passageway with a rectangular notch (+27) connecting them. An empty base block (119) with (121) is shown. pore cavity (12j, 1 25) is equal to the center-to-center distance between the axes (85, 87) of the crossrail assembly. Yes.

? , 2 Cross section of the writing carriage base block at the A-A cross section in Figure E As shown in FIG. 2F, which is a top view, on one side of the block (119), the hole cavity (125 , 123>, linear bearings (111, 113) are incorporated into the shafts (87, 123), respectively. , 85). Linear bearings (115, 117) are bearings (113, 111) It is incorporated into the block (119) on the opposite side and engages with the shaft (85, 87).

The bearings are split straight ball bushings of the same type used in the X-direction rail assembly. This mechanism uses the carriage base block (119) as the axis (115, 87). It is constrained to move only in the y direction. The block (119) is forming a foundation on which the elements of the writing carriage can be securely installed. Structure Planks, framing elements and other elements of the writing carriage must be fitted with screw holes in the block (not shown). ) is installed on the block.

FIG. 2H shows a write table generally utilized in various embodiments of circuit writers. Figure 3 is a plan view of the tile (33), showing elements not seen in the other figures. writing table is pivotable in a pivot bin (571) that is securely attached to the base plate (15). Installed. The lower part (573) of the writing table is attached to the part (573). Three wheels (575, 577, 579) are attached and roll on the top surface of the foundation (15). ). The write table, in the preferred embodiment, It can be rotated relative to the foundation about the center of the pivot pin. Tae The weight of the bull is carried by the wheels.

The mounting of the table on the pivot pin and the mounting of the wheels on the table shall be performed without mechanical clearance. This is done with a minimum value, typically less than I/2*il (12,7μ). , almost any table movement other than rotation about the pivot bin (571) occurs. It can't be done.

an actuating arm for controlling the rotational position relative to the base and other circuit lighter elements; A bracket (581) is then fixed to one corner of the table (33). another The bracket (583) is attached to the foundation (15) and the linear actuator (585) is retained. The axis (587) of the linear actuator is indicated by the arrow (589) It expands and contracts in the direction of , and has a spherical end cap (591). One end is bracketed. (581), the other end force (a tension spring (583) attached to the bracket (583) 9g) is always 1; the table bracket is urged against the actuator shaft. Rini The actuator (585) is operated via a computerized control system (43). The writing table is rotated through a relatively small arc, typically 5". used for. This means that after writing the blank and setting it on the table, you can write the circuit. Used in alignment (centering) procedures before starting.

Fixing a PCB blank to a writing table for writing circuits One method that can be used is a vacuum. In the preferred embodiment, the write table The upper part is a vacuum chuck. On the M2R diagram (1) write on the tape A number of small holes (595) can be seen opening into the top surface of the cell. Don't hide other details As shown, holes are shown only over a small area of the top surface, but in the actual device, Almost the entire top surface of the write table that a blank PCB may come into contact with. Similar pores are present throughout. The holes are connected internally, forming a pentagonal device (Fig. 2H). (not shown) terminates in a pipe fitting (597). writing table A typical way to provide these holes on the top surface of the writing table is to using sintered metal balls. It is also possible to use only vacuum as the plate holding mechanism. However, such an approach means that a PCB blank is typically used to mount the elements. It would have been very noisy, as it would have had holes for water.

Therefore, in a desirable embodiment, a single sheet of Write tape (i.e. tape that does not leave any residue when removed). Place it over the top of the bull and use a vacuum to hold the tape firmly. Next, the PCB block Place the rank on top of the tape and hold the blank by the tape's adhesive properties.

The method in the preferred embodiment of moving the write carriage (23) in the y direction is as follows: This is shown in Figures 3A and 3B.

In Figure 3A, the rail assembly (11, 13) is installed on the block (69, 7). 1), struts (93, 95), upper cross rail shaft (85) and writing cabinet Riji (23) is drawn entirely by a dashed line. Four relatively large corner pillars (181,1 33, 135, 137) are attached to the base plate (15) by conventional fasteners (not shown). ) is securely installed. The corner post is a dowel that performs both x and y movement. Acts as an anchor for securing the ram drive cable to the frame.

FIG. 3B, which is a cross-sectional view taken along the line A-A in FIG. The corner pillars (131, 133) are shown in a three-dimensional plane, along with the arrangement of the various elements of the corner.

The power to move the writing carriage in the y direction is provided by the drive (31), which This includes a step motor (139), a framework (141), and a cable drum (14g). )including. FIG. 3A shows the y drive section (31) in a plan view. On the B-B side of Figure 3A FIG. 3C, which is a sectional view, shows the y drive section (31) in a three-dimensional plane. Drum (143) is pivotally mounted between the two upright parts of the framework (14+) and is connected to the motor from one end. It is driven by the output shaft of the motor (139). The framework (141) has a zipper (as shown). (without) on the foundation (15).

Depending on the preferred embodiment, two strong, braided steel cables are involved in the operation of the y-drive. give The cable (147) is clipped to the end closest to the motor and starts from there. wrapped around the drum (143), exits the drum from the bottom, and attaches to the corner bracket. (135, 137) extends towards the side of the circuit writer occupied by (135, 137). de The wraps on the ram are single-layered, with each wrap around the drum adjacent to the next. Third Figure D is a sectional view of the C-0 side of the drum, and the cable (147) is located below the drum. Shows how it comes out. Cable (145) starts at the end opposite the motor connection and ends at the drive. It is wrapped around the ram, and this also comes out from the bottom of the drum, but the corner bracket (131 , 133) towards the side of the circuit lighter occupied by the cable (147). Get out in the direction. FIG. 3E is a sectional view taken along c'-c' plane of FIG. 3C, and shows the cable (1 45) However, the drum cable is wound only once on the drum, and the two cables are Since they are wound around the drum in mutually opposite rotational directions, rotation of the drum in one direction is Wrap the cable onto the drum and let the other cable out of the drum by the same amount. let Looking towards the motor in Figure 3D, rotating the drum clockwise will cause the Pay out the cable (147) from the drum, and then pull the cable (145) by the same amount. Wrap it around the rum.

A cable (145) extends from the drum (143) to a bearing support pulley (149); There, turn 90 degrees and head towards the corner pillar (133). Figure 3A shows the location of the pulley and cable. The location is shown in plan view. Figure 3B (A-A sectional view in Figure 3A) shows the base plate (15 ) mounted on top of a rigid support (151) 49). Figure 3B is divided into four parts, with one sheet representing the entire length of the circuit lighter. It can be represented by the diagram below.

There are two pulleys on the corner pillar (183), namely a pulley (158) and a pulley (+55). These are similar to pulleys (+49), but act as stable mooring points and at the same time In order to change the height and direction of the cable (145), the plane of the pulley is made vertical. Placed. Cable (145) passes around pulleys (153, 155)) Above the base plate, the installation on the saddle carriage (17) is mounted on the top surface of the block (69). Extends back horizontally in the X direction at a height immediately above. Installation is by block (69) There are two pulleys on the top, namely pulleys (157, 159), and these are in the horizontal plane. Inside, they are arranged side by side. The other of these two pulleys on block (69) The position for the elements is shown in elevation in Figure 2G.

The cable (+45) from the pulley (+55) goes around the pulley (+57) 90″. Then, insert the hole (161) in the post saddle (183) (same as the post saddle (97)). through which it extends in the y direction towards the write carriage (23). write-in carrier The base block (119) of the ji is at the same height as the pulley (157, 159). A pulley (165) is installed on the lower side within the horizontal plane. The cable (145) Turning 180° around the car, in the y direction the installation extends towards the block (69). , through the second hole (187) of the post saddle (111i3) and insert the pulley (159). 90@ and extends towards the corner bracket (131). corner pillar <131 ), the cable <145) is attached to an anchor pin (16 9) is securely moored. The bottle (189) is threaded and fitted with a nut (1 71), and when the nut (171) is rotated, the cable (145) is Pulling and loosening the nut will give slack to the cable (145). cable (145) is locked to the drum (143), so tighten the nut (+71). Then, tension is applied to the cable.

At the end of the drum (+43) opposite to the cable (+45), connect it to the drum (+41). The locked cable (147) is attached to the X foundation plate (15) from the drum. A pulley biased to the pulley (149) mounted on a support similar to the supported support (151) (173). Cable (145) rotates 90° around pulley (173) around and extending towards the corner post (135). At the corner pillar, connect the cable (14 7) goes around the pulleys (175, 177) and towards the saddle carriage (19). Extend back, then turn 90° around the pulley (179) and attach the post saddle. (97) through the hole (181) (Fig. 2D) and near the pulley (165). It extends to a pulley (188) mounted on the underside of the load carriage (23). pulley (165) and pulley (183) are the base blocks forming the basis of the write carriage. It is firmly attached to the lock (110).

The cable (147) goes 180” around the pulley (18g) and the installation is block Return towards the hole (7I) and pass through the hole (185) in the post saddle (97). cable goes around the pulley (187) 90 @ and extends to the corner post (137), where it Then, attach the anchor pin (+69) that locks the cable (145) at the corner post (+31). The cable (147) is securely attached to the anchor pin (+89> similar to Ru. Attach the nut (191) used to adjust the tension of the cable system to the anchor pin. (189) has.

Clockwise rotation of the drum (143) (Fig. 3D) drives the cable (145) the cable (147) from the drum by exactly equal amounts. child The action of the drum (143) and the anchor (189) on the corner post (131) Shorten the total length of the cable (145) in the pulley mechanism between the drums and corners. The entire length of the cable (147) between the anchor (189) on the pillar (137) is the same. lengthen by the same amount. Drive assembly and pulley (149,1) as well as all four corner posts 71) are all securely mounted on the base plate (15) so that the drive assembly and each The distance between the pulleys (149, 173) remains unchanged. The only one that can absorb dimensional changes The location is the position of the writing carriage, which is supported by the ball bushing 2. so it can move along the crossrail assembly.

Rotating the drum (143) clockwise increases the effective length of the cable (145). shorten and move the write carriage towards the X-direction rail assembly (11). Ingredients Physically, the write carriage is equal to half the length of the shortened cable. Move only the distance. For example, shorten the effective length of cable (145) by 4CI11. When the drum is rotated enough to cause the write carriage to move Ku. This rotation adds four countries to the effective length of the cable (147), so the write key The movement of the carriage is restricted by the cable (147) around the pulley (183). There is no such thing.

Play or dimensional instability must be avoided in the circuit in order to perform the precise movements required for drawing the circuit. Serious errors may occur when making connections. Therefore, in the desired evil state , this dimensional instability is typically limited to 2 mil (50,8 μ).

Adjustable anchor bins can therefore be used to close (but not equal to) the elastic limit of the cable. ) Preload the cable to tension. Moreover, the cable should be exercised before installation. and stress is applied to remove small kinks. Together, these tasks Eliminates plastic or non-linear elastic deformation and substantially all play in the cable within. de Another important outcome of the cable system on the ram is that The elastic deformation is precisely balanced by an equal amount of elastic deformation on the other side.

For example, in the X-direction cable assembly, each of the cables (145, 147) The angle formed by the drum (141) with the axis of rotation is such that the write carriage At the center of the travel limit, that is, saddle carriage (17) and saddle carriage (19) Only at a certain point in the middle is 90°. As the drum rotates, the cage Wind the cable (143, 145) onto the drum (+43), let it out, and adjust the angle. is the contact point where the two cables touch the drum (i.e. the cable is connected to the drum). The parts extending away from the pulleys (173, 179) are the move along the length of the drum in either direction depending on the direction in which the drum is rotating. do. The movement of this contact (or equivalently the angle between the cable and the drum axis) changes) cause tension and loosening of the cable. For example, from each end of the drum By wrapping the bull in a single layer, the contacts can move together, and the contacts can also be used as pulleys. (173, 179), so as the drum rotates Ensures that each cable is pulled or loosened by a substantially equal amount This ensures that the stresses in each cable are matched and that precision of the carriage assembly is maintained. motion is directly related to the distance traveled by the cable and is not a function of the stress within the cable. It turns out.

The operation of the aged carriage in the X direction is independent of the position of the crossrail assembly in the X direction. I am in charge. Rail assembly (11.

The movement in the X direction along 9°187), but the effective length of either X-direction cable is (Unwound length) is also unaffected.

The X-direction movement is accomplished by a second cable drive that is independent of the X-direction drive. be done. FIG. 4A is a plan view of the drive section similar to FIG. 3A, but with an X-direction cable drive. The moving part (3]) is not shown. The illustrated drive section (29) is a motor located in the drive section (3I). This is a motor-driven drum cable drive, but the rail assembly (11, 13) Cross rail assembly in the X direction on the bearing associated with the saddle carriage (17, 19>) have different cable mechanisms for moving the

There are four cable extensions exiting the X drive (29) shown in Figure 4A. 4 pieces There are extension parts (199, 201, 203, 205), but the X drive part in the fs4A diagram The plan view is suggestive and does not show details of the cable wrapping on the drum. No. Figure 4B is an enlarged plan view of the X drive section (29), showing the elements and cable mechanism. Show in detail. The drive unit is installed using a bracket (195) and a cable drum (197). ) and a drive motor (191) for rotating the drum. Cable (1 99) is wound from the motor side end of the drum (197), and is wound from the top of the drum. Exit to one side. The cable (203) is wrapped in the opposite direction of the cable (199). The cable wraps around the end of the drum farthest from the motor and runs from the top of the drum. It comes out on the opposite side from where (+99) comes out.

The cables (201, 205) are wound around the drum between the cables (199, 203). It is shown as a single cable with both ends running from the bottom of the drum in opposite directions. Go out to the other side. The extension (205) is in the same direction as the cable (199) and the extension (205) is in the same direction as the cable (199); 201) is in the same direction as the cable (203). For convenience of explanation, one central case Treat the two extensions of the cable as two cables; cable (205) and cable Bull (201).

Figure 4C is a cross-sectional view taken along line A-A in Figure 4B, extending from the drum (197) to one side. The cable (199) is shown. Figure 4D is a sectional view taken along line B-B in Figure 4B. In addition to the bull (199), a cable (205) and a cable (201> are shown. Figure 4E is a sectional view taken along line C-C in Figure 4B, showing the cable (203) along with other cables. ) is shown. In Figure 4E, the clockwise rotation of the drum (+97) is caused by the cable ( +99) to one side and the cable (201) to the other side. Wind up the bull (205) and cable (203).

Referring to FIG. 4A, the cable (201) extends to one side of the circuit lighter, 2! Pulley (207) attached to the pillar (255) installed on the foundation plate (15) and further extends to the corner pillar (137). At the corner post, attach the cable (20 1) passes around two pulleys (215, 213) and changes direction and height. K The block (201) then extends towards the installation block (71). These key points The structure and mechanism are also shown in Figure 4F, which is an elevational view taken from plane A-A in Figure 4A. It is also shown in Figure 4G, which is a perspective view looking towards the corner post (137). relationship For understanding, it is helpful to refer to each of these figures.

Installation is done in block (71), cable (201) is placed around pulley (2+9) Go around 180", return to the corner pillar (+37), go around the pulley (211) and install it. returns to block (71). The installation is in the block, and the cable (201) is Another pulley (219) is attached adjacent to the pulley (219) but rotates independently. 220). The cable then returns to the corner pillar (137) where it By Natsuto (2111): A! ! Cable anchor that can be used as IE ( 217). The case is placed between the corner pillar (137) and the installation block (71). Bull (201) is "passed" four times. As a result, the cable (201) is connected to the drum ( 197), and installed 1cl block (71)! l move it It becomes.

Cable (203) extends to the same side of the circuit lighter as cable (201) and is supported by The circuit goes around the pulley (209) on the pillar (257) and is on the opposite side of the corner pillar (+37). Reach the corner post (115) at the end of the lighter. Figure 4H shows these mechanisms. FIG. 1 is a perspective view looking toward the first corner pillar (+85). At the corner pillar (+35) , the cable (203) goes around the pulleys (227, 225) and changes its height and direction, The attachment extends towards the block (71). The installation is done in the block (71). The cable goes around the pulley (221), returns to the corner post (135), and passes through the pulley (223). The installation returns to the block (71), which is next to the pulley (221). Go around the pulleys (222) that rotate separately, return to the corner pillar (135), and go here. and is locked to the cable anchor (229). Cable drum (197) on one side When rotated in the direction, the cable (201) extends, while the cable (20B) Contracted by an equal amount, the installation biases the block (71) in one direction. cave Rotating the block drum in the opposite direction will have the opposite effect and the installation will rotate the block. Move in the opposite direction.

Cables (199, 205) are connected to opposite circuit labels from cables (201, 203). (Fig. 4A), and the installation is carried out in synchronization with the block (71). Move the lock (69) to move the cross rail assembly in the X direction. 1, 13). The cable (199) is a pulley (231°23 5.237, 243, 239.244) and end at anchor (241). ing. The cable (205) is connected to a pulley (233, 247, 249, 245° 251 ．． 246) and ends at the anchor (25B) of the corner post (133). drum When (197) is rotated in one direction, the cable (199, 201) is shortened and the other , extend the cables (203, 205) by the same amount, and then attach the crossrail assembly. It is energized toward the pillars (131, 137). For rotation in the opposite direction, use cross rail assembly Force your body in another direction. Tension the cable to remove small kinks and prevent elasticity. Pre-stretch the cable close to its elastic limit to eliminate misalignment caused by cable strain. So that the cable anchor can be adjusted. In this preferred embodiment So, both the y-drive motor (+39) and the X-drive motor are DC step motors. It is desirable that there be. High resolution servo motor or other electric motor with high resolution It will also be clear to the person skilled in the art that it can be used. In a preferred embodiment, this The operation of these motors is managed by a computer control system (43) (Fig. 1). , this control system is equipped with a combinatorial system, as normally occurs during microstep operation. They work as if they were the same to give extremely precise movement without putting strain on the machine. Drive these DC step motors as if you were expecting.

Such a route is also quieter than many other routes. 2 electric Motives vary independently of each other from forward, backward, starting, stopping, and motive speeds ranging from 0 to approximately 5 rpm. is operated at a speed of Routes for traces on the printed circuit board to be fabricated The electric motor operates according to a computer program generated from the checking information. . As mentioned above, the cable mechanism from the ν moving part is the cross rail assembly (2I) in the X direction along the rail assembly (11, 13) and remove the write carriage. (23) in the X direction along the crossrail assembly (21). two drives The coordinated movements of the parts are similar to tracing a two-dimensional pattern with a pencil or pen. The writing extension (33) has two degrees of freedom above the writing table (33). 37).

Figure 5 assumes that a circuit writer is required to write traces on a PCB. An example of a simple geometric figure is shown. The trace (259) is the write extension (37) (not shown). The arrow (263) is The X direction is indicated, and the tens and minus symbols indicate arbitrary forward and backward movement in the X direction. arrow The mark (261) represents the X direction, and the tens and minus signs indicate any forward or backward movement in the X direction. Show your determination.

Starting at point (265), the trace (259) is approximately 45@ Extending along part (2H) at an angle. To explain the operation of a circuit lighter, Suppose a trace (259) is written from point (21i5) to point (297) Ru. Portion (267) moves the write carriage in the X direction and the write key in the X direction. By rotating the X drive section and the X drive section so that the slider moves at the same speed. It is written. Starting from point (269), the speed of the X drive is slower than the X drive At point (271), the X drive section stops and only the X drive section is rotating. the As a result, a curved portion (271) is created.

The curvature is adjusted to t8 by controlling the relative drive speed. Part (275) is a straight line extending in the +X direction, and is drawn by rotating only the X drive unit. Ru. At point <277), the X drive starts operating again. extends to point (281) In the curve section (279), the speed of the X-drive decreases harmonically, while The velocity of the part is the same harmonic function out of phase from the function of the X drive part by a phase angle of 180°. To increase.

As a result, a 90° arc is generated, the X drive section stops at point (281), and the X drive section It is working in the direction.

The trace part (283) is caused by the rotation of the X drive unit and the stationary X drive unit. That happens. There is no movement in the X direction in this portion of the trace. At point (285) The X-drive starts again and the X-speed increases harmonically to point (287). and then decreases with the same harmonic function and stops again at point (289). During this time, The speed of the drive unit decreases in the +yX direction and reaches point (287), then increases in the -yX direction. In addition, point (289) is reached. The result is similar to arc (279), but with the addition 180” arc from point (285> to point (289)) created by adding 901 of It is. At point (289), the X drive section is operating in the -yX direction, and the X drive section is stopped. , resulting in a vertical section from point (289) to point (291). Point (291 ), another arc occurs in the same way as the other arc, but with the speed of the X drive. increases harmonically and the speed of the X drive decreases by the same harmonic to complete a 90″ arc arise. In part C295), the X drive section operates in the +X direction, and the X drive section stops. This is the resulting straight line portion leading to point (297).

X drive according to pre-programmed information about the desired trace position and dimensions Computer control of dynamic and y-driven step motors eliminates the need for circuit lighters traces can be generated. Pre-tensioned cable specifications shown. The combination allows x-y information to be accurately conveyed to the PCB. x, opposite to the X direction can generate traces at any angle and with constant and variable curvature. Ru.

However, in reality, process control and automatic routing of various traces To simplify the decision, avoid long drawn arcs and parallel to the x+y axis of the device. It is generally preferable to avoid long movements at angles that are not It turned out to be true. computer program that determines the optimal progression of traces to write By only allowing movement of the seeds within the ram, such traces are avoided. It will be done. This program will be discussed later when explaining the software control of the device. However, hereinafter, this program will be referred to as "router J."

Figure 6A is a side view of the writing carriage (23), in the same direction as Figure 2E; Figure 3 shows a cross-section through the crossrail assembly adjacent the write carriage. crossley Bearing/' space that supports the base block (+19) in the X direction along the Elements of the service assembly are not shown in FIG. 6A. Installation is on a board (277, 279, 281, 282) is firmly connected to the base block (+19), and other than the write carriage. form the structure on which the elements of The installation is a specific arrangement of the plates forming the structure. , is not critical as long as the various elements can be mounted in the correct mechanical orientation. Yo There are other ways in which the installation can form a structure.

The clamp bracket (283) fixed to the writing carriage has a rotary three-way valve. The material tank (35) is held in a substantially vertical orientation with an airtight seal in the opening leading to the valve. Mounted by rail. The tank (35) has traces formed on the PCB. Contains uncured PTF material suitable for

As mentioned earlier, in some cases this material is a conductive material, in other cases It is an electrically insulating material. A step motor (287) starts and stops the material flow. The rotary valve (285) is operated to stop the operation. Semi-rigid piping such as stainless steel tubing (29+) is extended from the lower opening of the valve (285) to the writing tip (293). Ru. The step motor (295) writes at the beginning and end of the trace on the PCB. While raising and lowering the chip (293) and writing traces, Maintain the delicate height of the cutting tip.

Figure 6B is oriented 90' relative to the view in Figure 6A, as seen from line A-A in Figure 6A. Shows an elevation. The clamping element holding the valve (285) is installed on the plate (281) This is a part of the bracket <297) that is removed. Bracket (297) is joint <2 99> to install the motor (287) that operates the rotation shaft of the valve (285). Also serves the eyes. A motor (295) is installed on the frame by a bracket (301). Ru. This motor has a spindle (303) that wraps around the tongue of the tongue-like striped lip (305). Provides bidirectional (vertical) movement of the writing tip by rotating the . 1 pair The slide (307) is guided vertically in the bearing guide <809) of the tongue. strips are bolted together.

The pipe (291) through which uncured PTF material passes on the way to the PCB is connected to the valve (21). 15) and the material is forced to pass through the thorn to reach the writing tip (293). Make some bends and wide bends between the heater block (lid) and the heater block (lid).

The purpose of refraction and bending is to maintain a steady flow of material while providing the necessary freedom for the writing tip. Its purpose is to give degrees of motion. A loop that can be used to provide the necessary mechanical degrees of freedom. There are other types of piping, such as pipes. However, keeping the PTF passage length relatively short It is generally desired that

The purpose of the heater block (113) is to heat the uncured material to control viscosity. It is maintained at a known temperature. The heater block (313) resists depending on the current The temperature readings of the block are preferably taken from the block (not shown in Figure 6B). Control system (43) 16B made into a combiator by the thermocouple element in (not shown in the figure). Control system has pre-programmed settings Maintain temperature by point. The temperature of the material flowing through the writing tip is typical is controlled at 40°C for the desired PTF material used (described below). , and can also be at different temperatures depending on the physical properties of the particular trace material being extruded. Wear.

Figure 6C shows the A--A plane of Figure 6B along the -edge of the slide (807). Spicy The handle (303) is extended inside the loop of the tongue strip (305) and the strip The top is coupled to the slide (307). Figure 6D shows the tongue strip (305) FIG. The tongue strip converts rotation into linear movement without play. used to connect linear motion elements to rotary motion elements so that It will be done.

For 2-drive, it is also very important that the play is O (zero). write a trace A high-quality tray allows you to control the height of the write tip above the PCB while This allows you to complete traces and have traces that intersect across other traces. This is because it is important.

A resistance heater (313) is coupled to the slide (307) at the bottom end of the slide. , a write chip (293) is fixed to the resistive heater. With this mechanism, The precise rotation of the spindle (303) results in the precise vertical movement of the writing tip (293). This movement can be made mechanically by repeating the step position of the motor (295). It is repeatable without mechanical hysteresis.

Figure 6E shows a BB section through the valve <285) of Figure 6B. The valves are each The upper passage (321) and the lower passage ( 323) and a body (317). The valve body consists of a tightly fitted center drum ( 319) has a cylindrical center hole into which it fits. The drum (319) rotates automatically within the valve body. and is rotated by the motor (287) via the joint (299) (Fig. 6B). Turn around. The central drum has a direct passageway (325) and a lateral connecting passageway (327).

At the position shown in Figure 6E, the direct passage (125) coincides with the passage (321, 323). do. This is the position the valve maintains to send PTF during trace writing .

For purposes of illustration, rotation of the drum (319) from the position of FIG. 6E to "close" the valve. is counterclockwise. Due to the small diameter of the passage compared to the diameter of the drum, The channel (323) is typically more than 100 times the cross-sectional area of the exit orifice of the writing tip. Only a slight rotation of the solder is required to completely interrupt the flow of material. Not. Therefore, the flow is extremely rapid, typically stopping in less than 500 microseconds. can be done. In practice, in order to obtain an accurate trace, at most It is desirable to stop the flow in about 1 second. In the illustrated embodiment, close When the drum is rotated 90'' to the position shown in Figure 6F, the side passage (327) is It coincides with the exit hole (82B). The valve (285) is typically covered with stainless steel. It is a brass valve that is commonly used in hospital environments. An example of such a valve is Part numbers available for purchase from Poper & Sons Boil or 6014.

jii6A In figure 6A, whether conductive or non-conductive PTF can be trained with one material. The elements are shown along with one tank for writing the source. Figure 6A shows the writing Extend the material outward from both sides of the carriage. A plate forming part of the writing carriage structure (282) is shown. In fact, the side of the write carriage opposite the first assembly A second assembly of elements is added to and attached to the plates (282, 277), and the two You can write traces on different materials.

In operation, an inert gas such as nitrogen is introduced via line (289). , allowing a gas pressure to build up above the uncured FTP material in the tank (35). introduced The gas is from a source outside the circuit lighter (not shown) and the pressure is typically 25 to 55 psi (1,76 to 3.87 kg/d).

When writing is not being performed, the valve (285) is closed and the writing tip (285) is closed. 93) is driven by a two-way drive to a point approximately 1 am above the surface of the PCB blank. be lifted up.

To write a trace, click the write tick on the PCB above the point where the trace should begin. The X drive section and the X drive section are operated to move the pump. Next, write the writing chip. Activate the two-way drive to move it close to the PCB surface.

Two different writing tips are used in the operation of a circuit writer, one is conductive One is for writing the trace of the isolated PTF, and the other is the trace of the insulating PTF. This is typically, but not always, a conductive PTF tread. layered on top of the base. FIG. 6G shows a typical configuration of a write chip. stainless steel 26 gauge subcutaneous injection made of stainless steel, standard wall thickness, inner diameter, 010' (0,254 mm) The cutting portion (601) of the firing tube is fixedly attached to the tube fitting (603). desirable condition In this case, there is a hole cavity ([106) inside the joint, which has a decreasing diameter. It matches the region (604) with a relatively steep slope, and this region (804) in turn matches the region (604). 04), the second region (602) is adapted to reduce the diameter at a relatively shallower angle than 04).

Region (602) reduces in diameter to the inner diameter of tube (601).

The tube (601) is designed to avoid sudden obstructions to the flow of material into the tube (801). It is inserted until it hits the shoulder. Generally, the length of the tube (601) depends on the back pressure it generates. This is an important consideration in controlling FTP flow. for example, Rule-0- produced by Becton-Dlchson / Leur-Loc female joint No. 4B2 LNR, stylet indexing For a joint (603) without a notch, the length Sl of the pipe (801) is typically 0. It is 200In (5.08mm). Obviously there are other fittings that would be suitable. It is also possible to machine special joints.

Figure 6H is an enlarged view of the end of the hypodermic tube circled (605) in Figure 6C.

This is the process of the chip used to write the first traces of conductive PTF material. The outer bevel A1 of approximately 30° is fabricated into a hypodermic tube. The slope is the same as the inner diameter of the pipe. are not cut until they produce sharp edges between them. Sharp edges are brittle and prone to erosion and damage It is from. Typically, a land S2 of about 15 it (25.4μ) is provided.

The diameter S3 is then approximately 12 m11 (305 μ). Figure 6J is outside Figure 6H How the side-beveled chip relates to the PCB surface when writing traces. show. Width S3 in Figure 6H is a controlling factor in the formation of trace (805) in Figure 6J. and the height Hl of the chip above the PCB surface (607) is equal to the width S3 of the chip. It is kept at about 0.5 times. In this case, Hl is approximately 6 sil (152μ). deer However, in reality, in the desired range of viscosity and flow rate, and in the desired PTF formulation, The trace width has almost no relation to the height of the hand movement, and varies by approximately -100 to +50%. There is no obvious change in the trace width. This relative insensitivity to the height of hand movement is This is very important in being able to provide well-defined, high-density traces.

Figure 6I is a different cutting process for the end of the hypodermic tip. In this case, the sixth An inner bevel was cut into the same original standard tube tip as the tip in Figure H. Interior angle A2 is It is about 118@. Also, do not cut to sharp edges; approximately 1s11 (25,4μ) ) land is left behind. Here, 54 is the outer diameter of the 2G gauge tube, approximately H1ai l(457μ). Sixth figure shows traces of conductive PTF material that have already been applied. To write the insulating PTF trace (809) on top of (605), use the inner slope. Show how the chip can be used.

As a general principle, the dimension that controls the trace width is the effective outside diameter of the tube, i.e. The diameter S3 at the slope is the effective outside diameter of the tube for the FTP being extruded. similarly , on the inner slope, the diameter S4 is the effective outer diameter of the tube for the PTF being extruded.

To begin tracing, open the valve (285) and remove the PTF material from the old chip. computerized control by operating the X drive and The associated cables are connected to the desired trace pattern pre-programmed in the system (43). Move the write carriage through the mechanism.

During trace writing, the resistance heater (313) is activated and the current flows to the writing tip. The temperature of the PTF material is maintained at a constant temperature. Specific PTF material used, writing tip and the temperature according to such variables as required for the width and thickness dimensions required for the trace. degree is pre-programmed.

The typical "writing height" of a trace is the exit end of the writing tip being used. Depending on the specific effective diameter, it varies from 5 to 10 m11 (127 to 254 μ). to The surface of the PCB on which the race is to be written often varies by more than this amount6. can be obtained. As a result, if the two drives are stationary and therefore the writing tip is If you write a trace while keeping it rich, the writing chip on the PCB surface the height would vary unacceptably. To prevent this problem, the circuit light First, measure the height of the PCB surface with respect to the frame reference plane of the computer. PCB about 3 am Divide into four square areas and determine the reference height for each area. height in such an area It has been found that this does not significantly affect the operation of the circuit lighter. This information is input into the control system computer and the relationship with the position of the trace on the PCB surface is displayed. I'll leave it aside. Next, while writing the trace, take into account the area where the writing is currently taking place. 2 drive unit to change the writing height.

When the tracing is finished, close the valve (285) and remove the FTP material from the writing tip. prevent further extrusion of The inner drum of the valve rotates 90'' in approximately 18 milliseconds.

However, as mentioned earlier, it takes only a few turns to completely close the passageway within the valve. Since only one rotation is required, the flow can be effectively interrupted in a much shorter time than 1 millisecond. Ru. Once the valve drum has rotated 90'', the side passageway (327) is connected to the lower hole (323). The passage (825) corresponds to the opening (329) in the valve body. the result, The entire passage (291) of the tube leading to the writing chip is opened to atmospheric pressure, and the tap is removed. reduce the pressure exerted by the inert gas source in the tank and close the valve. Continued extrusion of FTP material from the writing tip due to residual pressure after Ru. At the end of tracing, the two-way drive unit operates to lift the writing tip as well. do.

A preferred alternative circuit writer (hereinafter referred to as Type 2) is shown in Figure 7A. be done. The difference between the first preferred embodiment and the second type is that both the X and Y direction drive parts bearing rails, the pulley mechanism of the X and Y direction drives, and the two on the same carriage. orientation of the writing carriage element to provide two writing assemblies.

As shown in FIG. 7A, the write carriage (337) has an X-direction rail assembly. (385), and the X direction rail assembly is the same as the cross rail assembly of the previous embodiment. , the installation is installed on blocks (339, 341). Installation is done using blocks (3 39) rides on the X-direction rail assembly (331), and the block (341) is installed on the X-direction rail assembly (331). Ride on the directional rail assembly (333). For installation, block and X-direction rail assembly are required. Since it is a rigid assembly, the X-direction rail assembly is constrained to move in the direction.

FIG. 7B shows the installation of the X-direction rail assembly (131) adjacent to the block (189). ) is a cross-sectional view taken along line AA in FIG. 7A; Bearing of X-direction rail assembly (3H) The mechanism includes a rail (347), but this rail cannot be purchased. Following the name of the company that r) It is called a rail. In association with the Sinineburger rail, two bearing blocks (349, 351>).The bearing block is attached to the spacer plate (353). The spacer plate serves to hold the block in a fixed position relative to the rail. each The bearing block consists of complementary balls that circulate along the width of the circulation passage within the restrained rail within the block. Has a bearing. As is known to those skilled in the art, the mechanism that produces this result is Play-free, low-friction shaft with special load-bearing capacity in the horizontal direction perpendicular to the Give the mechanism of the receiving rail.

The Schneeberger rail is mounted on a long support block (34) above the foundation (343). 5) and is connected to the block by conventional fasteners. Installation is The block (3H) is firmly connected to the spacer plate (153) and supports (35) 9) The installation is connected to the block. The support (359) is a second Schnever-gauge. - Carrying the rail. The rail (357) is located in the y direction at 90″ with respect to the x direction. A track is provided to restrain the crossrail assembly from moving in the direction. rail Assembly (333) includes elements equivalent to those shown for rail assembly (331). include.

FIG. 7C is a view of plane B--B of FIG. 7A through the crossrail assembly. Shini The neighbor rail (357) is shown in cross section. The spacer plate (361) is the axis Used to space the receiving blocks (363, 365) and the equivalent of the X-rail assembly. As with the assembly of elements, move the write carriage in the y direction along the crossrail assembly. The block (363, 885) is held so as to be constrained to move.

The spacer plate (361) assembles the elements of the reservoir for carrying conductive or non-conductive PTF material. The attached mounting also serves as a stand, and these elements include the spacer plate and the bearing block (1 63, 165> constitute a write carriage (337). Delivery of type 2 embodiment The write and write tip positioning assembly is an equivalent assembly of the first preferred embodiment. It is similar to a solid. Similar to the first embodiment, transmit conductive and non-conductive traces. Two such assemblies can be used, as can be used. deer However, unlike the first embodiment, each writing chip is used to send the PTF material. The two assemblies that control the write speed of the disk are similar to those in the first embodiment. Installed side by side rather than on both sides of the rail assembly.

Figure 7D shows the writing carriage (337) as seen from line A-A in Figure 7C; Figure 2 illustrates two PTF material feed assemblies. The configuration and installation of the two assemblies are mutually exclusive. The writing chips (369, 371) are very close together.

If you are writing one circuit on one writing chip, change it to the other chip. If not, write the second chip to the position where the first chip was. This arrangement has the advantage that minimal movement of the carriage is required.

For example, if you write a circuit with traces of two different widths, one chip It would be desirable to change to the other chip. The circuit is connected to conductive and non-conductive trays. Such changes may also be desirable if both systems are required.

Regarding the second type embodiment, the movement in the X direction and the movement in the y direction are carried out in exactly the same way as in the first embodiment. There is a separate cable drive for movement. Assemble the writing carriage to the cross rail The y-direction cable system for movement along the body is exactly the same in both embodiments. Ru. The cable drive unit (373) consists of two cables wrapped in a single layer from both ends of the drum. Make 6 bulls.

The cable (375) exits from the top of the drum, crosses a system of pulleys and first connects to the corner structure (375). 77), then the installation reaches the pulley on the block (339) and further writes Turn the pulley at the bottom of the carriage 180 degrees, return to the installation block (339), and finally The first embodiment and one adjustable anchor (379) on the heel structure (381) Installed in exactly the same way. Cable (383) exits from the bottom of the drum and connects to the circuit Further installations are carried out on the corner structure (385) across a similar pulley system on the opposite side of the block (341) and install it through the pulley on the underside of the writing carriage. Return to the anchor (341) and finally the adjustable anchor (387) with the heel structure (3H). reach. The operation of the y-drive drum using a step motor is a cross rail assembly. Move the writing carriage back and forth along the Schneeberger rail.

In some cases it may be desirable for the y-drive to have two cables on each side instead of one. This is similar to the first embodiment illustrated in FIGS. 4B, 4C, and 4D. The drive unit (373) is connected in a manner similar to the cable mechanism described earlier for the X drive unit. This is done by wrapping a third cable around the center of the cable drum.

The third cable provides one more cable extension on each side and provides additional pulleys. , the new cable extensions on each side closely follow the path of the original single cable. so that In this case, additional anchors are added to each of the corner structures (381, 389). Is required. If we provide such a dual mechanism to the y drive unit, it will be possible to There are now two cable passages between each point, which strengthens the mechanism. Ru.

The X-direction drive section for the Type 2 embodiment is different from the X-direction drive section of the first embodiment. or different. The X drive (391) also includes a motor driven cable drum. Dora Two cables are wound around the module. The cable (39B) is attached to one end of the drum (motor It is a heavy winding from the side farthest from the edge), and comes out from the bottom of the drum with a corner structure (311 9).

The cable (393) is attached to the pulley by going around the pulley (H4) inside the bridge (396). corner structure 389) and the installation is carried out through vertically oriented pulleys to the block (341). Extends. This installation is done with a block, and the cable (893) goes around the pulley (897). Return to the lever structure (389) and go around the pulley (395). Next, install the cable. Return to block (341) and attach it separately but next to pulley (397). Return the pulled pulley (398) to the corner structure (H9) where it is attached to the adjustable arm. Coupled with Kerr (399). The cable drum that winds up the cable (3H) The rotation and installation bias the block (341) towards the corner structure (389). Slippery The groove on the top of the wheel (395) is installed on the pulley (397) in the block (341). so that it deviates from the bottom groove by an amount equal to the distance between the groove of the pulley (39g) and the groove of the pulley (39g). , the pulley (395) is attached at an angle to the corner structure. This installation depends on the person. , the cable will be able to enter and leave the pulley groove straight in and out, which is especially desirable. When the cable is under high tension, as in new operating conditions, the effects of friction are Reduce.

Figure 7E viewed from line C-C of the fflTA diagram shows that the installation is with two pulleys on the block. The diagonal mounting of the corner structure illustrates its relationship with the pulley. Only three pulleys are shown.

The cable (401) is wound around the cable drum from the side closest to the motor drive side. It exits from the bottom and side of the drum and heads toward the corner structure (3g+). Cable (40 1) Go around the pulley (405) attached to the block near the corner structure (381). and extends the entire length of the circuit lighter to a corner structure (377). At this corner, The cable (401) goes around a vertically oriented pulley and the installation goes to the block (339). , the installation goes around the pulley on the block, returns to the corner (377), and is installed diagonally. After going around the pulley, the installation returns to block (339) and turns the second independent pulley there. It turns and returns to the corner structure (377) where it connects to the anchor. This mechanism is The installation for the cable (39g) is done with the block (341) and the corner structure (H9). It is similar to the mechanism of a cable system with a pulley in between. The X-drive cable drum rotates and When the bull (401) is rolled up, the installation is done by the block (339) and the corner structure (377). ).

Only two cables (893, 401) are wound around the drive drum, and these two cables (893, 401) are Execute the action. A third cable (407) passes over the drum, but Not rolled. The cable (407> extends to the corner structure <3H) on one side, and the pulley is attached to around a pulley <409) attached at an angle to the bridge (396). This point The cable (407) extends the entire length of the circuit lighter and connects to the structure (385). go. Cable (407) is the same as described for cable (393, 401) above. In the same manner, the surrounding and corner structure (385) of the pulley and the installation are made with the block (341). pass between. On the opposite side of the circuit lighter, connect the cable (407) to the corner structure (381). ) and installed around the pulley and corner structure (381) in the manner already described for the other pulleys. The attachment passes between the block (339) and the block (339). Cable (407) Edge structure (381 , H5) and counterbalances the tension of the cable (39L401) mechanism. It acts as an idler assembly that takes care of the load.

Figure 7F is a view from the same end as the C-C line, but looking towards the center of the circuit lighter. be. Cable (393) extends toward pulley (394) and cable (401) extends to the opposite side, and the cable (407) passes over the drum to the diagonal pulley (409) on one side. ), the drum of the drive part (391) is shown. Pulley (394,409) is In both cases, the pulley is attached to the bridge (39G), but in Fig. 7F, the pulley is attached to the bridge (39G). The relationship between the pulleys can be seen better because the ji is not shown.

The pulley and cable mechanism for movement in the X direction drives the drum of the drive unit (891). When turned in one direction and the other direction, the cross rail assembly will move along the X direction rail assembly. It moves left and right. The drum of the y drive unit (373) is moved in one direction and in the other direction. direction, the write carriage moves back and forth in the y direction along the crossrail assembly. Ku. Therefore, by selectively rotating the two sliding parts, the writing table (41 1) A complex pattern is written on the printed circuit board placed above and the chip can be written as

The height of any writing tip in the Type 2 embodiment is as described in the first embodiment above. It is controlled by a similar motor drive mechanism. The type 2 embodiment is the same as the first embodiment. It has the advantage of being lighter than the example, partially due to Schneber The gar rail element is lighter than the rail element used in the first embodiment. be. Moreover, the forces generated by tension and movement of the cable are The Sininenberger rail is designed to apply bending forces across the rail. , giving a very rigid structure and guaranteeing legal stability. X drive section arrangement and The number of pulleys used is reduced due to the winding method and the use of diagonally mounted pulleys. I don't need it. The use of obliquely mounted pulleys increases cable and pulley alignment and reduces drive friction. Power is used to process blanks by circuit writers to prepare them for making PCBs. There is a series of setup steps that must be followed. The first step is to write a blank This means placing the plate on a vacuum chuck and chucking it as described above. This can be done using tape to hold it in place. In either case, blank shall meet published standards for the species and shall be visually identified at specific locations. It will be installed in Circuit writers operate to very close tolerances, so you can easily Simply visually aligning and positioning the board by standing it up will not ensure that the trace is in the correct position on the board. Not enough to write accurately.

that the blank placed on the writing table cannot be perfectly horizontal; Also, to form traces with the required precision, traces must be drawn <> above the PCB surface. that the writing tip must be moved at a precisely controlled height of It was pointed out earlier in this specification. Therefore, part of the setup procedure is to of the surface of the mounted blank at a number of locations within the matrix covering the product. , to measure the height of the circuit lighter relative to the frame. This is a circuit writer This is done using a measuring probe mounted on the writing carriage. Elements of Figure 7A (630) shows the LVDT measurement probe attached to the write carriage. measurement After initially positioning the probe vertically and horizontally, the operator Writes and carries positions in the matrix via a computerized control system according to commands. the relative height at a point within each of a number of subregions (1 CI 11 squares each). over the entire area of the blank, riding the writing carriage and Follow the instructions of the measuring probe that touches the surface of the tank and read them into the computer. child The array of data continues to be used for process control and the blank where the trace is written. The height of the writing tip relative to the surface of the disk (in two directions) is controlled.

Alignment of the blank in the x+Y plane and in the rotational direction is determined by the writing carrier of the circuit writer. This is done by a video camera fixedly attached to the camera. To computerized control system For entry, the operator must match specific marks on the blank and write tables. The video camera projects a display for the worker that includes a crosshair that can do. Element (629) of Figure 7A is installed in writing carriage (337) Showing a video camera. Use the writing tip (also called a pen) and the camera crosshairs. The matching block is installed in the circuit lighter to match and zero. .

The control system “knows” the step position of each step motor in the x, y, and z drives. , so you typically use the cursor control keys on your computer keyboard. to move each of the pen and camera crosshairs to the “standard” position on the alignment block using the By taking the data (putting it into a computer database), you can A person can generate offset information for a computer.

In a preferred embodiment, the operator can Not close to each reference point from the same direction to reduce hysteresis issues Pay attention to the nearest step position reached by the write carriage. (1all (25μ) more).

The alignment block, also called a touchpad, is installed on the base plate of the circuit writer. 4A, shown as element (70) in FIG. 4A. Figure 41 shows the arrow (72) in Figure 4A. ) is a perspective view of the alignment block as seen in the direction of FIG. The matching block is attached to the moving element. Cut into a box and installed in the frame of the circuit lighter to provide an absolute positional reference I get kicked. Using this standard, the worker can, for example, move the pen to the surface (701, 703, 70 5) to create an absolute reference in two directions, and move to a parallel surface (707°709). Create an absolute reference in the X direction and move it to the parallel surface (711, 713) to Create an absolute standard of direction.

As part of the setup procedure, the operator also uses three The camera crosshair is also used to input the position of each of the reference points. In this case too, Take care to approach the reference point to the closest possible step from the same direction. child These points are fed into a data field and a computer program generates a scale factor. Calculate rotation, offset, and rotation corrections. After calculation, write table is rotated by the computer via the rotation mechanism shown in Figure ff52H earlier. The scale factor and rotation angle will be displayed. The correction angle is relatively If so, the operator can choose to repeat the alignment process. Integrity is representative Specifically, the rotation correction is repeated until it is less than 0.001@. Illumination during alignment process is provided by a ring light, the purpose of which is to not alter the operator's perception of the landmarks. The purpose is to provide uniform illumination. In the future, it will be possible to replace the operator and automate the alignment procedure. It is planned to use mechanical observation techniques to

process control Since there are many equivalent elements between the two embodiments, the circuits in the two embodiments are The control of elements for implementing writing is similar. Printed circuit board (PCB) setup Convert raw meter data to a board on which traces are written by a circuit writer. Figures 8A, 8B, and 8C are block diagrams showing the rough requirements for It is. Figure 8A shows three major processes. Block (549) The width and cross-sectional area required for the trace to carry the required load current with full margin. The computer-aided engineering (CAE) process of calculating the block (551) traces between various elements mounted on a PCB. A computer-aided engineering (CAD) process that performs tasks such as determining shows. Block (553) provides P to the x, y, z drives and various actuators. The data from the CAD process is sent to the circuit writer to write the trace on the CB. Show information.

Figure 8B shows the netlist to be used as input data for the CAD process. Schematic capture (555) resulting in (i.e. component table) and Enlarged diagram of the CAE process showing the process of netlist extraction (557) It is.

Figure 8C shows the physical location data (559) and the netlist being routinely generated. (561) (router), and the router sends the trace layer for the PCB. A CAD process showing the process of creating a database called root by performing This is an enlarged view. One connector pad where the device is attached to the circuit board number of trace connections allowed between traces on the board (no shorts or other minimum spacing (to avoid obstructions across the The router operates according to programmed principles such as the following.

Various computer programs for performing CAE and CAD are available to those skilled in the art. is well known in the art and is used to create the netlist and physical layout of the PCB. can do. Similarly, routers are also commercially available, which allow you to create routes directly. can be used. However, the characteristics associated with this extrusion method give traces. Certain general rules are incorporated into the command set.

FIG. 9 shows the cycle performed by the combi-coater control system (43) (FIG. 1). FIG. 2 is a block diagram of process control for a road lighter. The program element (501) is , load and manipulate the data, and use the loaded data by the actuating elements of the circuit writer. is the main program that calls subprograms to convert it into a usable format. . The element (50g) is read by the main program from a peripheral storage device such as a disk drive. is loaded and stored in the program element (507), binary buffer. This is a machine action sequence (MAS) file that is stored. Element (505) is It is also loaded from the peripheral storage and contains element (511), brimiciprist, and A pre-calculated mechanical motion list (MML) that is stored internally. Burimichi Priests are primarily created by routine generators and contain binary buffers. In order to have the circuit writer write a trace corresponding to the layout stored in the , driven to perform several primitive axidins that can be combined in sequence. A list of acceleration vectors in a form that can be recognized or ignored by a dynamic element (motor). sa The sine and cosine tables are also available from the peripheral storage. loaded and internal as represented by program elements (537, 539) Stored.

Element (509) stores the address of the current record in the binary buffer during operation. Scale everything and return this scaled result to a binary buffer, as desired. In this embodiment, it is a subprogram called 5CALE, C. element (51B) is called 5CALE, C and CREATE, C in this example. Another subprogram, element (515), This is a pre-programmed file with functions. CREATE, C is the main program The trace data is read from the binary buffer and the block is instructed by the program. Find out the correct set of motor brimitibs from limitipristo and find the desired In the embodiment, an element (517) called machine control list is created.

In the preferred embodiment, an element (5 19) is commanded by the main program to transform the machine control list into four separate Make a list.

These lists are: Element (521), X-LIST, Element (523), Y -LIST; element (525), Z-LIST, and element (527), It is displayed in the tutor list or ACT-LIST. Each of these lists The corresponding control elements are X drive, Y drive, 2 drive and valve actuator. A sequence of actions that a controller must take to write the desired trace. They are listed in the order in which they must be done and based on their respective time standards.

Element (529) is an interface called ISR, ASM in the preferred embodiment. -This is a subprogram called a loving service routine. This program The elements are fired on a repetitive time basis, in the preferred embodiment 0.5 milliseconds. Departure When activated, it compares the current time with the times listed in the various action lists. Time If the tick values are correct, it means acceleration, that is, the actuator for that control function. This is the time to update the data. IsI? stores the current position for each axis and In a preferred embodiment, every 0.5 milliseconds, the position is updated by the formula The degree is updated by the formula V-AT.

The interwoven service routine uses the interface (53 1), for the y-axis the interface (F+18), and for the z-axis to the interface (585) as well as to the valve or valve actuator to be controlled; send a signal. Elements (531, 533, 535) are digital-to-analog conversion models. Genil, which converts digital information into analog signals and generates the X motor (541) , y motor (54g) and 2 motor (545). 3 motor drive operation of at least one valve for starting and stopping the movement of the parts and the supply of FTP material; A trace is written on the PCB through the operation.

Circuit board requirements In the preferred embodiment, the circuit writer is equipped with a brand that meets prevailing standards. is supplied. Conductive pads to which component lead wires are connected by soldering etc. This is important so that the position can be fed as data to the combinatorial control system. It is. A programming procedure similar to that commonly used in the industry is used here. It is possible to “route” the conductive traces connecting between pads. can. This conductive trace is the circuit connection between the pads and therefore between the component leads. is a conductive trace that forms a between traces to give protection from the environment. Conductive traces that cross over and beyond the conductive traces written earlier to prevent short circuits. The density and complexity of circuits completed by circuit writers Non-conductive traces can also be written on top of the conductive tray to increase the number of traces. especially the pad The blank specifications related to the size and position of the a set of ``brimitibs'' (raw cotton), from which all the necessary movements are constructed. the minimum set of movements that can be determined by the geometrical constraints typically required for traces constructed by Ru. Primitives and router rules are software choices and can be tailored to different needs. Blanks of many different standards can also be used with the present invention, as they can be modified on the fly. may be adapted by program change without departing from the spirit and scope of the Wear. (See Appendix A for a list of software Primitives.) FIG. 1O shows typical and desirable pad dimensions for a representative circuit board according to a preferred embodiment. Show the law. The length Ll of a typical pad (811) is 60*1l (1.52mm) The s tolerance is about 5%, the width L2 is 40ml (1,02 dragon), and the tolerance is about 5%.

Pads are typically for inserting leads from components such as resistors. It has a through hole (613) with a diameter L7 of 31 sll (0.79 dragon) and a tolerance of about 10%. , where the lead wires are connected to the pads by soldering or other adhesive. pad material is copper plated with nickel and gold to improve trace-to-pad adhesion. It is desirable that Components designed to be surface mounted do not require holes. be.

Blanks used by circuit writers are typically one-sided, similar to traditional PCBs. Alternatively, a laminate with copper plates glued on both sides is the beginning. Required size where required leaving an isolated pad of ground and shape, and often as a ground or power plane. Corrosion away unnecessary copper leaves other areas of the copper surface separate from the pads that should be used. Eliminate food.

The area (815) at each of the four corners of the board is the "landing zone" In a desirable embodiment, the dimension L3 is 12g+II (0.30 dragon). , L4 is 14 vll (0,38 dragon). This is nominally the tray you connect. area of the pad that can be covered by such a ward in one corner One of the areas is shown in Figure 1O. The smaller area (lli17) is the “critical landing zone” (critical landing zone), this is where the trace is attached. This is the smallest allowable area that can be used. In the desired configuration, the dimensions of the critical landing zone are L5 = 9sll (0,23 dragons) and L6 = 8511 (0,20 dragons) m■). A total of up to 4 trays per pad on one side of the board. As a base terminal, the PTF trace can end at any of the four corners.

Plated through holes can have pads of the same size on the opposite side of the board, In addition, up to four traces can end there, and the possible traces on one pad Increase the total number of spaces to 8. The pads provide a suitable area for trace connections. Those skilled in the art will appreciate that other shapes of pads could be used as long as will understand. For example, a circular pad could be used and different A pad with as many corners as possible could be used. But in any case In addition to considering the number of traces that may be needed for a particular component, The “real estate” of the board available for tracing and the very precise alignment at the start and end points of the trace There is a compromise between the difficulty of hitting one corner and the other.

FIG. 11 shows four pads (627) on a representative plate (627) according to a preferred embodiment. 819, 621, 823, 825). Only a small area representing part of the board is shown. In the circuit writer's preferred programming, the center of the pad, The relationship between the lines is L8=L9-100a+i! (2,54+m) .

Figure 12A shows the desired connection traces on a portion of one side of the plate ([135)]. Three pads (629, 881, 8H) are shown with different dimensions and placement. trace (687) touches the negative corner of pad (629), trace (889) touches pad ( The trace (641) touches the -corner of the pad (633). do. Although the trace (843) passes through the area of three pads, the three shown touch any of the pads.

Trace (844) touches the negative corner of pad (633) and Cross the bottom. By covering the conductive traces with insulating material, the first Add another layer of traces that cross over the top layer to prevent shorts and other failures. Can also be done.

When writing multiple layers of traces to a board, multiple write buses are typically done. one One bus is a series of buses made of one PTF material without intersecting patterns. - This is the procedure for writing a text. After the first bus makes some connections between pads, A second bath covering all or a portion of the first bath is performed using a transparent PTP material, followed by a second bath. 3 baths can be carried out, and the first bath has overlapping layers of insulating PTP material. cross over the conductive traces of the first bus at locations protected by The conductive PTF trace can be easily traced. The number of layers that can be formed is Theoretically constrained by the usage of the viewing zone of L, and as a practical matter, Due to complex terrain, it may be necessary to control the position of the chip height. be restricted.

Figures 12B, 12c and 12D were created by a circuit writer. Figure 3 shows different views of a portion of a two-layer board using a cross pattern. Figure 12B shows the plate A portion of the surface on one side shows two rectangular pads (633, 635). /Kurado are separated from the power plane area (685) by etched grooves (634, 636). separated. A trace (837) is written between the pads. by circuit writer Three more traces (839, 841°648) written on the pad (633 , 835) but not touching any pads. Ru.

Figure 12D shows a portion of the opposite side of the PCB with two additional pads (845, 647). ), the trace (649) that contacts the pad (847), and the area between the pads , but does not touch either pad, and is above trace (649). A trace (11i51) that does not intersect either above or below is shown. ) 4 Tsudo (645°64 7) is precisely aligned with the pads (633, 635) on the opposite side of the PCB.

FIG. 12C is a sectional view of the PCB taken along line A-A in FIG. 12B. Figure 12B All elements of Figures 1 and 12D are shown.

As evident in Figure 12B, trace (637) crosses over trace (639). However, traces (641, 643) both cross over trace (837). do. This relationship is more clearly seen in the cross-sectional view of FIG. 12C. Additionally, trace is a composite trace formed from two materials. Trace (H7) is conductive formed from a trace of material (853) and a coated trace of insulation material (855) . Similarly, the trace (H9) is a conductive trace (857) and an insulating coated trace ( 859), and the trace (841) has a conductive trace (661) and an insulating coating. trace (6H) and trace (843) is disconnected from the conductive trace <865). Has edge-coated traces (6B?>) that create shorts between conductive traces. It is because of the insulation coating of the traces that cross-over is possible.

On the other side of the PCB, traces (851) are conductive traces (671) and insulating has a coated trace (875) and trace (649) has a conductive trace (ee9 ) and an insulating coated trace (671). This will clone these traces. This is true even if no overflow is indicated. Elsewhere on the PCB, these two It makes sense that there would be some crossover involving book tracing; Even without a crossover, insulation provides protection for conductive traces. and prevent short circuits between traces due to the intrusion of foreign objects or materials.

In Figure 12c, between pad (633) and pad (845) on both sides of the PCB, A hole (677) is shown through the PCB, and a hole <679) is shown through the pad (635). ) and pad (847). The hole (677) is lined with steel material (681). , the holes <679) are lined with steel material (688). Steel materials are used to make PCB blanks. During tracing, typically by electroless plating and with a circuit writer. applied during the preparation of the blank before. Electrical contact between pads on both sides of PCB It is the conductive lining of the pores that establishes the pores.

Also shown in FIG. 12C are surface power planes (685, 887), which are During link fabrication, the pads are typically bonded to a non-conductive plate at the same time as they are formed. This is a copper plate formed by corroding and removing the copper coating. Traditional Depending on the technique, typically a dry film solder mask ( 6119, 691) also exist.

Figures 12E, 12F and 12G are similar to Figures 12B, 12C and 12G. FIG. 3 shows a different view of a portion of a printed circuit board similar to the board shown in FIG. The main of the two boards The difference is that in the boards of Figures 12B, 12C, and 12D, which are known as two-layer boards, , all the elements are on one side of the plate or the other, whereas in Figures 12E, 12F and In the plates of Figures 1 and 12G, there are electrically conductive elements inside the plate. electric power flat The plane (695°B97) is a copper conductive trace formed on the surface of a much thinner plate. The thin plates are later laminated and the power plane is divided into two different types in the resulting plate. It will be buried at a certain height. Each table contains traces written by the circuit writer. The on-plane elements and internal power planes constitute the four layers of this four-layer PCB.

One conventional method of preparing circuit boards, especially prototype circuit boards, is to prepare conductive through-holes on the board. By connecting them with a thin '21 X-ray. Such boards are known in the industry as "wire This practice is called ``wound'' or ``wire wrap'' board, or PVB. , is a typical method in the prior art for making a prototype of a board. prepared by circuit writer The board is made of at least 6 layers and optionally 8 or 10 layers of wirewound. Circuit densities comparable to those of hard circuit boards can be achieved.

As previously mentioned, extruded polymer thick films for tracing are prepared by wet-processing This will require some changes to the router rules that would normally be used in manufacturing. desire In a new embodiment, the industry board has landing pads for connecting component leads. One new general rule is that extruded PTF does not typically have must end at one corner, and - there can only be one trace at a corner. Is Rukoto. Similarly, when a trace enters or exits a pad, it is connected to another pad. Make sure the trace extends the distance it will before bending to leave room for attachment. generally constrained to A typical distance is between the trace spacing and 1/2 the trace width. Use sum. Another general rule is to avoid series of turns that are too close together. this is Typically, once you have made a bend, the minimum trace will be before making the next bend. This is done by requesting that the distance be continued. representative of such requests A typical example is that the distance before making the second bend is 1/2 the sum of the trace width and the trace spacing. It would require that it be. Another general rule is that crossovers are allowed. Is Rukoto. However, for convenience of equipment currently in operation, only one Only crossovers are allowed. An additional general rule is that traces should intersect at right angles. That is. Both this latter general rule and all the above general rules mean that each line segment of the trace is It is based on the convenience of being in the direction of. The x and y directions of the line segments that make up the trace Many of these general rules can be relaxed or eliminated altogether if it is acceptable to lose some convenience. It is clear that it can be done. One supplementary general rule used today for convenience is 1 There is never another trace along the same direction above the book trace. That is, yes. However, as we will discuss later, the density is very important. At times, this general rule can be relaxed. Due to changes in the above router general rules In this way, the advantage of the x-y property of the stage assembly is skillfully utilized, and at the same time, it is possible to It is possible to simulate a ruchig in the form of an ear wrap.

As mentioned above, it is desirable to have one trace run along the top of the other trace. In some cases, it may be difficult. By relaxing router rules, this arrangement Conserve space on the board by allowing more traces to run between the pads. 12th Diagram H shows two pads, each pad touching one trace at one corner. Indicates the mode. A trace (715) extends from one pad and bends 90 layers to form a trace. (71B) extends from the other pad and curves in the same direction as trace (715); Overlaps the top surface of trace (715). Figure 121 is a sectional view taken along line A-A in Figure 12H. , shows these two traces. Trace (715) is insulated from conductive part (717) It has two parts: part (719). Number of A-A cross sections where two traces overlap In some places, trace (71B) rests directly on trace (715). to The race (71B) also has two parts: a conductive part (721) and an insulating part (72B). . Typically, each portion of each trace is written by a separate pass of the write carriage. It will be destroyed. The conductive traces of the two traces do not touch, so there is no electrical connection between the traces. Interference Hana (1゜Alternative polymer delivery/feeding device In addition to the standard valve systems mentioned above, there are also operational advantages over standard valve systems for polymer delivery and supply. Above, several preferred alternative embodiments and approaches with manufacturing advantages are used. (FIG. 13A is a preferred alternative embodiment, hereinafter referred to as Minlbu ng) is a side view of the writing carriage (800) of what is called an embodiment. , which uses several elements that differ from those of the embodiment shown in Figure 6A. 13th The viewing direction in Figure A is the same as in Figure 2E, with the cross rail adjacent to the writing carriage A cross section through the assembly is shown. The bearing block (363, 365) is spacer plate <36 1), and the assembly is installed in the same manner as in the previous embodiment shown in FIG. 6A. Runs on Kuker Rail (357). Two-way drive unit of mini-no-kung embodiment It is substantially the same as the other preferred embodiments previously described.

FIG. 13B is a view of the writing carriage of FIG. 13A, looking in the direction of arrow A-A. and driven by two two-way drives, namely electric motors (821>). , which is driven by an electric motor (853). Each of the two-way drives Carrying the Nibang Dogantai extrusion unit.

The minibang (801) is carried by an assembly driven by a motor (821). The minibang (827) is mounted on an assembly driven by a motor (853). Therefore, it is supported.

The mini bang (1101) has a thumb screw ( 805) and mini-bang screws (831). Each mi ”Bang is the quantity! store the polymer and quantify it via a writing tip to write circuit traces. . Typically, one minibang quantifies insulation and the other quantifies conductor 1@submerged. do.

Each of the two circuit writing assemblies on the writing carriage is pushed out by gas pressure. and a polymer tank that supplies polymer to each minibang. Polymer tank (8 07) replenishes the minivan (801) via the supply line (80B), and the gas It is sent to the tank (807) via the gas line (H9). Control line (112 a remote control valve (8) controlled by electrical signals from the control system (43) via the 11) opens and closes the gas supply to the tank (807). Polymer tank (839) Refill the minibang (827) via the supply line (829) and ensure that the gas pressure It is supplied to the tank (839) via the in (841). Control line (851) A remote control valve (843) controlled by electrical signals from the control system (43) via ) opens and closes the gas supply to the tank (839).

Each polymer tank can be quickly removed and replaced with another polymer tank. It is a modular unit that can be used. Piping is connected to the tank by quick-removal fittings. mounted, each tank in place on the shelf (817) in the preferred embodiment; It is held by a clamp (not shown). By being able to quickly replace the tank, New polymer sources can be inserted at the start of operation, as needed, or New sources can be added quickly when the previous source becomes empty. heavy Coalesced materials are typically stored in refrigerated hangars to slow down premature polymerization. A mini- A heater can be added to the vang.

Each minibang unit stores a polymer supply less than the capacity of the replaceable tank It has a storage capacity of The storage capacity of a minivan is the same as that of a typical vehicle in one bus. is calculated to have at least the amount required to write the base. The mini bang is Via a gas line built into each minivan and attached to each tank A unique valve and metering device driven by supplied gas pressure allows the write buffer to Each tank is refilled in between periods.

When polymer is delivered to the minibang storage volume, the gas supply valve is closed to the tank. and writing begins. Gas supplied from the same source as gas to each polymer tank. The polymer is forced out of the minibang by the gas pressure. to mini bang (827) Gas is supplied via line ([7) and actuated via control line (849). The gas is opened and closed and the pressure is controlled by the gas control unit (847) .

Gas to the minibang (801) is supplied via line (1119) and the control lamp The gas control unit (815) is operated via the inlet (823). is opened and closed, and the pressure is controlled. Each minibang has a polymer attached to it from the writing tip. It has a gas-operated piston to force the polymer flow metered from the mini-bang. , a piston by an LVDT device (not shown in FIGS. 13A or 13B). be remotely monitored by sensing their location and movement. Sensing for mini bang (801) The device is controlled via the control line (833) and is connected to the mini-bang <827>. The device is controlled via control line (835).

ff! Figure 14A is a cross-sectional view of the mini bang (801). Figure 14A is representative It is a mini bang (827). Three main parts, namely the main body part (855) , a quantitative portion (857), and a writing tip portion (859). Main body part The central passage (8B+) passing vertically through the metering section (857) and the writing tip section ( 859). The second passageway (865) through the body (855) is substantially straight. Connect to the passage (H+) at the corner. Passage (865) is threaded (867) and a portion (869) having a smaller diameter than the remaining passageway.

A movable shutoff piston <863) in passageway (865) is connected to the supply line (803). control the polymer influx. Polymer entering from line (803) follows passage (897) Go through and enter the passageway (865).

Although passageway (897) is shown offset by 90″ relative to body (855), This is merely a matter of convenience. The piston (863) has an O-ring (863) in the groove of the piston. 71) and the piston is sealed within the passageway (865) by a coil spring (873). The threaded portion of the passage (1165) ( An adjustable stop (875) on the stopper (867) controls the stroke of the shut-off piston (883). and adjust the pressure that spring (873) exerts on piston (868).

The insert (877) in the passageway (885) has a guide passageway (879) and a blocking pin The stone (IIH) has an extension (881) that fits into the guide channel. extension A passage (8H) is made in the part (8B+), and the passage (885) and the main body (855) provides a conduit for the polymer between the passageway (881) in the. Shown in Figure 14A When the piston (863) is in the retracted position, this passageway (885) is open and the material Pass through. Cause 14B shows the same cross-sectional view as FIG. 14A, but in this case the piston ( 883) is shown in the advanced position, closing the polymer passageway. Extension ( 885) is a replaceable tube for adjusting the diameter and length of the polymer passageway.

The metering portion (857) of the minibang has a diameter substantially equal to the diameter of the passageway (861). having a central cylindrical volume (887) of diameter and a close-fitting metering piston (889). ). The metering piston is made from a magnetically permeable material and in the preferred embodiment , magnetic stainless steel. The metering piston (889) has the inner diameter of the volume part (887) It is free to slide vertically inside.

An LVDT device (891) surrounds the passageway ([7) and the timing piston (889). , the piston (1189) via an electrical lead (833) to the control system (43). position and speed are monitored.

The writing tip portion <859) is located at the end of the passageway (1181) opposite to the metering portion. It is attached to the main body (1155) at (+193). The passage (89B) ends at the write chip (895), During the circuit writing process, the chip writes traces on the PCB.

The operation of the refilling and extrusion device of the minibang embodiment is shown in FIGS. 18B, 14A, and This is best explained with reference to FIG. 14B. The circuit drawing work is completed and the volume part (88 7) When the supply of polymer in the tank (807) is almost consumed, will be refilled. A gas control unit (815) is operated by the control system to control the gas. ・The pressure in the line (819) is released, the valve (811) is opened, and the pressure-regulated outside is released. Gas pressure is applied to the tank (807) from a source. Supply pressure is typically around 50p si (3,52 kg/cd). The gas pressure above the polymer feed is (863) leads to the surface (899) (Fig. 14B), and extends to the area of the surface (899). The difference between the atmospheric pressure and the gas pressure on the opposite side of the piston is determined by the closure shown in Figure 14B. Move the piston (H3) within the passageway (885) from the position to the open position shown in Figure 14A. Gives enough force to scrape.

When passageway (883) is exposed to passageway (885), polymer from tank ([07) flows through extension tube (885) and into passageway (861). Gas in pipe (819) Since the pressure is released, the piston is forced upward and the volume (887) is filled with polymer. filled with. The position of the piston (889) is monitored by an LVDT device and (887), passageway (Hl), and passageway (H3) are filled with polymer and Filling ends at the specified position. The polymeric material allows the filling pressure to flow from the writing tip. It has thermophilic properties such that it does not generate enough internal pressure to initiate the process. , there is no flow from the writing tip during filling. When the valve (all) is closed, the line (809) is vented to remove gas pressure from the tank and the face of the piston (88B) ( 1199), the spring (87B>) moves the piston (863) to the 14B to the closed position shown in Figure 14B.

For writing traces with the writing chip (H5), other preferred embodiments are described. Activate the x, y and 2 drives according to the above description to control the flow of polymer. is necessary. The polymer flow is routed to the control system via the gas control unit (815). The unit controls both the flow and pressure of gas into line (819). control In a preferred embodiment, the control unit (815) is a Norgren Lee Dex (Norgren Reedex) Model number NC-V321P3-2 Incorporates an 8NN pressure control valve and pressure sensing transducer. Piston (8 The upper gas pressure of 89) moves the piston downwards against the polymer in the volume 887. is energized to extrude the polymer from the writing tip. Piston (889) position and speed are monitored and sensed by the control system along with the gas pressure in line (119). Depending on the parameters set, the preprogrammed polymer flow rate is controlled by the control unit ( 815). Minibang storage volume refilled When the position of the piston (Ii89) again indicates that it requires will be performed again.

Second circuit writing assembly on writing carriage using mini bang (827) The body is operated in substantially the same manner as described above for the first minivan assembly. Ru. Typically, one assembly is for extruding a conductive polymer and the other The assembly is for extruding insulation.

7 milling of the circuit board, cutting and alternative configuration circuit writing, moving the assembly in three dimensions , a circuit that follows a programmed and calculated course to create precise and complex patterns. The ability of the writer is to develop prototypes of printed circuit boards, which I did not mention in detail earlier. Gives more power to fabrication and repair. Figure 15 is shown in Figure 13A. 15 is a side view of a carriage similar to the carriage, but the carriage of FIG. 15 is an extrusion assembly; FIG. to support and operate the cutting head instead of.

In Figure 15, the tightening screw (805) is attached to the two drive slides in the saddle (911). A cutting head (901) is held. If the cutting head is installed, polymerization body tank or gas control elements to operate the tank or minivan are not required; Elements such as are not shown in the tJ15 diagram. Cutting that should be used in applications that require cutting. The cutting head (901) has a variable speed electric motor (90B) and a tool chuck (905). and cutting tools (907) are important elements. The electric motor is connected via lead wire (909). and is controlled by a control system (43).

In the preferred embodiment, the tool chuck (905) holds a small diameter milling chuck. The tightening of cutters and drills is a device, and the tool change is a PCB blank for processing. move the cutting head away from the area where the Do it with In an alternative embodiment, the control system is stored in a shelf in the exchange area where the various tools are stored. The chuck is electrically actuated by a control system.

In an alternative embodiment, the change of available cutting tools is programmed and occurs automatically. be exposed.

The cutting tool in the preferred embodiment is designed to perform a specific type of work on the PCB. This is one of the various cutters and drills that have been measured. For example, about 0.028In in diameter (,71mm) drill is attached to the tool chuck, and the diameter is approximately 0.028in ( , 71 m) of holes in a printed circuit board blank. Can be done. Such a pattern of holes may e.g. lead wires from separate components. Useful for prototype development work. Install a milling cutting tool instead , milling specific areas of the coating on PCBC lab blanks under program control. Remove and isolate areas of conductive copper coating from any conductive sockets used in the circuit being written. It can be left as a The cured polymer material on the blank is also cut, Useful configurations can be formed. Circuit writer with cutting tool mounted on carriage - The usefulness that the equipment can perform regarding PCB prototype development, manufacturing and repair. The work involved is very diverse.

A common requirement in the fabrication of many prototype PCBs is to make conductive pads and connect the pads to conductive pads. Connect with conductive traces. Pads are added to the board to complete the circuit Attachment of leads from separate components is a point. and conductive between pads A conductive trace becomes a conductive circuit between separate components. Like pads and traces Coated or uncoated PCB blanks and circuit writers in the production of unique PCB structures. - Utilize many alternative methods using a combination of machine cutting and circuit writing techniques You can. Some application examples are described in the following sections and are kept for future reference. are numbered. In the examples, traces and other dimensions are for similar structures. The dimensions are similar to those mentioned. Such dimensions vary with design conventions.

1. Figure 16A is an elevation of a coated blank used as a starting point for prototype development work. FIG. The blank is non-conductive with a copper layer (915) coated on both sides. It is a reinforced epoxy material (91B) with an insulating layer (917) of polymer +4 overlaid on a copper layer. It will be done. Although not a requirement, such cladding plates may be , the gold can be flashed before depositing the ball coalescing material. at the first stage , using a circuit writer in cutting mode, cut the non-conductive blank through the two outer material layers. Cut up to 7 rice to create a pad. The M+eB diagram shows the two outer layers on one side. Reduction of the groove (919) cut through to create a substantially rectangular pad (921) FIG. The actual rectangle is arbitrary. Flat pads of any shape required The chair can be cut. Additionally, the component mounting techniques used may require holes. If so, drill holes through the plate connection pads on both sides of the plate during cutting. You can also No holes are shown in Figures 16A to 16D.

Figure 18C shows the section passing through the pad (921) and groove (919) on one side of the blank. FIG. In Figure 16C, the insulating overlayer is still on the pad just created. present, which would impede attachment of individual components.

Figure 18D is a cross-sectional view of Figure 18C after an additional step. cutting mode Using a circuit writer, the insulating overlay on the pads is cut away and the individual components are removed. Leave the copper layer exposed for attaching bare leads. The groove (919) is Insulating polymer (923) from the newly formed pad to another point on the PCB. A conductive trace (925) is drawn. The conductive trace (925) is Below the copper in the non-pad area of the PCII is a trench insulation (923) and an insulating overlay. (917), and the top surface is insulated by insulating extrusion material (92G). are connected. Multiple installations create pads on the board and also conductive traces. Use this procedure to connect to pads on the circuit pattern by Can be done. The remainder of the coated surface not used for pads shall be used as a ground or power plane. Those skilled in the art will recognize that it can be used.

2. Figures 17A, 17B, 17c and 1iiN 17D are bare coatings. Illustrate the application starting from the board. The starting plate, shown in partial cross-section in Figure 17A, is made of copper. A non-conductive reinforcement (927) with a coating (929). In the first stage, the Similar to step #1, grooves were cut by milling through the coating layer to isolate the Form a copper pad. Although not shown, connect the pads on both sides if necessary. Can make holes. Insulating material (931 ) is written to form an insulating subgrade, and then a conductive material is written on top of this insulating material to form a conductive base. Gives a conductive trace. Insulating subgrade conductive traces from copper clad areas between pads Insulate. If further protection of the conductive traces (93B) is desired. If so, we can write an insulating overlapping trace (935) of the conductive trace, and then You can intersect traces and write circuits with two or more layers.

FIG. 17C is a cross-sectional view of conductive traces on an insulating subgrade. Figure 17D shows FIG. 17C is a cross-sectional view of FIG. 17C with the addition of insulating overlapping traces. Adding overlapping traces will completely enclose the conductive traces between the pads. Insulating subgrade, conductive The relative shapes of the races and insulating overlapping traces are suitable for both conductive and non-conductive Control the rheological properties of the coalesced material, write tip, two heights and each material controlled by selecting the pressure used to extrude.

3. Pads formed by cutting grooves in the copper clad plate as in step #2 above. Another alternative example of a trace between the Illustrated in fig. Figure 1gA shows the grooves through the copper coating <949> of the coating plate blank. (941,943) formed by milling two substantially FIG. 7 is a plan view showing a rectangular pad (987, 939). Thread the groove (9) through the copper cladding. 41,943) is milled. Another groove (945) is milled.

The cut grooves (945) serve the purpose of the insulating subgrade in step #2 above. Groove (94 5), with a width considerably narrower than the width of the groove (945), the pad (937, 9 39) A conductive trace (947) is written in between, so this conductive trace Do not touch the copper coating on both sides. Figure 18B is the 18B-18B section of Figure 11iA. FIG. 3 is a top view showing conductive traces in the grooves between pads. As shown in Figure J8C Additionally, an additional insulating overlayer (94 g) can be applied to the conductive traces.

4. Figures 19A, 19B, and 19c show polymer coatings on nonconductive, uncoated plates. How to use circuit writer equipment in various aspects to produce pads Indicates the order.

FIG. 19A is a plan view showing five traces written side by side. trace (951,955,959) is an insulating polymer, trace (953,957 ) is a conductive polymer. Figure 19B is the 19B-19B cross section of Figure 19A. The three insulating traces in the side-by-side array are further away from the board surface than the conductive traces. The height is high. Trace (9B+, 9H) (ji insulation) race, 5 pieces is written at an angle of approximately 90' on top of the side-by-side traces. Traces and pads form After being applied, the board is cured and coated with industry standard adhesives such as conductive adhesive or solder. The components are attached using equipment. 19th cv! Jha 19th A5V no. 19C-19C cross-sectional view, one for two cross-direction dielectric traces Shows the relationship of conductive traces. The placement of insulating traces relative to conductive traces is Two pockets are formed in which the component leads (985, 987) are conductive. Align with the sex pad and ride on it. Use of two conductive trace pads is optional It is. As many trace pads as desired can be written side-by-side or in any other relationship. can. After forming the polymer pads, a conductive polymer is used to form one pad. A trace to another pad can be written as above.

5. Many PCBs have internal conductive planes, often used as ground planes. Manufactured. In the process of prototype development of this kind of PCB, a special problem is Connect the pads on one side of the cover plate to the pads on the opposite side, avoiding short circuits to the electrical plane. It is the ability to Progress from one side of such a plate to the internal plane and through each Roads are sometimes called vias.

@2 [E has copper coating 51 (971) on one side, copper coating (971) on the other side, and a cross-sectional view of the plate (969) with an internal conductive plane (975). Said procedure Two pads (979, 981) are created by cutting the grooves as described in . next A hole (98g) is drilled in the step to form a pad (979, 91+1>) and an internal plane ( 975). After drilling, the polymer is extruded using a circuit lighter. Fill the hole with insulation. The process of charging the hole is to insert the writing chip of the circuit writer into the hole position. Push the material into the hole or insert the chip into the hole until it is almost touching the plate. Either insert the tip into the hole, start extrusion, and then pull up the tip. Therefore, it can be implemented.

Insulation is cured, although typically the board must be removed from the circuit lighter. be done. After curing, the plate is reinstalled and the diameter of the hole (9H) is smaller than that of the hole (9H). A hole (989) is drilled approximately on the center line of hole (98B). -For example, The diameter of the hole (9H) is typically 0.020in (0.5 fin); 9) has a diameter of 0.010 in (0.25 m). Using the circuit writer again , now extrude the conductive polymer into the hole (989) and over the insulating polymer at both ends. Cover it and bring it into contact with the two pads (979, 981>. As a result, an insulating circle The ring (985) effectively removes the conductive polymer core (987) from the internal plane (987). At the same time as insulating, connect the internal conductive core material to the two pads on the image side of the board. It turns out.

6. Figures 21A and 21B show pads on both sides of the plate that form internal conductive planes. The second procedure for connecting is illustrated. Plate (991) is external covering (99L995) and an internal conductive plane (997). Pad (999,1001) is as above It is produced by milling a groove into the groove.

A wide hole (1009) is cut through the plate between the two pads. The hole is slanted , the length of one side is S, and the length of the other side is S. The longer dimension is on the side where the cutting will take place. . Dimensions can vary considerably due to different board designs and design conventions. representative The length is 3 mm, and the typical length S is 1n.

A first bed (1003) of insulating polymer is extruded using a circuit lighter. floor( 1003) is stretched over the entire width of the hole. The typical size is approximately 1 inch. Ru. The conductive polymer trace (1005) is then narrower than the width of the floor (1 (103)). It is extruded onto the floor (1003) to a wide width. Trace (1005) shows both patches. Contact (999,1001). Next, the hole is filled with insulating polymer (1007). completely enveloping the conductive trace and eliminating the possibility of contacting the internal plane (997). Lose it. The final step in the procedure is to remove the plate and cure the polymer extrusion. . The advantage of this procedure is that it creates holes between the pads. Intermediate cures like the Aia procedure No work is required.

7. The ability provided by the various operating modes of the circuit writer to configure the PCB create and offer other possibilities. Extruded and cured, both conductive and insulating The removed polymeric material can, for example, be milled. Figures 22A and 22B The figure shows how the lead wires for the individual components differ from the polymer pads described above. 1 illustrates a procedure for producing an extruded polymer pad having seams of .

No. 22A IID is a polymeric pattern with matching portions for individual device leads. FIG.

FIG. 22B is an elevational view taken in the direction of the arrow A--A in FIG. 22A. 2 pieces Insulating traces (1011, 1013) are extruded side by side and cured. tree After curing, use a circuit writer to connect the three grooves (1015, 1017, 1019). Cut. Then, it intersects the path of the original two insulating traces and into the cut groove. Conductive polymer trays X (1021, 1023, 1025) are extruded. conductive The conductive traces are extruded to a lower height from the board surface than the insulating traces. Ru. After the conductive traces are cured, they are used for attachment of individual device leads. acts as a pad, and the height difference between the conductive and insulating traces Provides a matching section for the leads of the device being connected. 2 insulating traces and 3 The conductive traces in the book are arbitrary. As an alternative, first the conductive tray Of course, it is also possible to provide a This is Cause 23A or Figure 23C Illustrated in. Conductive traces (1031,]033.1035) first Push up. Next, as shown in Figures 23 and 23C, one layer of insulating traces is added. (1037) is extruded onto the conductive trace. This is typically two of the insulating traces. Do it on the bus more than once. The board is then cured and milled to create an accurately flat surface. Leave the conductive traces (1031, 1038, 1085) with the top surface and the second B As shown in Figure D, the sidewalls of the insulating layer (1037) are coated with the first and second materials, i.e. In other words, the materials used to form the conductive and insulating traces are It is formulated to have certain desirable properties for successful use.

In particular, the hydrodynamic properties of the first and second materials may vary depending on the specific equipment implementation, e.g. , tubing, and equipment for delivering the polymer solution. these are Imposing constraints on the hydrodynamic properties of the first and second materials. Preferably, the first and second The material has the following hydrodynamic properties: (1) Increase or decrease stress, such as would occur during adhesion or extrusion procedures. It exhibits little or no associated thixotropic hysteresis.

(11) It is pseudoplastic.

(jii) Immediately after extrusion, an increase in viscosity occurs, causing damage to existing traces during the circuit writing process. Whenever you place a crossover trace on top, only slight physical deformations occur. There is no need for curing between layers of different traces.

Regarding mechanical properties, the material must flow well from the scraping tip. However, once applied to the surface of the PCB, it should not flow, but rather be relatively narrow. Large trace width and appropriate thickness to provide either good conductive or insulating ability. It must have sufficient mechanical stability to maintain stability. practical problems and In the preferred embodiment, these mechanical properties are determined by a static shear rate of 20/sec. The practical viscosity range of the first (conductive) material is 15,000 to 30,000 cp. At low shear rates of less than about 0.01/sec, the practical viscosity range is It should be 1 million to 5 million Cp, which is extremely hard. However, as a general rule Therefore, a slightly narrower range of 20.000 to 27.000 has a relatively high shear rate. The most desirable range is 22.000 to 25.000 cp. Ru. For the second (insulating) material, the practical range of viscosity at high shear rates of 20/s is approximately It appears to be between 15,000 and 30,000 cp, with a more desirable range being about 20,000 cp. 000 to 22,000 cp. At low shear rates of less than about 0.01/sec, The range also appears to be around 1 million to 5 million Cp, with the desired operating point being Like the conductive material, it is 2.5 million cp. However, in the formulation consisting of When using the desired materials and equipment, write It is sometimes useful to control the temperature of the chip. For example, in Example 2 described below, 40 A write tip temperature of ±1°C is desired. In that formulation, viscosity is a function of temperature. This is the function. Therefore, in order to properly control the shape and repeatability of the trace, It is useful to have good control of temperature during road marking. Relax some temperature constraints Relatively high temperatures, such as 60° C., could be used.

However, as the temperature increases, the operating temperature approaches the polymerization temperature. In example 1 described later Typically, temperature control is not used.

According to the invention, the hydrodynamic properties of the first and second materials are controlled in several ways. This can be accomplished by adding a suitable component as a component of the first or second material. Molecular weight of resin, i.e. selection of polymer, type of solvent and selection of melon, reactions contributing to polymerization This includes selection of functional functionality, selection of catalyst, etc. Hands for making such choices References can be found in many standard reference texts in polymer science. For example, ma "Physical Properties of Polymers" by Mark et al. ies of Polysers) J (American Chemical Society, Washington DC, USA) Aserlcan Chemical 5ociety, 19B4) ; Miller's "Solid state technology" Technology>J (October 1974); Kaurman Ian) ed. “Introduction to Polymer Science and Technology” mer 5science and Technology) J (US New City of York, John WHcy & 5ons, 1977): Test (Tc ss) and others “Applied Polymer Science (AI) I) Iied Polyscr 5c1c ncc) J (American Chemical 5oc iety) Washington DC.

1985):

, Post-extrusion curing, or viscosity increase, varies depending on the chosen polymer system. This method is used. For example, partial curing by light energy or heating, such as drying. In the preferred group of first and second materials, prior to curing, drying, In other words, curing is brought about by solvent evaporation. Such pre-cure drying A polymer precursor material, a catalyst, a solvent mixture in which at least one component is a high vaporization rate solvent, This is successfully done by mixing conductive particles etc. Has a moderate vaporization rate Solvents include acetone, tetrahydrofuran, ethyl acetate, and methyl ethyl ether. Includes Luketone. Although not a requirement, the trace you just applied It is desirable to speed up drying by passing a stream of heated air over the.

In addition, it is desirable that the first and second materials: (i) be less than 150°C; Most desirable, low temperature curing is possible; (2) Low amount of ion contamination; (3) In the case of the first material, the conductivity is high after Guinea. with trace Low temperature curing is desirable so that the substrate to which it is deposited does not decompose during the curing process. The board is Typically includes standard shroud material. For example, epoxy/glass fiber, epoxy/glass Rusty fiber/paper, phenolic plastic/paper, polyimide/glass fiber, Teff iron/glass fiber, etc.

Ions may lead to unpredictable polymerization in the desired polymer system described below. Contamination is undesirable. Such contamination-induced polymerization may occur in the first and 152 materials. It can significantly reduce the shelf life of the material, make its rheological properties unpredictable, and may be involved in premature failure of electrical circuits.

Cure transforms the first material into a thick film of electrically conductive polymer. first material Conductivity can be obtained by including conductive particles as a negative component in the material. desirable. Upon curing, the polymer brings the conductive particles into contact with each other, thereby The entire composite, a thick film of polymer, is made electrically conductive. However, in some cases In this case, mixing alone is sufficient and a moderate level of conductivity is exhibited even before curing. Like that Formulation of conductive polymers is well known in the polymer thick film industry. Generally, polymerization The superior electrical conductivity of thick-walled films requires a compromise with superior mechanical strength. conductive The increased conductivity is due to the relatively high weight ratio of conductive particles in the polymer thick film. achieved. Similarly, higher mechanical strength can be obtained from polymers in polymer thick-walled films. This is achieved by increasing the ratio of That is, higher conductivity is typically is achieved by a moderate reduction in mechanical strength. Important features of the invention are: Conductive traces can be integrated into commonly used polymer thick-walled fibres, without loss of mechanical strength. It has a higher conductivity than that obtained with lume. High proportion in the first material Higher conductivity can be obtained by including conductive particles in 5. The associated loss of mechanical strength of the overall structure, i.e. the conductive traces, is due to (1) a high degree of (2) has mechanical strength and adhesion to the substrate; (2) wraps the conductive traces and This is avoided by using an insulating polymer that forms the outer shell. Sunawa In other words, according to the present invention, when wrapped in an insulating polymer, the conductive polymer has minimal mechanical properties. Since only mechanical strength is required, it is possible to achieve a lower conductivity. Guidance This is because the conductive material is applied in traces that are narrower than the screen layer. It is possible to wrap something like this. Desirably, the first material contains sufficient conductive material. Therefore, the resistivity of a 12 wN (0,305 m) wide trace is at most 0.6 Ω. /in (0,24Ω/c211). Appropriate electrical conductivity for the first material The particles include, but are not limited to, silver, silver-coated nickel, gold, silver-coated gold, copper, gold. Contains coated nickel, etc. Such particles may be of any size suitable for use with the present invention. It is commercially available in several forms, such as flakes and powders.

The second material is deposited onto the conductive trace in several ways, such as spraying, extrusion, etc. It is performed. Preferably, the second material is a tracerouting engine programmer. Under gram control, the newly applied conductive toner is removed by a second extrusion device. Extruded onto the lace. More preferably, the second material is electrically conductive after the drying step. Extruded onto the trace.

Desirably, the polymeric in-thickness film formed by the second material has a low dielectric constant. have The choice of dielectric constant is highly dependent on the choice of polymer system used. for example "Electrical Properties of Polymers: Chemical Principles" by Kis-(Ku) et al. cal Properties or Polymers: C chemical principles) J (Hawser, Munich, See 198B). Generally, polymers with fewer axial bonds in the rings have lower dielectric constants.

Whenever the first and second materials are brought into contact, a component of the first material is added to the second material. reacts with the components of the material to form a layer of hydrophobic polymer at the point or surface where the two materials come into contact. I believe that it will happen. This hydrophobic polymer layer is referred to herein as an interfacial layer. interface Layer formation should proceed rapidly at room temperature. The shape of such a rapid interfacial layer It is believed that formation occurs in the following desirable polymer systems.

Epoxy Diamine Dicyanate Epoxy Diamine Epoxy Epoxy Diamine Isocyanate Isocyanate Diol Epoxyamine Epoxy Diol Polyamide Dopolyamide　　　　　　　　　　Dicyanate polyamide Epoxy diol The specific composition, catalyst, and General guidance on the selection of media, solvents, resins, hardeners, etc. can be found in the literature. Can be done.

Most desirably, the first material comprises an epoxy/diamine polymer system and the second material is allyl dicyanate polymer system or allyl dicyanate/epoxy polymer system including. Exemplary compositions of such first and second materials are listed in the table below. From the body to ^molecules 4~lO bripolymer) Diamine/polyamine curing agent 0.25-3.5 low vaporization approach 1-4 Highly volatile approach solvent 2 ~IO conductive fine particles 75-90 Epoxy used The selection of resin is primarily based on the desired glass transition temperature of the conductor after curing. most purchased Easy epoxies can be used. The preferred epoxy resin is bisphenol A <4.4'-isopropylidenediphenol) and shrimp chlorohydrin It is a condensation-based (B-stage) bripolymer or monomer. Other suitable epo Epoxy resins include epoxy novolak, polyfunctional amine group epoxy resin, and polyfunctional epoxy resin. There is poxy resin. The manufacturer of such resins is Shell Chemical. Chemical, al), Dow Chemical (Dov Che*teal) and Ciba - Contains Geigy (C1ba-Geigy).

Preferably, the amines in the diamine/polyamine curing agent reduce latent curing properties. It will be done. Anhydrides, polyamides and reactive imide-containing compounds are also used as curing agents. be able to. When using anhydride, boron is added to activate the anhydride at high temperature. ・Suitable catalysts such as trifluoride ethyl amine complexes must also be used. No. Most preferably, the aromatic amine provides high temperature resistance and is capable of latent curing. It is used because it is These compounds are diamines and triamines. including enes and other mono- and polymeric aromatics.

Preferred highly volatile aprotic solvents include 2-butanone, 4-methyl-2-pene Thanone, tetrahydrofuran, dioxane, ethyl acetate and ethoxyte Contains trihydrofuran. More preferably, 2-butanone is the preferred primary Used as a highly volatile solvent in materials. The highly volatile solvent in the first material is It is called a highly volatile solvent. The first highly volatile solvent is used in the second material described below. It can be the same as or different from the second highly volatile solvent used. desirable Low-volatility arotic solvents include 2-butoxyethyl acetate, 2-methoxy Ethyl chytyl (diglyme), ethoxyethyl acetate, propylene Glycol methyl ether acetate and 1-methyl-2-pyrrolidino Includes More preferably, propylene glycol methyl ether Low vaporization in the first material, preferably acetate or 1-methyl-2-pyrrolidinone Used as a solvent.

second material H (allyl dicyanate) composition minutes 　 　 　 　 　 　 　 　 　 　 　 　 (Special exceptions) Allyl dicyanate 50-7゜dense Shrinking agent 1-81 App approach solvent (highly volatile) ~]0 approachable solvent (lowly volatile) ) 20~3゜Hydroxyl accelerator 1~ 6 metal catalyst 25~5DOppta preferably , allyl dicyanate is bisphenol A, bisphenol F, or bisthio It is a disy[anate ester of phenol. These materials are commercially available , for example, AroCy-B% AroCy-M, AroCy-T, and the manufacturer is Teck Polymer (formerly Tck Po1y CR) (George, Kentucky, USA) This is the city of Hwaseong Town. Ki below about 150℃ Whenever a hard temperature is required, AroCy B is most preferred and is approximately 15 Whenever a curing temperature in the range of 0 to 250”C is required, AroCy M is preferable.

A thickening agent is used so that the second material is pseudoplastic. For example, N-dispersed silica Many basic or modified inorganic materials such as alumina, titanium dioxide, glass particles, etc. Microparticles can be used.

Hydroxyl accelerators include nonylphenol, 4-hexylphenol, 4-ethylphenol, Thylphenol, 4-tert-butylphenol, 4-tert-butylphenol, 2.6-di-tert-butyl-4-methylphenol, 2-methylimidoazole, 2.4.6- Alkylphenol or high boiling point, such as trimethylphenol It can be alcohol. The most desirable hydroxyl accelerator is nonylph. It is phenol.

Combining various metal compounds with soluble coordinating metal carboxylates or xylates can be used. Preferred metals include zinc, copper, nickel, iron, and platinum. , cobalt, manganese, etc. More preferably, the zinc is acetylacetate. Used in combination with nate chelating agents. Uncontrolled reaction at sites of high catalyst concentration Hydroxyl promoters should be added before combining with allyl dicyanate to avoid reactions. The metal catalyst must be dissolved in the The concentration of metal catalyst is allyl disia It is expressed in ppm relative to the concentration of analyte alone. Preferably, a low-volatility solvent is equal to that shown in the first material table above. However, the most desirable highly volatile solvent is ethoxytetrahydrofuran, and the most desirable low-volatility solvent is JiGly It is mu. The highly volatile solvent used for the second material is referred to as the second highly volatile solvent. .

second material (Special exceptions) Epoxy 5-40 allyl dicyanate 40-7070 Titsuku solvents (high -aircraft) 1 ~ Lo Arotic solvent (low vaporization) 15-30 hydroxyl accelerator t-e metal catalyst 25-500 ppm desirable Allyl dicyanate, epoxy, thickener, solvent, hydroxyl promoter and a metal catalyst such as that described above for the second material of allyl dicyanate ( (w/w %) 10.4% polymeric epoxy mixture (average molecular j110.0 It is a solution of methyl ethyl ketone containing 40% of 00 epoxide in l1ffi ratio. Dow Chemical 684EK40), 2.97% 3,5-diethyl-2,4- Diaminotoluene (Ethaeure 100 from Ethyl Cope), 5.8 % 1-methyl-2-pyrrolidinone, 1.22% cyclohexanone, 1.31 % of tetrahydrofuran, and 78.4% of silver fine particles (handy and paper). silver flakes and 5il, such as 5ilflakc 2g2, which can be purchased from Ratio of 4:1J with silver powder such as POVDCR (Handy & Perman Co., Ltd. "1ake 2g2 and 15.839 powder) (All percentages are weight A first material was prepared comprising: (weight jl/!l amount%) 65.15% AroCy-B-30 (High Tech Polymer Co.), 8.0 2% silica particles (Aer from Degussa Corp.) osil 972), 26.88% diglyme, and 300 pI)s (Ar oCy-B-80) containing zinc acetylacetonate 1.95% A second material was prepared consisting of nonylphenol. Using the device of the invention , test traces were written on a blank PR-4 circuit board board. circuit completed Afterwards, the plate was placed in a furnace at 125°C for 1 hour to remove volatile solvents, and then The temperature was increased to 150° C. for 2-4 hours to complete the cure. 4 all(0, IOs+m+), width 12all (0,30m+m)) lace IIn(2 The post-cure trace showed a resistivity of 0.5 Ω per . insulation coating The membrane had a breakdown voltage of over 100OV.

Similar experiments using Kapton polyimide plate substrates showed higher 0.1Ω/1n (0,004Ω/ am) was able to be achieved.

Example 2 With the following prescription! 151 materials were prepared. Silver flakes (handy and ・Perman 5llflake 282 with 96 parts), silver cluster (handicap) 5llpovder (22g, 24 parts) and line ball ( 5 parts), acetone (15 parts) and N-methylpyrrolidone (1 part). 0 parts) and dimethyl ether of diethylene glycol (diglyme, 3 parts) ) were added. The finished paste was passed through a 150 mesh screen. . Part of the base (including 65 parts of silver) is made of epoxy resin (Ciba Geigy Co., Ltd. Araldite GZ 4g8 N-40,6 baht) and curing agent (m-7E Nylene diamine (1.8 parts) was mixed and stirred to obtain a homogeneous mixture. child Acetone (10 ml) was added to the mixture and stirred to obtain a homogeneous mixture.

Next, this mixture was placed under reduced pressure (vacuum degree of 291n) Ig (737+u Hg) for 3 Expose for 0 minutes, N! ! ! I got a sex paste. This is 5~9011 (0,13~ Pressure (5-100 psi, 0.35-7 ．． 03 kg/cJ) and adhered to the board. A stream of hot air is applied to this extrusion. Let it dry for 5 minutes to form a solid line, and then add a layer of insulating PTF on top of that. It was possible to cover it without compromising its performance. This conductive layer is then placed in a heating furnace along with an insulating layer. can be cured to form an insulated conductive conductor with low resistivity. Ta. It was possible to cure each layer separately, but this one-step curing process took a considerable amount of time. This saves time and makes it easier to cure when between a conductive layer and a matching insulating layer. Those skilled in the art will appreciate that realignment problems in the case of

The second material (insulating PTF) was prepared with the following formulation. Epoxy resin (Arald ite GZ 4g8 N-40, 20 parts), dioxane (5 parts) and Bisphenol A dicyanate (Intcrez RDX 80352.1B pa ) was added. Erogenic silica (Cabot) is added to the resulting solution. Cabot Corp's 511 anox 101, 1.6 parts) Dispersed. Acetone (15 ml) was mixed with this dispersion, and the mixture was heated under reduced pressure (29 inHg). , 737 mm Hg vacuum) to evaluate the rheological properties and An insulating paste was obtained with similar properties to drying and drying properties.

Many changes may be made to the circuit writer without departing from the spirit and scope of the invention. It is clear to those skilled in the art that this can be done. Using materials instead of the specified materials You can change dimensions, reposition elements, etc. It is. - As an example, although a step motor is used in the preferred embodiment, could also be used with appropriate sensors, such as synchronous motors. Other types of motors exist. computer without the use of external sensors A stepper motor is chosen because it can sense position. Similarly, pad material The material may differ from that of the desired embodiment, and surface mounting may be required for all components. There would be no need to do so. The pad itself can also be composed of P-F Will. Using completely different drives, e.g. to provide x, y motion It is also clear to those skilled in the art that a lead screw device could be used.

As another example, if the elements of the circuit writer are given a certain size, PCB blanks are limited to the maximum size that will fit on the write table. However, the circuit writer can be adapted to handle larger or smaller boards. Such fabrication would not depart from the spirit or scope of the invention. each is different 3 on the writing carriage to apply the material, or all apply the same material. It would also be possible to install more than one write assembly. Also, the device is Although it was explained that the board should be made, if it is to be made, it is necessary to make a vair. As there are cases where it is possible to do this, please refer to Vair for information on how to proceed with this extruded PTP. The choice of whether to use it or not is reserved. In some cases, various methods may be used together. It may be desirable to For example, conductive traces are provided by extrusion. However, it is possible to provide an insulating layer over the entire board, not just over the conductive traces. Sometimes it's useful. Additionally, it describes a circuit writer in relation to a flat circuit board. However, there are inherent limitations that constrain the method of the present invention to such two-dimensional substrates. In fact, three-dimensional structures could be constructed by the method of the invention as well. different computer platform and data storage device. There may be many variations in programming and data processing elements. may be made, but all within the spirit and scope of the invention as set forth in the appended claims. Don't deviate.

Note table flat 3-504909 (40) Fig, 3C Fig, 3D, Fig, 3εFig, 4C Fig, 4D Fig, 4E Fig, 6D Fig, 6E Fig, 6J Be Fig, 9 Flg, 10 Fig, 12H Fig-15 Fig, 20 February 1991] C day

Claims (1)

Claims: 1. An apparatus for forming traces between pads on a printed circuit board, comprising: a. extruding a first extrudable material that becomes electrically conductive after curing to form the traces; a first extrusion device for injecting and forming the first extrudable material onto the printed circuit board; b a carriage device for carrying the first extrusion device; c a first extrusion device for injecting and forming the first extrudable material onto the printed circuit board; a writing chip associated therewith; d a first guide device for constraining the movement of said carriage device in a first linear direction; e a foundation frame for installing said first guide device; f a base frame for said carriage device; a second guide device for constraining the movement of the writing chip in a second linear direction perpendicular to the first direction; g for constraining the movement of the writing chip in a direction perpendicular to the first and second directions; a third guide device for moving the carriage device along the first guide device; h a first drive device for moving the carriage device along the first guide device; i a second drive device for moving the carriage device along the second guide device; Drive system j a third drive device for moving the writing tip along the third guide device; k a third drive device for controlling the first, second and third drive devices and for controlling the first extrusion device; a computerized control device for starting and stopping extrusion of material by the device, thereby controlling the start, end point and shape of traces on the printed circuit board. 2 the first guide device comprises: a a pair of substantially parallel rails; b a first saddle device slidably mounted on one of the pair of rails; c the other of the pair of rails. a second saddle device slidably mounted on each of the first and second saddle devices; d. said second guide device fixedly mounted on each of said first and second saddle devices; 2. The second guide device and the first and second saddle devices are adapted to move together along the pair of rails. A device for forming traces on the surface. 3. The trace forming method of claim 2, wherein said parallel rails are smooth steel shafts, and said first and second saddle arrangements are attached to said rails by linear bearings. equipment. 4 The parallel rails are Schnee-burger rails. 3. The apparatus for forming traces of claim 2, wherein the first and second saddle arrangements are mounted on the rail by Schneeberger bearing arrangements. 5 the second guide device includes a pair of substantially parallel rails, and the second guide device includes a pair of substantially parallel rails; the carriage straddles the pair of rails, and the carriage device slides onto each of the pair of rails. 3. A device for forming traces as claimed in claim 2, wherein the device is movably mounted. 6. The apparatus of claim 5, wherein the rail of the second guide device is a smooth steel shaft and the carriage device is mounted to the rail by a linear bearing. 7. The second guide device includes one Schneeberger rail, and the second guide device includes one Schneeberger rail, and 6. The rail according to claim 5, wherein the rail is mounted to the rail by a Schneperger bearing arrangement. equipment. 8 a four frame posts arranged in a substantially rectangular pattern; b a plurality of cables attached to said frame posts, said first and second saddle arrangements and said carriage arrangement; c a pulley; at least one adjustable cable anchor on each of the four frame columns; -, d each of the first and second drive devices is disposed through the plurality of pulleys and has a front a cable system latched to the adjustable cable anchor, and actuation of the first and second drives causes the carriage to have two degrees of freedom in a horizontal plane; 6. The apparatus of claim 5, further comprising: . 9 The first drive device includes: a a first electric motor installed on the foundation frame; b a first electric motor installed on the first electric motor; a first cable drum which is rotated by a first cable drum; c a first cable drum which is wound on said cable drum in a counter-clockwise direction so as to rotate said cable toward one side of said device; first and second cables extending from the cable drum; d third and fourth cables wound counterclockwise on the cable drum and extending from the cable drum toward opposite sides of the apparatus; 9. The apparatus of claim 8, comprising: a cable. 10a: the first cable passes around the cable pulley attached to the first of the frame columns and the cable pulley attached to the first saddle device; , a first case attached to the first frame column; b The second cable is latched to a bull anchor, and b the second cable is connected to the cable pulley attached to the second of the frame column and the cable slide attached to the first saddle device. and the vehicle, and is attached to the second frame post of the adjustable cable anchor. c The third cable is locked to a second cable anchor attached to the front the cable pulley attached to the third frame column and the cable pulley attached to the second saddle device; and the cable pulley attached to the third frame column of the adjustable cable anchor. d the fourth cable is latched to a third cable anchor; d the fourth cable passes through the cable pulley attached to the fourth of the frame columns; and the cable pulley attached to the second saddle device; Said adjustment self A fourth cable anchor attached to the fourth frame pillar of the existing cable anchor. e Therefore, when the first cable drum is rotated in one rotational direction, the front the first and second saddle devices together in one direction along the first guide device; and rotating the first cable drum in an opposite rotational direction urges the first and second saddle devices together in opposite directions along the second guide device. The apparatus according to claim 9. 11. The apparatus of claim 10, wherein the adjustable anchor is adjusted to apply substantially equal tensile stress to each of the cables to avoid strain-induced movement of the cables during service. 12 The first and third cables are aligned from one end of the first cable drum. and the second and fourth cables are wound at opposite ends of the first cable drum. so that while the first and second saddle arrangements are moved along the first guide arrangement, the angle that each of the cables makes with the longitudinal axis of the first cable drum is substantially The forces exerted by each cable and each cable are kept equal. 11. The apparatus of claim 10, which tends to equalize the frictional drag experienced by the bull. 13 The second drive device includes: a a second electric motor installed on the foundation frame; b a second electric motor installed on the second electric motor; c) a first cable wrapped around said cable drum and extending towards one side of said device; d) said first cable wrapped around said second cable drum; 9. The device of claim 8, comprising: a second cable wound in the same circumferential direction as and extending toward an opposite side of the device. 14 a The first cable is connected to one of the cable pulleys attached to the first of the frame columns, one of the pulleys attached to the first saddle device, and one of the cable pulleys attached to the first saddle device. one of the pulleys attached to the saddle device; and one of the pulleys attached to the first saddle device. and (b) the second cable passes around one of the adjustable pulleys attached to the second of the frame columns and is latched to one of the adjustable anchors attached to the second of the frame columns; one of the pulleys attached to the second saddle device, one of the pulleys attached to the second saddle device, and one of the pulleys attached to the carriage device. passing around one of the pulleys attached to the second saddle device and another of the pulleys attached to the second saddle device, and passing around one of the pulleys attached to the second saddle device, c so that when said second cable drum is rotated in one direction of rotation, the front Biasing the carriage device in one direction along the second guide device and rotating the second cable drum in the opposite direction of rotation causes the carriage to move along the second guide device. 14. The apparatus of claim 13, wherein biasing in opposite directions along the inner device causes actuation of the first drive device to not move the carriage along the second guide device. 15. The adjustable cable anchor shall be designed to prevent strain in the cable during operation. 15. The apparatus of claim 14, wherein the apparatus is adjusted to apply substantially equal tensile stress to the cable to avoid movement. 16 said cables are wound side by side from one end of said second cable drum, and the angles made by each of said cables with the longitudinal axis of said second cable drum remain substantially equal; force and friction to which each cable is subjected. 16. The device of claim 15, which tends to equalize the rubbing forces. 17 further comprising a second extrusion device for extruding a second extrudable material onto the first extrudable material, the second extrudable material being an electrically insulating material; 2. The apparatus of claim 1. 18 said first extrusion device comprises: a a tank device containing a supply of said first extrudable material; b a tank device for extruding said first extrudable material from said extrusion device; a gas supply device connected to the tank device for applying pressure to the first extrudable material in the storage device; c. a flexible tube connection device connecting the tank device and the writing chip; d. 2. The apparatus of claim 1, further comprising: a valve arrangement in said flexible tubing arrangement for stopping the flow of said first extrudable material between a tank arrangement and said writing tip. 19 a pressure control device for controlling the extrusion flow rate of the first extrudable material from the first extrusion device by controlling the pressure; The pressure control device further includes a pressure control device that controls the pressure control device in accordance with programmed information. 19. The device of claim 18, wherein the device is controllable by a computerized control device. 20 The valve device includes: a a rotary valve having an inlet, a through passage, and a side passage from the through passage, b a third electric motor for rotating the rotary valve, c the side Connected to the outlet of the flow path. an overflow receptacle connected to the writing tip; d in one position said through passageway allows substantially unimpeded passage of said first extrudable material through said rotary valve to said writing tip; the first extrudable material is adapted to be biased by the pressure; e. when the rotary valve is slightly rotated by the third motor, the tank device and (f) is adapted to completely disconnect said through-flow channel from said side flow channel to quickly stop the flow of extrudable material to said writing tip; connects the tank device to the overflow receptacle, and relieves pressure on the writing tip from the tank device through the valve, so that the extrudable material continues to be forced through the writing tip. 19. The apparatus of claim 18, wherein the apparatus is adapted to completely eliminate a tendency to 21 a a fourth electric motor installed on the carriage to raise and lower the writing tip; b engaging the third guide device and coupled to the writing tip to raise and lower the writing tip along with the writing tip; A slide designed to move vertically through the device. c a shaft driven by the fourth electric motor; d wound around the shaft, the slide When the shaft is rotated by the fourth electric motor, the slider is coupled to the slider. a thin-walled tongue for allowing the guide device to move in the z-direction with the writing tip within the guide device; e. 20. The apparatus of claim 18, further comprising: controlling the fourth electric motor by the computerized controller so as to move in the direction of the fourth motor. 22 By controlling the temperature of the extrudable material during extrusion, the rheological properties can be improved. pre-prepared according to pre-selected instructions to control heat-sensitive properties such as elasticity and viscosity. coupled to said writing chip, said computerized controller controlling said writing chip; 19. The apparatus of claim 18, further comprising an electric heater block. 23. said writing tip comprises: a a fitting connected to said flexible tubing connection device; b a hypodermic syringe-shaped tubing engaging said fitting; 19. The apparatus of claim 18, further comprising: reaching onto the printed circuit board to form traces on the printed circuit board. 24. The hypodermic syringe-type tube is outwardly sloped such that the outer diameter of the tube at the exit from which the extrudable material emerges onto the printed circuit board is less than the nominal outer diameter of the tube. 24. The apparatus of claim 23, having a beveled portion so that the width of the extruded trace is narrower than the width without the beveled portion. 25. The hypodermic syringe-type tube is inwardly sloped such that the inner diameter of the tube at the exit from which the extrudable material exits onto the printed circuit board is greater than the nominal inner diameter of the tube. a beveled portion, whereby the width of the extruded trace is greater than the width without the beveled portion; 24. The device of claim 23, wherein the device is wider. 27. The apparatus of claim 1, further comprising a writing table mounted on the base frame for positioning and holding the printed circuit board during formation of the traces. Place. 28 Pressing the printed circuit board against the writing table during trace formation 28. The apparatus of claim 27, further comprising a vacuum device for generating a differential pressure so as to create a pressure difference. 29. said writing table is pivotally mounted on said base frame, with said pivot axis substantially in the z-direction; The controller for rotating the a pivoting drive controllable by a computerized control device; b mounted on said carriage and capable of focusing said circuit board; 28. The apparatus of claim 27, including: a video camera that transmits images with the alignment device for use by an operator to align the printed circuit board prior to marking. 30 Apparatus for producing electrically conductive traces on a circuit board, comprising: a a first extrusion device for extruding a material that becomes electrically conductive after curing (hereinafter referred to as electrically conductive material); b said extrusion device and the circuit board in close proximity and the extrusion c. a stage device for producing relative movement of the conductive material onto the surface of the circuit board along a preselected path for producing the traces; c. 1 extrusion device and the stage device a control device for controlling the location; 31 further comprising a second extrusion device for extruding the electrically insulating material: a. holding said second extrusion device in close proximity to a circuit board; the stage apparatus includes a device for moving the electrically insulating material along the traces formed by the first extrusion device to produce insulated conductive traces on the circuit board; press up 31. The apparatus of claim 30, wherein the control device controls the second extrusion device to cause the extrusion device to eject. 32 The first extrusion device includes a first heating device for heating the conductive material. 32. The apparatus of claim 31. 33 The second extrusion device includes a second heating device for heating the electrically insulating material. 33. The apparatus of claim 32, comprising a thermal device. 34 The first extrusion device includes a first heating device for heating the conductive material. 31. The apparatus of claim 30. 35 further comprising a second extrusion device for extruding the electrically insulating material: a) holding the second extrusion device and the circuit board in close proximity; said stage apparatus includes a device for producing relative motion; b said first extrusion device for producing a conductive trace that is insulated at a plurality of locations; The electrical current is placed on the surface of the circuit board at the plurality of locations along the traces created by 31. The apparatus of claim 30, wherein the control device controls the second extrusion device and the stage device to extrude a gaseously insulating material. 36. Apparatus for fabricating conductive traces on a circuit board, comprising: a extrusion apparatus for extruding a first material; b holding the extrusion apparatus and the circuit board in close proximity to form conductive traces on a circuit board; The extrusion device and the circuit are configured to extrude the first material onto the circuit board along a preselected path to produce a circuit board. An apparatus comprising: a stage apparatus for producing relative movement between road plates; 37. A method of fabricating conductive traces on a circuit board support, comprising: a. extruding a first polymerizable material onto the support along a preselected path to form the traces. b. polymerizing said first polymerizable material which becomes electrically conductive after polymerization. 38 a. applying a second polymerizable material onto the support material at a plurality of locations above the first polymerizable material; b. applying the second polymerizable material to the substrate which becomes electrically insulating after polymerization; 38. The method of claim 37, further comprising: polymerizing the polymerizable material. 39. The method of claim 38, wherein the steps of polymerizing the first and second polymerizable materials overlap in time. 40. The step of polymerizing the first and second polymerizable materials comprises heating the support after the first and second polymerizable materials are applied. Method. 41. The method of claim 38, wherein polymerizing the first and second polymerizable materials includes providing an environment in which polymerization occurs and waiting until polymerization occurs. 42 at least a portion of said location insulated by said second polymerizable material intersects said trace formed by said first polymerizable material and overlaps said first polymerizable material; Advance the third material along a preselected path 39. The method of claim 38, further comprising applying the third material to the support, the third material being electrically conductive after being applied to the support. 43. The method of claim 42, wherein the third material is equal to the first polymerizable material, and wherein applying the third material includes polymerizing the third material. 44 The first polymerizable material, the second polymerizable material, and the third material 44. The method of claim 43, wherein the steps of polymerizing the materials overlap in time. 45. A circuit board for holding an electrical component, comprising: a. a circuit board support; b. a plurality of conductive traces adhered to the circuit board support between locations of the electrical component, the traces comprising: The motor is mounted on the support along a path defining the location of the A circuit board comprising traces formed from a thick film of polymer extruded through a orifice. 46. The circuit board of claim 25, wherein the trace has a maximum thickness that is at least 25% of its minimum width. 47. The circuit board of claim 45, wherein the trace has a maximum thickness at one or more locations that is at least 45% of the minimum width of the trace. 48 A circuit board for holding electrical components, comprising: a. a circuit board support; b. a circuit board attached to said support for electrically connecting said electrical components. a number of conductive pads, c a plurality of conductive traces bonded to said support and terminating on top surfaces of said pads to form electrical paths between said pads; a circuit board formed by extrusion of a thick polymeric film from a plurality of traces, some of which intersect over a countable number of other traces; 49. The circuit board of claim 48, wherein the pad has multiple corners. 50. The circuit board of claim 49, wherein the pad is rectangular. 51 The support is flat, and at least one of the pads on one side of the support is flat. The pads also partially have corresponding pads on opposite sides of the support to form a plurality of pairs of pads on the substrate, each of the plurality of pads having a corresponding pad on an opposite side of the support. 49. The circuit board of claim 48, wherein the circuit board is electrically connected to a corresponding pad. 52. The circuit of claim 48, wherein the trace is coated with an electrically insulating material. Road board. 53. The circuit board of claim 52, wherein the coating of the insulating material is formed by extruding the insulating material onto the traces. 54 Apply multiple layers of conductive traces, intersecting said traces of previous layers and Reduce the number of traces that are electrically connected to the pads without vias. 49. The circuit board of claim 48, wherein some of the layers have both. 55. A method of forming a jumper on a circuit board having conductive traces, comprising: a. positioning an extrusion device at the point of initiation of the jumper; b. extruding a material that becomes conductive after being applied to the circuit board. starting, c. taking a path from said starting point to an ending point crossing said conductive trace; d. moving the extrusion device close to the circuit board while the extrusion device is extruding the material; d. stopping extrusion of the material. 56 A method of forming a circuit of insulated conductive traces on a substrate, comprising: a. a trace routing engine containing a programmed representation of said circuit; the position on the board corresponds to the position pre-programmed into the board. b extruding a trace of a first material by a first extrusion device under programmed control of said trace routing engine; c curing said trace; d said curing. e. curing said second material; f. said trace routing engine; step b to e are repeated until the circuit determined by the said first and second materials and a curing layer to form a circuit of conductive traces. A method comprising the step of: 57 The overlapping step includes applying the second material onto the cured trace by a second extrusion device under programmed control of the trace routine engine. 57. The method of claim 56, comprising extruding the material. 58. The method of claim 57, wherein the first material and second material are pseudoplastic. 59 The step of overlapping further includes: 58. The method of claim 57, comprising forming an interfacial layer of a hydrophobic polymer between the first and second materials. 60 The first material includes an epoxy resin or prepolymer and a diamine or polyester. A polymer solution containing an amine curing agent, a first highly volatile solvent, and conductive particles. The second material includes allyl dicyanate, a second highly volatile solvent, and a hydride. The method according to claim 59, which is a polymer solution comprising a roxyl promoter and a metal catalyst. Law. 61 The step of curing the trace includes applying the first highly volatile solvent to the trace. 61. The method of claim 60, wherein the step of curing the second material includes vaporizing the second highly volatile solvent from the second material. 62. The method of claim 61, wherein the first extrusion device extrudes the first material through a writing tip having a width in the range of 3 to 20 mils (76 to 508 microns). Law. 63a A thick wall of conductive polymer having a width in the range of 3 to 20 mils (76 to 508 μ) and a resistivity in the range of 0.1 to 0.6 Ω/in (0.04 to 0.24 Ω/cm) Heartwood consisting of film. b. A thick film of insulating polymer enveloping the core material and bonding the core material to the substrate. an insulated conductive trace on a substrate, comprising: a cladding comprising: c; an interfacial layer comprising an impermeable, hydrophobic polymer between said core material and said cladding; 64 The thick film of conductive polymer is coated with cross-linked epoxy resin mixed with conductive particles. The crosslinking epoxy polymer contains a diamine or polyamine hardener. The thick film of the insulating polymer is cross-linked by a binder. 64. The insulated conductive trace of claim 63, comprising: a conductive trace. 65. The insulated conductive tray of claim 64, wherein the thick film of conductive polymer further comprises 75-90% by weight conductive particles, and the conductive particles are silver. vinegar. 66 a: an epoxy resin or a bripolymer; b: a diamine or polyamine curing agent; c: a first low-volatility solvent; d: a first high-volatility solvent; e: conductive particles; and has a pseudoplastic and non-zero yield point. polymerization that becomes conductive after curing body solution. 67 The highly volatile solvents include 2-butanone, 4-methyl 2-pentanone, dioxane, ethyl acetate, ethoxytetrahydrofuran, acetone, and tetrahydrofuran. 67. The polymer solution of claim 66 selected from the group consisting of lofuran, ethyl acetate, and methyl ethyl ketone. 68. The polymer solution of claim 66, wherein the conductive particles constitute 75-90% by weight of the mixture. 69 The first low-volatility solvent is 2-butoxyethyl acetate, 2-methoxy 67. The polymer solution of claim 66, selected from the group consisting of ethyl ether, ethoxy ethyl acetate, propylene glycol methyl ether acetate, and 1 methyl 2 pyrrolidinone. 70. The polymer solution of claim 66, wherein the epoxy resin or prepolymer is restrained. 71. The polymer solution of claim 66, which exhibits no thixotropic hysteresis. 72 A polymer solution which is pseudoplastic and has a non-zero yield point and becomes insulating after curing, comprising a allyl dicyanate, b a highly volatile solvent, c a hydroxyl promoter, and d a metal catalyst. 73. The polymer solution of claim 72, which exhibits no thixotropic hysteresis. 74 An apparatus for extruding an extrudable material, comprising: a. the extrudable material; a storage volume for storing a quantity of material; b a writing tip opening into said storage volume for injection molding of said extrudable material; c a writing tip opening into said storage volume for injection molding said extrudable material; a filling passage connected to said storage volume for replenishing material; d a valve passage closing said filling passage; e biased by a spring to tend to close said opening to said filling passage; a valve piston in the valve passage, f a supply port opening into the valve passage, a pressure applied to the supply port; The extrudable material moves the valve piston against the spring and the extrudable material The valve passage is opened to a filling passage, and the extrudable material is allowed to flow through the filling port from the filling port. a fill port for allowing flow into said storage volume through a filling passage; g opening into said storage volume for introducing pressurized gas so that said extrudable material is forced out of said writing tip; A device containing a pressurizing port; 75 a the extrudable material is extruded from the storage volume; a metering piston in said storage volume adapted to move within said storage volume; b the relative fill level of said storage volume and said extrudable material from said storage volume; sensing the position of the piston within the storage volume to determine the extrusion rate of material; 75. The apparatus of claim 74, further comprising: a piston sensing device for sensing. 76. The apparatus of claim 75, wherein the metering piston is made of a magnetically permeable material and the sensing device includes an LVDT coil that senses position and relative movement of the piston. 77 the valve passage and the fill passage are collinear, the valve piston having a first portion having a first diameter that fits snugly within the valve passage; and a first portion that fits snugly within the fill passage; a second portion having a second diameter less than a diameter of the second portion, starting from an end of the second portion distal to the first portion and proceeding toward the first portion; , the second part has a connecting passage that opens through an outer wall of the second part in a changed direction, and the second part has a connecting passage that opens through an outer wall of the second part; When fully inserted into the filling passageway, the connecting passageway closes and the valve piston is urged against the spring to remove the second portion from the filling passageway. When partially withdrawing the liquid, the connecting passage opens from the valve passage to the filling passage. 75. The device of claim 74, wherein the device forms a drainage path. 78. A modular replenishment tank connected to the replenishment port for replenishing a quantity of the extrudable material to replenish the storage volume of the device, the replenishment tank being adapted to supply extrudable material from the replenishment tank. Supplying pressurized gas to energize 75. The apparatus of claim 74, further comprising a replenishment tank having a pressure port. 79. The apparatus of claim 78, wherein the modular replenishment tank further comprises a first quick-release fitting that connects to the replenishment port and a second quick-release fitting that connects to the pressure port. 80. The apparatus of claim 78, further comprising a valve arrangement connected to the pressure port for delivering pressurized gas to the replenishment tank and venting the replenishment tank. 81 Sending pressurized gas to the storage volume and venting the storage volume The claim further includes a gas valve device connecting the pressure port and the storage volume to 75. The device according to claim 74. 82 further comprising an extrudable material stored in the storage volume, the extrudable material having a yield point of a height sufficient to support the weight of the metering piston; 75. The device of claim 74, comprising a pseudoplastic material. 83. A method of forming a mounting pad for mounting a differentiated device on a circuit board support having a non-conductive surface for receiving the mounting pad, the method comprising: a. Materials that can polymerize freely on non-conductive surfaces (b) polymerizing said polymerizable material which becomes electrically conductive after polymerization; A method that includes: 84 a circuit board support having a non-conductive surface; b an orifice on said support; a plurality of conductive mounting pads on said non-conductive surface, comprising a thick film of polymer formed by extrusion from a substrate; 85 A plurality of conductive strips between the mounting pads and connected to the mounting pads. a trace, the trace being placed on the support along a path defining the location of the trace; 85. The circuit board of claim 84, further comprising conductive traces comprising a thick film of polymer formed by extrusion from the orifice. 86. The circuit board of claim 85, wherein the traces are covered with a coating of electrically insulating material. 87 The coating of insulating material is formed by extruding the insulating material onto the traces. 87. The circuit board of claim 86, wherein the circuit board is formed by: 88 having a plurality of layers of conductive traces, at least some of which have a plurality of traces electrically connected to the pads without vias crossing over the traces of previous layers; 88. The circuit board of claim 87. 89. A circuit board for holding components, comprising: a circuit board support; b an extruded polymer polymerized on said circuit board support and cut to assume a geometric shape after polymerization. 90 a. extruding a polymerizable material onto a circuit board; b. curing said polymerizable material; c. cutting portions of said material to form precise geometric shapes after polymerization; How to create precise geometric shapes on circuit boards, including: 91 Mounting on a circuit board support with a conductive coating layer on the non-conductive support 1. A method of forming an electrical connection between two electrically isolated mounting pads, the method comprising: cutting a groove through said cladding layer to form an orifice comprising: a. said mounting by extruding a thick film of forming an insulating subgrade between the mounting pads overlying the conductive coating layer between the mounting pads; b. forming a thick polymerizable film between each of the mounting pads; c. forming conductive traces between the attachment pads that track and overlap the insulating subgrade and are narrower than the insulating subgrade; c. the conductive traces that become conductive after polymerization; The polymerizable thick-walled filament that creates the trace polymerizing the lume. 92 extruding a polymerizable thick film insulative coating over the extruded conductive traces prior to the polymerization step, the insulative coating encasing the insulative traces along with the insulative subgrade; 92. The electrically isolated mounting of claim 91, comprising: A method of forming conductive traces between pads. 93a Circuit board support having a conductive coating layer on a non-conductive support. b by cutting a groove through said conductive coating layer to form a mounting pad; a plurality of conductive mounting pads on said non-conductive support pad formed by c. A conductive thick film material is formed by extruding a conductive thick film material on top of an insulating subgrade formed by extruding a thick insulating polymerizable film material between the attachment pads. a plurality of electrical traces between the mounting pads; a circuit board for holding electrical components; 94 By extruding an insulating thick film material over the electrical traces. 94. Protecting the electrical component of claim 93, wherein the electrical trace is encased in an insulating material. circuit board for holding. 95 Having multiple layers of conductive traces, at least some of which are in front of the previous layer. Multiple front traces electrically connected to the pads without vias crossing over the traces. 95. A circuit board for holding an electrical component as claimed in claim 94, having said traces. 96. Two electrically isolated mounts constructed on a circuit board support module having a conductive coating layer over a non-conductive support by cutting a groove through said coating layer to form a mounting pad. A method of forming an electrical connection between pads, the method comprising: a forming a groove connecting between the grooves forming the isolated mounting pad; forming one of said electrically isolated mounting pads through an overlayer; b. From one to the other, press a trace of polymerizable material, following the path of the connecting grooves. Since the width of the trace is narrower than the width of the connecting groove, the trace is Do not touch any part of the coating except at isolated mounting pads. c. polymerizing said polymerizable material which becomes electrically conductive after polymerization. 97 a extruding traces of insulating material over the traces of conductive material; b polymerizing the traces of insulating material so that the traces of insulating material cover the traces of conductive material; 97. The method of forming an electrical connection between two electrically isolated mounting pads as recited in claim 96, further comprising: forming an electrically isolated mounting pad. 98 a. a circuit board support material having a conductive coating layer on the non-conductive support material; b. a circuit board support material having a conductive coating layer thereon; b. a plurality of electrically conductive mounting pads on an electrically conductive support; c a plurality of conductive mounting pads passing through the electrically conductive coating layer between the grooves forming the mounting pads; a number of connecting grooves, d formed by material extruded into said grooves and connected to said mounting pad; a circuit board for holding an electrical component, comprising: an electrical trace between the mounting pads that does not contact any part of the conductive cover layer except at the point of the pad; 99 A circuit board support having an electrically conductive coating layer on a non-conductive material and having a non-conductive layer on top of the electrically conductive coating layer, electrically isolated for discrete devices. A method of forming a mounting pad comprising: a. forming a groove through both the conductive coating layer and the non-conductive layer; b. removing the non-conducting layer from the covering layer of the isolated area and leaving the material covered with the non-conducting layer leaving an enclosed, isolated conductive pad; 100 A circuit board support material having a conductive coating layer on a non-conductive support material, and a circuit board support material having a non-conductive layer on the conductive coating layer; a groove passing through the conductive coating layer and the non-conductive layer. a plurality of conductive mounting pads on said non-conductive support formed by removing a non-conductive layer from the formed mounting pads; and a circuit board for holding electrical components. 101 A conductive coating layer is provided on a non-conductive support material, and a non-conductive coating layer is provided on the conductive coating layer. forming an electrical connection between two electrically isolated mounting pads formed on a circuit board support having a conductive layer by forming a groove through the cover layer and the non-conductive layer; A method of: a) inserting an insulating weight into the groove from the orifice; filling said groove with an insulating material by extruding a polymerizable thick film; b. tracing a second polymerizable material from one of said electrically isolated mounting pads to another one; extrude the traces from the conductive material on each of the mounting pads. c. polymerizing the second polymerizable material which becomes electrically conductive after polymerization; ; A method including; 102 a extruding a coated trace of insulating material over the conductive material trace; 102. The method of forming an electrical connection between two electrically isolated mounting pads as recited in claim 101, further comprising: b. polymerizing the coated traces of insulating material. 103 a. A circuit board support material having a conductive coating layer on a non-conductive support material and a non-conductive layer on the conductive coating layer, b. A circuit board support material having the conductive coating layer and the non-conductive layer. removing said non-conductive layer from a mounting pad formed by forming a groove, said groove being filled with insulating material by extrusion from an orifice; a plurality of conductive mounting pads on said non-conductive support, c filling said groove; said insulating material and said non-conductive layer of said polymeric thick film formed by extrusion from an orifice onto said circuit board support along a path overlying said non-conductive layer; A circuit board for holding electrical components, including a plurality of conductive traces between and connecting the bonding pads. 104. The circuit for holding an electrical component of claim 103, wherein the conductive trace is covered by a coating of insulating material formed by extruding the insulating material onto the conductive trace. Board. 105 having multiple layers of conductive traces, at least some of which cross over the traces of previous layers and electrically connect to the pads without vias. 105. The circuit board of claim 104. 106 Align and install the differentiated device leads on the circuit board support material 1. A method of forming a mounting pad for mounting a circuit board, comprising: a. extruding adjacent lines of polymerizable thick film material onto the circuit board support. and every other line of said material is an insulating material, and the remaining lines are lines that become conductive after polymerization, and said insulating lines are longer in front than said conductive lines. the conductive line extends on the circuit board support, and the conductive line extends in front of the differentiated device. a space between the insulating lines is substantially equal to the width of the lead wire, and the space between the insulating lines is an alignment groove for the lead wire of the differentiated device; b. polymerizing the lines of extruded material; A method comprising the steps of: 107 Before the polymerization, the adjacent lines of the polymerizable thick film material are further comprising extruding lines of insulating material that intersect at qualitatively right angles; 107. The method of aligning and attaching differentiated device leads as recited in claim 106, wherein the connecting line provides a supplemental constraint for aligning the differentiated device leads. How to form mounting pads for installation. 108 a circuit board support; b extruding adjacent lines of polymerizable thick film material onto said circuit board support; Align and install differentiated device leads formed by mounting pads for mounting, wherein every other line of said material is an insulating material; and the remaining lines are of a material that becomes conductive after polymerization, the insulating lines extending above the circuit board support longer than the conductive lines, and the conductive lines being connected to the differentiated device. an electrical component including: a mounting pad substantially equal to the width of the leads of the insulating line, the space between the insulating lines providing an alignment groove for the differentiated device leads; Circuit board for holding. 109 A method for electrically connecting conductive pads on one side of a circuit board having an internal conductive layer to conductive pads on the opposite side of the circuit board without contacting said internal conductive layer. a. drilling a first hole through the circuit board through the conductive pads on the opposite sides and through the internal conductive layer; b. an insulating layer from an orifice to the first hole; extruding a polymerizable thick film material, c. polymerizing the insulating thick film material to form an insulating plug in the first hole, d. placing an insulating material in the first hole. A second hole is drilled in the insulating plug, leaving an annular body. e. extruding a second polymerizable thick film material, which becomes electrically conductive after polymerization, through an orifice into the second hole so that the second material forms the insulating material on each side of the circuit board; material a second material overlying and contacting each of the conductive pads, the second material being electrically isolated from the inner conductive layer by an annular body of the insulating material; A thick film material is polymerized to form an electrical connection between the pads. and the second material is electrically isolated from the inner conductive layer. Law. 110 a) a circuit board support having an internal conductive layer and conductive pads on each side; b) a connection between the pads on opposite sides of the circuit board, comprising: i) a connection opened through the circuit board and connected to the circuit; a first hole passing through a conductive pad on each side of the plate and through said internal conductive layer; ii) extruding an insulating polymerizable material from an orifice into said first hole; an insulating plug formed by polymerizing a peripheral material through the first hole; iii) passing a light through the insulating plug, leaving an annular body of insulating material through the circuit board; iv) extruding a polymerizable material into said second holes; polymerizing the polymerizable material in contact with the pads on both sides of the road plate and separated from the inner conductive layer by an annular body of insulating material, which becomes electrically conductive after polymerization; a conductive trace through the second hole, formed by: a connection comprising: a circuit board for holding an electrical component; 111 Electrically connecting conductive pads on one side of a circuit board having an internal conductive layer to conductive pads on the opposite side of the circuit board without contacting said internal conductive layer. a. forming a slot through the circuit board, through the conductive pads on both sides of the circuit board, and through the internal conductive layer; b. forming a slot along a portion of the slot. Thick-walled insulating polymerizable film that intersects with the internal conductive layer extruding a subgrade of film material from the orifice; c extruding a first trace of polymerizable thick film material, which becomes electrically conductive after polymerization, through the orifice into the slot; The traces have a narrower width than the subgrade of insulative material and overlap the insulative subgrade so that the first trace does not contact the internal conductive layer and the first trace does not contact the internal conductive layer. both sides of the circuit board contacting each of the conductive pads on the side; d polymerizing the polymerizable material. 112 Prior to polymerizing the polymerizable thick film, extruding a coated trace of insulating polymerizable thick film material over the first trace and increasing the height of the internal conductive layer of the circuit board. comprising an additional step of masking said first trace at The method according to claim 111. 113 a) a circuit furnace board support having an internal conductive layer and conductive pads on each side; b) connections between said pads on opposite sides of said circuit board; i) formed through said circuit board; ii) a slot formed by extruding an insulative polymerizable material through an orifice into the slot and extending through a conductive pad on each side of the circuit board and through the internal conductive layer; iii) an insulating subgrade within said slots intersecting the layers; A circuit board for holding an electrical component, comprising: a conductive trace contacting the pad on the side and separated from the internal conductive layer of the circuit board by the insulating subgrade. 115 the connection between the pads additionally comprises a cover trace made of an insulating material extruded from an orifice and covering the conductive trace at the level of the internal conductive layer of the circuit board; 115. A circuit board for holding an electrical component according to claim 114. 116 Align and install the differentiated device leads on the circuit board support material a. extruding a pad of insulating polymerizable material onto the circuit board support; b. polymerizing the insulating material; c. electrical component leads. forming an opening in the polymerized insulating pad for aligning and attaching a wire; d extruding a polymerizable material that becomes electrically conductive after polymerization into the opening; forming an electrically conductive mounting surface for the lead wire of a gas component; e. polymerizing the electrically conductive polymerizable material. 117 a circuit board support material, b extruding an insulating polymerizable material, polymerizing the insulating material and forming openings in the insulating pad for alignment and attachment of electrical component leads; extruding a second polymerizable material that becomes electrically conductive into the formed opening to form a conductive attachment surface for the lead wire; and curing the second polymerizable material. a plurality of mounting pads on the circuit board support formed by circuit board for holding electrical components;