AU3588571A - A method of electrically connecting a semiconductor chip toa substrate - Google Patents
A method of electrically connecting a semiconductor chip toa substrateInfo
- Publication number
- AU3588571A AU3588571A AU35885/71A AU3588571A AU3588571A AU 3588571 A AU3588571 A AU 3588571A AU 35885/71 A AU35885/71 A AU 35885/71A AU 3588571 A AU3588571 A AU 3588571A AU 3588571 A AU3588571 A AU 3588571A
- Authority
- AU
- Australia
- Prior art keywords
- semiconductor chip
- electrically connecting
- toa
- substrate
- toa substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/05—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
-
- H10W72/07236—
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB5572170A GB1363431A (en) | 1970-11-24 | 1970-11-24 | Method of electrically connecting a semiconductor chip to a sub strate |
| GBGB55721 | 1970-11-24 | ||
| GBGB5484 | 1971-02-25 | ||
| GB548471 | 1971-02-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU3588571A true AU3588571A (en) | 1973-05-24 |
Family
ID=26239922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU35885/71A Expired AU3588571A (en) | 1970-11-24 | 1971-11-18 | A method of electrically connecting a semiconductor chip toa substrate |
Country Status (4)
| Country | Link |
|---|---|
| AU (1) | AU3588571A (enExample) |
| DE (1) | DE2157956A1 (enExample) |
| FR (1) | FR2115393A1 (enExample) |
| IT (1) | IT945066B (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3997910A (en) * | 1975-02-26 | 1976-12-14 | Rca Corporation | Semiconductor device with solder conductive paths |
| DE2704833C2 (de) * | 1977-02-05 | 1982-05-27 | Robert Bosch Gmbh, 7000 Stuttgart | Leiterbahn-Endbereich zum Anlöten eines Halbleiterelementes in Flip-Chip- Technik |
-
1971
- 1971-11-18 AU AU35885/71A patent/AU3588571A/en not_active Expired
- 1971-11-22 IT IT54241/71A patent/IT945066B/it active
- 1971-11-23 DE DE19712157956 patent/DE2157956A1/de active Pending
- 1971-11-24 FR FR7142146A patent/FR2115393A1/fr not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| DE2157956A1 (de) | 1972-05-31 |
| IT945066B (it) | 1973-05-10 |
| FR2115393A1 (enExample) | 1972-07-07 |
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