AU2003295223A1 - Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof - Google Patents

Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof

Info

Publication number
AU2003295223A1
AU2003295223A1 AU2003295223A AU2003295223A AU2003295223A1 AU 2003295223 A1 AU2003295223 A1 AU 2003295223A1 AU 2003295223 A AU2003295223 A AU 2003295223A AU 2003295223 A AU2003295223 A AU 2003295223A AU 2003295223 A1 AU2003295223 A1 AU 2003295223A1
Authority
AU
Australia
Prior art keywords
micromechanical
deposit
production
support
getter material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003295223A
Other languages
English (en)
Inventor
Marco Amiotti
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SAES Getters SpA
Original Assignee
SAES Getters SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SAES Getters SpA filed Critical SAES Getters SpA
Publication of AU2003295223A1 publication Critical patent/AU2003295223A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
AU2003295223A 2003-01-17 2003-12-24 Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof Abandoned AU2003295223A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ITMI2003A000069 2003-01-17
IT000069A ITMI20030069A1 (it) 2003-01-17 2003-01-17 Dispositivi micromeccanici o microoptoelettronici con deposito di materiale getter e riscaldatore integrato.
PCT/IT2003/000857 WO2004065289A2 (en) 2003-01-17 2003-12-24 Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof

Publications (1)

Publication Number Publication Date
AU2003295223A1 true AU2003295223A1 (en) 2004-08-13

Family

ID=32750478

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003295223A Abandoned AU2003295223A1 (en) 2003-01-17 2003-12-24 Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof

Country Status (12)

Country Link
EP (1) EP1592643A2 (ja)
JP (1) JP2006513046A (ja)
KR (1) KR20050092426A (ja)
CN (1) CN100453442C (ja)
AU (1) AU2003295223A1 (ja)
CA (1) CA2511836A1 (ja)
HK (1) HK1087090A1 (ja)
IT (1) ITMI20030069A1 (ja)
MY (1) MY157923A (ja)
NO (1) NO20053804L (ja)
TW (1) TW200500291A (ja)
WO (1) WO2004065289A2 (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005001449B3 (de) * 2005-01-12 2006-07-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Erzeugen eines vorgegebenen Innendrucks in einem Hohlraum eines Halbleiterbauelements
ITMI20052343A1 (it) * 2005-12-06 2007-06-07 Getters Spa Processo per la produzione di dispositivi micromeccanici contenenti un materiale getter e dispositivi cosi'prodotti
FR2898597B1 (fr) 2006-03-16 2008-09-19 Commissariat Energie Atomique Encapsulation dans une cavite hermetique d'un compose microelectronique, notamment d'un mems
FR2903678B1 (fr) 2006-07-13 2008-10-24 Commissariat Energie Atomique Microcomposant encapsule equipe d'au moins un getter
US7402905B2 (en) * 2006-08-07 2008-07-22 Honeywell International Inc. Methods of fabrication of wafer-level vacuum packaged devices
ITMI20070301A1 (it) 2007-02-16 2008-08-17 Getters Spa Supporti comprendenti materiali getter e sorgenti di metalli alcalini o alcalino-terrosi per sistemi di termoregolazione basati su effetto tunnel
FR2933389B1 (fr) * 2008-07-01 2010-10-29 Commissariat Energie Atomique Structure a base d'un materiau getter suspendu
JP2010251702A (ja) * 2009-03-27 2010-11-04 Kyocera Corp 電子部品、パッケージおよび赤外線センサ
FR2956521B1 (fr) * 2010-02-16 2012-08-17 Thales Sa Dispositif comprenant des composants electriques, electroniques, electromecaniques ou electro-optiques, a sensibilite reduite a faible debit de dose
US9491802B2 (en) 2012-02-17 2016-11-08 Honeywell International Inc. On-chip alkali dispenser
EP2736071B8 (en) 2012-11-22 2017-04-19 Tronic's Microsystems S.A. Wafer level package with getter
WO2014187505A1 (en) * 2013-05-24 2014-11-27 Epcos Ag Microelectromechanical systems device package and method for producing the microelectromechanical systems device package
EP2813465B1 (en) 2013-06-12 2020-01-15 Tronic's Microsystems MEMS device with getter layer
FR3008965B1 (fr) * 2013-07-26 2017-03-03 Commissariat Energie Atomique Structure d'encapsulation comprenant un capot renforce mecaniquement et a effet getter
CN104743502A (zh) * 2013-12-31 2015-07-01 北京有色金属研究总院 一种具有复合吸气剂层的mems组件及其制备方法
JP2017224704A (ja) 2016-06-15 2017-12-21 セイコーエプソン株式会社 真空パッケージ、電子デバイス、電子機器及び移動体
CN109173690B (zh) * 2018-09-20 2020-10-09 内蒙古科技大学 一种用于金属材料热处理中的空气消耗剂

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5734226A (en) * 1992-08-12 1998-03-31 Micron Technology, Inc. Wire-bonded getters useful in evacuated displays
US5610438A (en) * 1995-03-08 1997-03-11 Texas Instruments Incorporated Micro-mechanical device with non-evaporable getter
US5837935A (en) * 1996-02-26 1998-11-17 Ford Motor Company Hermetic seal for an electronic component having a secondary chamber
SE9700612D0 (sv) * 1997-02-20 1997-02-20 Cecap Ab Sensorelement med integrerat referenstryck
US6992375B2 (en) * 2000-11-30 2006-01-31 Texas Instruments Incorporated Anchor for device package

Also Published As

Publication number Publication date
NO20053804L (no) 2005-08-12
CN1738765A (zh) 2006-02-22
KR20050092426A (ko) 2005-09-21
MY157923A (en) 2016-08-15
WO2004065289A2 (en) 2004-08-05
ITMI20030069A1 (it) 2004-07-18
CA2511836A1 (en) 2004-08-05
CN100453442C (zh) 2009-01-21
HK1087090A1 (en) 2006-10-06
JP2006513046A (ja) 2006-04-20
EP1592643A2 (en) 2005-11-09
TW200500291A (en) 2005-01-01
WO2004065289A3 (en) 2005-01-06

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase