AU2003280468A1 - Miniature rf and microwave components and methods for fabricating such components - Google Patents

Miniature rf and microwave components and methods for fabricating such components

Info

Publication number
AU2003280468A1
AU2003280468A1 AU2003280468A AU2003280468A AU2003280468A1 AU 2003280468 A1 AU2003280468 A1 AU 2003280468A1 AU 2003280468 A AU2003280468 A AU 2003280468A AU 2003280468 A AU2003280468 A AU 2003280468A AU 2003280468 A1 AU2003280468 A1 AU 2003280468A1
Authority
AU
Australia
Prior art keywords
components
miniature
fabricating
methods
microwave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003280468A
Other languages
English (en)
Inventor
Christopher A. Bang
Elliott R. Brown
Adam L. Cohen
John D. Evans
Morton Grosser
Michael S. Lockard
Dennis R. Smalley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Memgen Corp
Original Assignee
Memgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/309,521 external-priority patent/US7259640B2/en
Priority claimed from US10/434,295 external-priority patent/US20040004001A1/en
Priority claimed from US10/434,103 external-priority patent/US7160429B2/en
Priority claimed from US10/434,497 external-priority patent/US7303663B2/en
Priority claimed from US10/434,519 external-priority patent/US7252861B2/en
Application filed by Memgen Corp filed Critical Memgen Corp
Publication of AU2003280468A1 publication Critical patent/AU2003280468A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/005—Manufacturing coaxial lines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00126—Static structures not provided for in groups B81C1/00031 - B81C1/00119
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/003—3D structures, e.g. superposed patterned layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/202—Coaxial filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/06—Coaxial lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/183—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers at least one of the guides being a coaxial line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0109—Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electrochemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Waveguides (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Waveguide Switches, Polarizers, And Phase Shifters (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
AU2003280468A 2002-06-27 2003-06-27 Miniature rf and microwave components and methods for fabricating such components Abandoned AU2003280468A1 (en)

Applications Claiming Priority (19)

Application Number Priority Date Filing Date Title
US39253102P 2002-06-27 2002-06-27
US60/392,531 2002-06-27
US41537402P 2002-10-01 2002-10-01
US60/415,374 2002-10-01
US10/309,521 US7259640B2 (en) 2001-12-03 2002-12-03 Miniature RF and microwave components and methods for fabricating such components
US10/309,521 2002-12-03
US46450403P 2003-04-21 2003-04-21
US60/464,504 2003-04-21
US10/434,295 2003-05-07
US10/434,519 2003-05-07
US10/434,295 US20040004001A1 (en) 2002-05-07 2003-05-07 Method of and apparatus for forming three-dimensional structures integral with semiconductor based circuitry
US10/434,103 2003-05-07
US10/434,103 US7160429B2 (en) 2002-05-07 2003-05-07 Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures
US10/434,497 US7303663B2 (en) 2002-05-07 2003-05-07 Multistep release method for electrochemically fabricated structures
US10/434,519 US7252861B2 (en) 2002-05-07 2003-05-07 Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids
US10/434,497 2003-05-07
US47655403P 2003-06-06 2003-06-06
US60/476,554 2003-06-06
PCT/US2003/020458 WO2004004061A1 (en) 2002-06-27 2003-06-27 Miniature rf and microwave components and methods for fabricating such components

Publications (1)

Publication Number Publication Date
AU2003280468A1 true AU2003280468A1 (en) 2004-01-19

Family

ID=30004145

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003280468A Abandoned AU2003280468A1 (en) 2002-06-27 2003-06-27 Miniature rf and microwave components and methods for fabricating such components

Country Status (5)

Country Link
EP (1) EP1520321A1 (zh)
JP (2) JP2005532015A (zh)
CN (1) CN1669177A (zh)
AU (1) AU2003280468A1 (zh)
WO (1) WO2004004061A1 (zh)

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WO2007125326A1 (en) * 2006-04-25 2007-11-08 Thruvision Limited Radiation detector
US7482893B2 (en) * 2006-05-18 2009-01-27 The Regents Of The University Of California Power combiners using meta-material composite right/left hand transmission line at infinite wavelength frequency
KR20080063217A (ko) * 2006-12-30 2008-07-03 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. 3차원 미세구조 및 그 형성방법
JP2008188754A (ja) * 2006-12-30 2008-08-21 Rohm & Haas Electronic Materials Llc 三次元微細構造体およびその形成方法
EP1939137B1 (en) 2006-12-30 2016-08-24 Nuvotronics, LLC Three-dimensional microstructures and methods of formation thereof
KR101472134B1 (ko) 2007-03-20 2014-12-15 누보트로닉스, 엘.엘.씨 동축 전송선 마이크로구조물 및 그의 형성방법
US7755174B2 (en) 2007-03-20 2010-07-13 Nuvotonics, LLC Integrated electronic components and methods of formation thereof
US8659371B2 (en) 2009-03-03 2014-02-25 Bae Systems Information And Electronic Systems Integration Inc. Three-dimensional matrix structure for defining a coaxial transmission line channel
JP4980397B2 (ja) * 2009-07-06 2012-07-18 三菱電機株式会社 方形同軸線路スロットアレーアンテナ
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
US8917150B2 (en) 2010-01-22 2014-12-23 Nuvotronics, Llc Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels
JP5639194B2 (ja) 2010-01-22 2014-12-10 ヌボトロニクス，エルエルシー 熱制御
DE102010013384A1 (de) * 2010-03-30 2011-10-06 Spinner Gmbh Koaxialleiterstruktur
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
KR101982887B1 (ko) 2011-07-13 2019-05-27 누보트로닉스, 인크. 전자 및 기계 구조체들을 제조하는 방법들
US8786515B2 (en) 2011-08-30 2014-07-22 Harris Corporation Phased array antenna module and method of making same
US9142497B2 (en) 2011-10-05 2015-09-22 Harris Corporation Method for making electrical structure with air dielectric and related electrical structures
US9706605B2 (en) * 2012-03-30 2017-07-11 Applied Materials, Inc. Substrate support with feedthrough structure
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
KR20160133422A (ko) 2014-01-17 2016-11-22 누보트로닉스, 인크. 웨이퍼 규모 테스트 인터페이스 유닛 및 컨택터
JP6284144B2 (ja) * 2014-02-14 2018-02-28 マクセルホールディングス株式会社 電鋳品及びその製造方法
CN106797064B (zh) * 2014-10-23 2019-09-13 华为技术有限公司 微带多工器
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
EP3224899A4 (en) 2014-12-03 2018-08-22 Nuvotronics, Inc. Systems and methods for manufacturing stacked circuits and transmission lines
DE102015201927A1 (de) 2015-02-04 2016-08-04 Siemens Aktiengesellschaft Verfahren zum Kaltgasspritzen mit Maske
KR102059285B1 (ko) * 2015-12-28 2019-12-24 가부시키가이샤 무라타 세이사쿠쇼 멀티플렉서
EP3301758A1 (en) * 2016-09-30 2018-04-04 IMS Connector Systems GmbH Antenna element
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
DE102018109505A1 (de) * 2018-04-20 2019-10-24 Stl Systems Ag Polyederförmige Spulensysteme mit großem Homogenitätsvolumen und großem Zugangsbereich
JP7288055B2 (ja) 2018-12-20 2023-06-06 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション 少なくとも２つのビアと接続されたコンデンサを備える多層フィルタ
CN113228504A (zh) 2018-12-20 2021-08-06 阿维科斯公司 高频多层滤波器
JP2022513526A (ja) 2018-12-20 2022-02-08 エイブイエックス コーポレイション リターン信号を低減する突起部を備える多層フィルタ
CN113228409B (zh) 2018-12-20 2022-05-27 京瓷Avx元器件公司 包括具有精确控制电容面积的电容器的多层电子装置
CN113228503A (zh) 2018-12-20 2021-08-06 阿维科斯公司 包括高精度电感器的多层电子装置
CN109940398B (zh) * 2019-03-26 2020-09-29 中国科学院微电子研究所 一种微观零件批量精密加工仪器
CN110380178B (zh) * 2019-07-29 2021-07-13 中国电子科技集团公司第五十五研究所 基于硅微机械加工的毫米波径向多路功率分配器
CN111585045B (zh) * 2020-05-20 2022-04-12 西安黄河机电有限公司 一种多联骨牌稀布天线及其布阵方法

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Also Published As

Publication number Publication date
WO2004004061A1 (en) 2004-01-08
JP2005532015A (ja) 2005-10-20
EP1520321A1 (en) 2005-04-06
JP2009038806A (ja) 2009-02-19
CN1669177A (zh) 2005-09-14

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase