AU2003277778A1 - Current-carrying electronic component and method of manufacturing same - Google Patents

Current-carrying electronic component and method of manufacturing same

Info

Publication number
AU2003277778A1
AU2003277778A1 AU2003277778A AU2003277778A AU2003277778A1 AU 2003277778 A1 AU2003277778 A1 AU 2003277778A1 AU 2003277778 A AU2003277778 A AU 2003277778A AU 2003277778 A AU2003277778 A AU 2003277778A AU 2003277778 A1 AU2003277778 A1 AU 2003277778A1
Authority
AU
Australia
Prior art keywords
current
electronic component
manufacturing same
carrying electronic
carrying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003277778A
Other languages
English (en)
Other versions
AU2003277778A8 (en
Inventor
Lih-Tyng Hwang
Li Li
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of AU2003277778A8 publication Critical patent/AU2003277778A8/xx
Publication of AU2003277778A1 publication Critical patent/AU2003277778A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/216—Waveguides, e.g. strip lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
AU2003277778A 2002-09-26 2003-09-26 Current-carrying electronic component and method of manufacturing same Abandoned AU2003277778A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/256,789 US6841736B2 (en) 2002-09-26 2002-09-26 Current-carrying electronic component and method of manufacturing same
US10/256,789 2002-09-26
PCT/US2003/030253 WO2004032205A2 (en) 2002-09-26 2003-09-26 Current-carrying electronic component and method of manufacturing same

Publications (2)

Publication Number Publication Date
AU2003277778A8 AU2003277778A8 (en) 2004-04-23
AU2003277778A1 true AU2003277778A1 (en) 2004-04-23

Family

ID=32029358

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003277778A Abandoned AU2003277778A1 (en) 2002-09-26 2003-09-26 Current-carrying electronic component and method of manufacturing same

Country Status (7)

Country Link
US (1) US6841736B2 (https=)
JP (1) JP2006501682A (https=)
KR (1) KR20050065558A (https=)
CN (1) CN1307653C (https=)
AU (1) AU2003277778A1 (https=)
TW (1) TW200409147A (https=)
WO (1) WO2004032205A2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101322198B (zh) * 2006-04-28 2011-06-08 松下电工株式会社 高频电流用馈线
US8032089B2 (en) * 2006-12-30 2011-10-04 Broadcom Corporation Integrated circuit/printed circuit board substrate structure and communications
WO2011039602A1 (ja) * 2009-09-30 2011-04-07 パナソニック電工株式会社 高周波用給電線、高周波用給電線の製造方法及び給電線保持構造
CN104021865A (zh) * 2014-05-14 2014-09-03 北京联合大学 可降低交流电阻的圆形导体
CN104036857A (zh) * 2014-05-14 2014-09-10 北京联合大学 可降低交流电阻的矩形导体
CN104409622A (zh) * 2014-10-15 2015-03-11 中国计量学院 一种高频薄膜热电变换器的结构及制作方法
DE102016212666A1 (de) * 2016-07-12 2018-01-18 Schweizer Electronic Ag Verfahren zur Herstellung eines Leiterplattenelements und Leiterplattenelement

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3586757A (en) * 1969-08-14 1971-06-22 Merle Haldeman Jr Flexible stripline transmission line
US3634810A (en) * 1970-02-03 1972-01-11 Reynolds Metals Co Electrical bus bar construction and method of making same
DE3530032A1 (de) * 1985-08-22 1987-02-26 Reiner Mannertz Stromleitungskabel
US5393933A (en) * 1993-03-15 1995-02-28 Goertz; Ole S. Characteristic impedance corrected audio signal cable
US5527999A (en) 1995-02-21 1996-06-18 Delco Electronics Corp. Multilayer conductor for printed circuits
US5574260B1 (en) 1995-03-06 2000-01-18 Gore & Ass Composite conductor having improved high frequency signal transmission characteristics
US5674780A (en) 1995-07-24 1997-10-07 Motorola, Inc. Method of forming an electrically conductive polymer bump over an aluminum electrode
US5675298A (en) 1995-11-21 1997-10-07 Sun Microsystems, Inc. Low-loss, low-inductance interconnect for microcircuits
US6100178A (en) * 1997-02-28 2000-08-08 Ford Motor Company Three-dimensional electronic circuit with multiple conductor layers and method for manufacturing same
US5834995A (en) 1997-05-01 1998-11-10 The United States Of America As Represented By The Secretary Of The Air Force Cylindrical edge microstrip transmission line
US5922514A (en) 1997-09-17 1999-07-13 Dale Electronics, Inc. Thick film low value high frequency inductor, and method of making the same
DE69831549T2 (de) 1997-10-21 2006-06-14 Murata Manufacturing Co Dünnfilm-Mehrschichtelektrode, Hochfrequenzübertragungsleitung, Hochfrequenzresonator und Hochfrequenzfilter
GB9911307D0 (en) * 1999-05-14 1999-07-14 Mantock Paul L Low resistance surface conducting conductor electric cable
SE517916C2 (sv) * 1999-12-17 2002-08-06 Ericsson Telefon Ab L M Chipsbärare, system och förfarande vid tillverkning av chipsbärare

Also Published As

Publication number Publication date
JP2006501682A (ja) 2006-01-12
WO2004032205A2 (en) 2004-04-15
AU2003277778A8 (en) 2004-04-23
CN1307653C (zh) 2007-03-28
US6841736B2 (en) 2005-01-11
KR20050065558A (ko) 2005-06-29
WO2004032205A3 (en) 2004-07-01
TW200409147A (en) 2004-06-01
US20040060724A1 (en) 2004-04-01
CN1685450A (zh) 2005-10-19

Similar Documents

Publication Publication Date Title
AU2003292630A1 (en) Electronic device and method of manufacturing the same
AU2003219352A1 (en) Electronic device and method of manufacturing same
AU2003291351A1 (en) Semiconductor component and method of manufacture
AU2003278855A1 (en) Improved integrated circuit package and method of manufacturing the integrated circuit package
AU2003215837A1 (en) Method of manufacturing nanowires and electronic device
AU2003233500A1 (en) Semiconductor filter circuit and method
AU2003285638A1 (en) Electronic device and method of manufacturing same
GB2396332B (en) Slotted substrate and method of making
AU2003270887A8 (en) Advanced microelectronic connector assembly and method of manufacturing
AU2003214579A1 (en) Semiconductor device and method of manufacturing same
AU2002357222A1 (en) Wire bond-less electronic component for use with an external circuit and method of manufacture
AU2003277560A1 (en) Electronic device and its manufacturing method
AU2003265862A1 (en) Semiconductor component and method of manufacture
AU2001282884A1 (en) Electronic component and method of manufacture
AU2003214524A1 (en) Method of manufacturing an electronic device
AU2003286362A1 (en) Electronic device and method of manufacturing same
AU2002326737A1 (en) Electronic devices and methods of manufacture
TWI351081B (en) Electronic component and method of manufacturing same
TWI340443B (en) Semiconductor component and method of manufacturing same
AU2003291350A1 (en) Semiconductor component and method of manufacture
AU2003277778A1 (en) Current-carrying electronic component and method of manufacturing same
TWI348217B (en) Semiconductor component and method of manufacturing same
AU2003217142A1 (en) Integrated circuit device and method of manufacturing thereof
AU2003263504A1 (en) Fail-safe method and circuit
AU2003206031A1 (en) Method of manufacturing nanowires and an electronic device

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase