AU2003244945A1 - Tft electronic devices and their manufacture - Google Patents

Tft electronic devices and their manufacture

Info

Publication number
AU2003244945A1
AU2003244945A1 AU2003244945A AU2003244945A AU2003244945A1 AU 2003244945 A1 AU2003244945 A1 AU 2003244945A1 AU 2003244945 A AU2003244945 A AU 2003244945A AU 2003244945 A AU2003244945 A AU 2003244945A AU 2003244945 A1 AU2003244945 A1 AU 2003244945A1
Authority
AU
Australia
Prior art keywords
manufacture
electronic devices
tft electronic
tft
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003244945A
Other languages
English (en)
Inventor
Jeffrey A. Chapman
Ian D. French
Pieter J. Van Der Zaag
Nigel D. Young
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0215566A external-priority patent/GB0215566D0/en
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of AU2003244945A1 publication Critical patent/AU2003244945A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0312Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
    • H10D30/0316Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6704Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6706Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device for preventing leakage current 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6732Bottom-gate only TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743Silicon
    • H10D30/6745Polycrystalline or microcrystalline silicon
AU2003244945A 2002-07-05 2003-06-25 Tft electronic devices and their manufacture Abandoned AU2003244945A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
GB0215566.1 2002-07-05
GB0215566A GB0215566D0 (en) 2002-07-05 2002-07-05 Electronic devices and their manufacture
GB0309977.7 2003-05-01
GB0309977 2003-05-01
PCT/IB2003/002883 WO2004006339A1 (en) 2002-07-05 2003-06-25 Tft electronic devices and their manufacture

Publications (1)

Publication Number Publication Date
AU2003244945A1 true AU2003244945A1 (en) 2004-01-23

Family

ID=30117094

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003244945A Abandoned AU2003244945A1 (en) 2002-07-05 2003-06-25 Tft electronic devices and their manufacture

Country Status (7)

Country Link
US (1) US20060049428A1 (enExample)
EP (1) EP1522104A1 (enExample)
JP (1) JP2005532685A (enExample)
CN (1) CN1666347A (enExample)
AU (1) AU2003244945A1 (enExample)
TW (1) TW200408136A (enExample)
WO (1) WO2004006339A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100928490B1 (ko) * 2003-06-28 2009-11-26 엘지디스플레이 주식회사 액정표시패널 및 그 제조 방법
KR101043338B1 (ko) * 2004-04-19 2011-06-21 삼성전자주식회사 편광자, 이를 갖는 표시장치, 이의 제조방법 및 이의제조장비
KR100613170B1 (ko) * 2004-10-12 2006-08-17 삼성전자주식회사 매트릭스 스위치를 이용한 온도 측정 장치, 반도체 패키지및 냉각 시스템
TWI253759B (en) * 2004-11-22 2006-04-21 Au Optronics Corp Method and apparatus for forming thin film transistor
KR100864884B1 (ko) * 2006-12-28 2008-10-22 삼성에스디아이 주식회사 박막트랜지스터, 그의 제조방법 및 이를 구비한유기전계발광표시장치
KR101282897B1 (ko) * 2008-07-08 2013-07-05 엘지디스플레이 주식회사 폴리실리콘 박막트랜지스터 및 그 제조방법
CN102339835A (zh) * 2011-07-14 2012-02-01 友达光电股份有限公司 半导体组件及电致发光组件及其制作方法
TWI476935B (zh) * 2012-10-03 2015-03-11 Nat Applied Res Laboratories 薄膜電晶體製造方法
CN109326676B (zh) * 2017-07-31 2020-12-11 上海耕岩智能科技有限公司 一种光侦测薄膜、器件、显示装置、制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW241377B (enExample) * 1993-03-12 1995-02-21 Semiconductor Energy Res Co Ltd
CN1095204C (zh) * 1993-03-12 2002-11-27 株式会社半导体能源研究所 半导体器件和晶体管
JP3535465B2 (ja) * 1993-03-22 2004-06-07 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2762215B2 (ja) * 1993-08-12 1998-06-04 株式会社半導体エネルギー研究所 薄膜トランジスタおよび半導体装置の作製方法
JP2814049B2 (ja) * 1993-08-27 1998-10-22 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
JP3378078B2 (ja) * 1994-02-23 2003-02-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4130237B2 (ja) * 1995-01-28 2008-08-06 株式会社半導体エネルギー研究所 結晶性珪素膜の作製方法及び半導体装置の作製方法
JP3295346B2 (ja) * 1997-07-14 2002-06-24 株式会社半導体エネルギー研究所 結晶性珪素膜の作製方法及びそれを用いた薄膜トランジスタ
JPH11214699A (ja) * 1998-01-23 1999-08-06 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
US6346437B1 (en) * 1998-07-16 2002-02-12 Sharp Laboratories Of America, Inc. Single crystal TFT from continuous transition metal delivery method
JP3454467B2 (ja) * 1999-01-29 2003-10-06 シャープ株式会社 半導体装置およびその製造方法
KR100473997B1 (ko) * 2000-10-06 2005-03-07 엘지.필립스 엘시디 주식회사 박막 트랜지스터 제조방법
JP4678933B2 (ja) * 2000-11-07 2011-04-27 株式会社半導体エネルギー研究所 半導体装置の作製方法

Also Published As

Publication number Publication date
JP2005532685A (ja) 2005-10-27
CN1666347A (zh) 2005-09-07
EP1522104A1 (en) 2005-04-13
WO2004006339A1 (en) 2004-01-15
TW200408136A (en) 2004-05-16
US20060049428A1 (en) 2006-03-09

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase