AU2003224233A1 - Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers - Google Patents

Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers

Info

Publication number
AU2003224233A1
AU2003224233A1 AU2003224233A AU2003224233A AU2003224233A1 AU 2003224233 A1 AU2003224233 A1 AU 2003224233A1 AU 2003224233 A AU2003224233 A AU 2003224233A AU 2003224233 A AU2003224233 A AU 2003224233A AU 2003224233 A1 AU2003224233 A1 AU 2003224233A1
Authority
AU
Australia
Prior art keywords
copper
mechanical polishing
chemical mechanical
barrier layers
integrated chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003224233A
Other languages
English (en)
Inventor
Bulent Bason
Robin F. Browne
Homayoun Talieh
Tuan Truong
Yuchun Wang
Douglas Young
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM Nutool Inc
Original Assignee
ASM Nutool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/199,471 external-priority patent/US20040014399A1/en
Priority claimed from US10/346,425 external-priority patent/US6857947B2/en
Application filed by ASM Nutool Inc filed Critical ASM Nutool Inc
Publication of AU2003224233A1 publication Critical patent/AU2003224233A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU2003224233A 2002-03-13 2003-03-13 Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers Abandoned AU2003224233A1 (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US36500102P 2002-03-13 2002-03-13
US60/365,001 2002-03-13
US10/199,471 2002-07-19
US10/199,471 US20040014399A1 (en) 2002-07-19 2002-07-19 Selective barrier removal slurry
US41754402P 2002-10-10 2002-10-10
US60/417,544 2002-10-10
US10/346,425 US6857947B2 (en) 2002-01-17 2003-01-17 Advanced chemical mechanical polishing system with smart endpoint detection
US10/346,425 2003-01-17
PCT/GB2003/001066 WO2003079428A1 (en) 2002-03-13 2003-03-13 Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers

Publications (1)

Publication Number Publication Date
AU2003224233A1 true AU2003224233A1 (en) 2003-09-29

Family

ID=28046746

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003224233A Abandoned AU2003224233A1 (en) 2002-03-13 2003-03-13 Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers

Country Status (6)

Country Link
US (1) US20040023607A1 (de)
EP (1) EP1483785A1 (de)
CN (1) CN1653600A (de)
AU (1) AU2003224233A1 (de)
TW (1) TW200308007A (de)
WO (1) WO2003079428A1 (de)

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JP2005244123A (ja) * 2004-02-27 2005-09-08 Fujimi Inc 研磨用組成物
CN1731567B (zh) * 2005-06-22 2010-08-18 中国科学院上海微系统与信息技术研究所 集成电路铜互连一步化学机械抛光工艺及相应纳米抛光液
US8728934B2 (en) 2011-06-24 2014-05-20 Tessera, Inc. Systems and methods for producing flat surfaces in interconnect structures
CN103100968B (zh) * 2011-11-11 2015-11-25 中芯国际集成电路制造(上海)有限公司 化学机械研磨装置及使用该装置对硅片进行研磨的方法
CN103182676B (zh) * 2011-12-29 2015-10-14 中芯国际集成电路制造(上海)有限公司 研磨垫、使用该研磨垫的研磨装置及研磨方法
US10293462B2 (en) * 2013-07-23 2019-05-21 Taiwan Semiconductor Manufacturing Company, Ltd. Pad conditioner and method of reconditioning planarization pad
CN105817991A (zh) * 2015-01-06 2016-08-03 中芯国际集成电路制造(上海)有限公司 化学机械研磨方法
CN112338640B (zh) * 2020-09-28 2022-02-01 上海新昇半导体科技有限公司 化学机械抛光方法和装置
CN114952600B (zh) * 2022-07-11 2023-09-19 赛莱克斯微系统科技（北京）有限公司 高频传输微结构的平坦化方法、装置及电子设备

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US5593344A (en) * 1994-10-11 1997-01-14 Ontrak Systems, Inc. Wafer polishing machine with fluid bearings and drive systems
US6050884A (en) * 1996-02-28 2000-04-18 Ebara Corporation Polishing apparatus
US5916012A (en) * 1996-04-26 1999-06-29 Lam Research Corporation Control of chemical-mechanical polishing rate across a substrate surface for a linear polisher
US5762536A (en) * 1996-04-26 1998-06-09 Lam Research Corporation Sensors for a linear polisher
US6012970A (en) * 1997-01-15 2000-01-11 Motorola, Inc. Process for forming a semiconductor device
US7018282B1 (en) * 1997-03-27 2006-03-28 Koninklijke Philips Electronics N.V. Customized polishing pad for selective process performance during chemical mechanical polishing
US5855792A (en) * 1997-05-14 1999-01-05 Integrated Process Equipment Corp. Rinse water recycling method for semiconductor wafer processing equipment
US5756272A (en) * 1997-05-19 1998-05-26 Eastman Kodak Company Simultaneous coatings of stearamide lubricant layer and transparent magnetic recording layer for photographic element
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6001730A (en) * 1997-10-20 1999-12-14 Motorola, Inc. Chemical mechanical polishing (CMP) slurry for polishing copper interconnects which use tantalum-based barrier layers
KR100524054B1 (ko) * 1997-11-21 2005-10-26 가부시키가이샤 에바라 세이사꾸쇼 폴리싱 장치와 이에 사용되는 대상물 홀더 및 폴리싱 방법 및 웨이퍼제조방법
US6248000B1 (en) * 1998-03-24 2001-06-19 Nikon Research Corporation Of America Polishing pad thinning to optically access a semiconductor wafer surface
JP3701126B2 (ja) * 1998-09-01 2005-09-28 株式会社荏原製作所 基板の洗浄方法及び研磨装置
US6461226B1 (en) * 1998-11-25 2002-10-08 Promos Technologies, Inc. Chemical mechanical polishing of a metal layer using a composite polishing pad
US6103628A (en) * 1998-12-01 2000-08-15 Nutool, Inc. Reverse linear polisher with loadable housing
US6117779A (en) * 1998-12-15 2000-09-12 Lsi Logic Corporation Endpoint detection method and apparatus which utilize a chelating agent to detect a polishing endpoint
US6261158B1 (en) * 1998-12-16 2001-07-17 Speedfam-Ipec Multi-step chemical mechanical polishing
US6244935B1 (en) * 1999-02-04 2001-06-12 Applied Materials, Inc. Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet
US6241583B1 (en) * 1999-02-04 2001-06-05 Applied Materials, Inc. Chemical mechanical polishing with a plurality of polishing sheets
US6475070B1 (en) * 1999-02-04 2002-11-05 Applied Materials, Inc. Chemical mechanical polishing with a moving polishing sheet
EP1068928A3 (de) * 1999-02-11 2003-08-13 Applied Materials, Inc. Chemisch-mechanisches Polierverfahren und Bauelemente
US6099662A (en) * 1999-02-11 2000-08-08 Taiwan Semiconductor Manufacturing Company Process for cleaning a semiconductor substrate after chemical-mechanical polishing
US6135859A (en) * 1999-04-30 2000-10-24 Applied Materials, Inc. Chemical mechanical polishing with a polishing sheet and a support sheet
US6322427B1 (en) * 1999-04-30 2001-11-27 Applied Materials, Inc. Conditioning fixed abrasive articles
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Also Published As

Publication number Publication date
WO2003079428A1 (en) 2003-09-25
US20040023607A1 (en) 2004-02-05
EP1483785A1 (de) 2004-12-08
CN1653600A (zh) 2005-08-10
TW200308007A (en) 2003-12-16

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase