AU2003214781A1 - Improved method and apparatus for positioning integrated circuits on die pads - Google Patents

Improved method and apparatus for positioning integrated circuits on die pads

Info

Publication number
AU2003214781A1
AU2003214781A1 AU2003214781A AU2003214781A AU2003214781A1 AU 2003214781 A1 AU2003214781 A1 AU 2003214781A1 AU 2003214781 A AU2003214781 A AU 2003214781A AU 2003214781 A AU2003214781 A AU 2003214781A AU 2003214781 A1 AU2003214781 A1 AU 2003214781A1
Authority
AU
Australia
Prior art keywords
integrated circuits
improved method
die pads
positioning integrated
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003214781A
Other languages
English (en)
Inventor
Beng Keh See
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of AU2003214781A1 publication Critical patent/AU2003214781A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU2003214781A 2003-02-24 2003-02-24 Improved method and apparatus for positioning integrated circuits on die pads Abandoned AU2003214781A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2003/000039 WO2004077551A1 (fr) 2003-02-24 2003-02-24 Procede ameliore et appareil de positionnement de circuits integres sur des languettes de connexion

Publications (1)

Publication Number Publication Date
AU2003214781A1 true AU2003214781A1 (en) 2004-09-17

Family

ID=32923959

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003214781A Abandoned AU2003214781A1 (en) 2003-02-24 2003-02-24 Improved method and apparatus for positioning integrated circuits on die pads

Country Status (3)

Country Link
AU (1) AU2003214781A1 (fr)
DE (1) DE10394148T5 (fr)
WO (1) WO2004077551A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2877142B1 (fr) * 2004-10-21 2007-05-11 Commissariat Energie Atomique Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere.
WO2009056469A1 (fr) * 2007-10-31 2009-05-07 Oerlikon Assembly Equipment Ag, Steinhausen Aiguille à perforer une feuille pour en détacher un petit dé
TW202201592A (zh) * 2020-06-15 2022-01-01 賢昇科技股份有限公司 轉移設備及轉移工件的方法
TWI798595B (zh) * 2020-10-22 2023-04-11 均華精密工業股份有限公司 晶粒固晶裝置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3146634B2 (ja) * 1992-05-19 2001-03-19 ソニー株式会社 半導体装置のワイヤボンディング装置及び半導体装置の製造方法
TW281795B (fr) * 1994-11-30 1996-07-21 Sharp Kk
JPH09266219A (ja) * 1996-03-28 1997-10-07 Sony Corp 半導体装置の製造装置
TW587296B (en) * 1998-10-28 2004-05-11 Matsushita Electric Ind Co Ltd Working method and apparatus
US6204092B1 (en) * 1999-04-13 2001-03-20 Lucent Technologies, Inc. Apparatus and method for transferring semiconductor die to a carrier
DE10044418C2 (de) * 2000-09-08 2002-09-19 Siemens Ag Bestückelemente-Entnahmeeinrichtung und Verfahren zum Entnehmen von Bestückelementen aus einem Bestückelemente-Gurt

Also Published As

Publication number Publication date
DE10394148T5 (de) 2006-02-09
WO2004077551A1 (fr) 2004-09-10

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase