AU2003211706A1 - Photosensitive resins, resin compositions and products of curing thereof - Google Patents

Photosensitive resins, resin compositions and products of curing thereof

Info

Publication number
AU2003211706A1
AU2003211706A1 AU2003211706A AU2003211706A AU2003211706A1 AU 2003211706 A1 AU2003211706 A1 AU 2003211706A1 AU 2003211706 A AU2003211706 A AU 2003211706A AU 2003211706 A AU2003211706 A AU 2003211706A AU 2003211706 A1 AU2003211706 A1 AU 2003211706A1
Authority
AU
Australia
Prior art keywords
curing
products
resin compositions
photosensitive resins
photosensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003211706A
Inventor
Yoshihiro Kawada
Hiroo Koyanagi
Koji Nakayama
Chie Umeyama
Minoru Yokoshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Publication of AU2003211706A1 publication Critical patent/AU2003211706A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D167/06—Unsaturated polyesters having carbon-to-carbon unsaturation
    • C09D167/07—Unsaturated polyesters having carbon-to-carbon unsaturation having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/061—Polyesters; Polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/91—Polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/06—Unsaturated polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/06—Unsaturated polyesters
    • C08L67/07—Unsaturated polyesters having terminal carbon-to-carbon unsaturated bonds
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/66—Polyesters containing oxygen in the form of ether groups
    • C08G63/668—Polyesters containing oxygen in the form of ether groups derived from polycarboxylic acids and polyhydroxy compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/109—Polyester
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/117—Free radical
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/921—Polyester having terminal ethylenic unsaturation other than polyesterurethanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
AU2003211706A 2002-02-26 2003-02-25 Photosensitive resins, resin compositions and products of curing thereof Abandoned AU2003211706A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2002048865 2002-02-26
JP2002-48865 2002-02-26
JP2002299047 2002-10-11
JP2002-299047 2002-10-11
JP2002302101 2002-10-16
JP2002-302101 2002-10-16
PCT/JP2003/002081 WO2003072634A1 (en) 2002-02-26 2003-02-25 Photosensitive resins, resin compositions and products of curing thereof

Publications (1)

Publication Number Publication Date
AU2003211706A1 true AU2003211706A1 (en) 2003-09-09

Family

ID=27767750

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003211706A Abandoned AU2003211706A1 (en) 2002-02-26 2003-02-25 Photosensitive resins, resin compositions and products of curing thereof

Country Status (9)

Country Link
US (1) US7361450B2 (en)
JP (1) JP4262097B2 (en)
KR (1) KR100974053B1 (en)
CN (1) CN1272361C (en)
AU (1) AU2003211706A1 (en)
DE (1) DE10392612T5 (en)
GB (1) GB2405875B (en)
TW (1) TWI277626B (en)
WO (1) WO2003072634A1 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050005138A (en) * 2003-07-03 2005-01-13 장응순 Mobile phone
TWI276929B (en) 2003-12-16 2007-03-21 Showa Denko Kk Photosensitive composition remover
DE102004023071A1 (en) * 2004-05-11 2005-12-08 Basf Ag Pumpable Tricyclodecandimethylol containing composition
US20060199027A1 (en) * 2005-03-03 2006-09-07 Wojciech Wilczak Radiation curable adhesive composition
JP4770354B2 (en) * 2005-09-20 2011-09-14 日立化成工業株式会社 Photocurable resin composition and pattern forming method using the same
US7572561B2 (en) * 2006-02-22 2009-08-11 Xerox Corporation Imaging member
US8017193B1 (en) * 2008-08-06 2011-09-13 Hrl Laboratories, Llc Monomeric formulation for making polymer waveguides
US7796855B2 (en) * 2007-04-24 2010-09-14 Lixin Zheng Electro-optic polymer devices with semiconducting oligomer clads
JP2009083137A (en) * 2007-09-27 2009-04-23 Dainippon Printing Co Ltd Protective layer transfer sheet
KR100988271B1 (en) * 2007-09-19 2010-10-18 주식회사 엘지화학 photosensitive resin, methode for producing thereof, photosenssitive resin composition and cured product using the same
JP5459483B2 (en) * 2007-10-19 2014-04-02 日産化学工業株式会社 Polyester resin solution for thermosetting film formation
CN102076774B (en) * 2008-04-28 2014-07-09 日本瑞翁株式会社 Radiation-sensitive resin composition, laminate and method for producing the same, and semiconductor device
TWI411625B (en) * 2008-06-24 2013-10-11 Onstatic Technology Co Ltd Oligomers and thermosetting photosensitive resin compositions
KR101736902B1 (en) * 2009-03-31 2017-05-17 닛산 가가쿠 고교 가부시키 가이샤 Polyester composite for forming thermoset films
WO2010113944A1 (en) * 2009-03-31 2010-10-07 日産化学工業株式会社 Polyester composite for forming thermoset films
JP5626536B2 (en) * 2009-04-14 2014-11-19 日産化学工業株式会社 Photosensitive polyester composition for thermosetting film formation
JP5505726B2 (en) * 2009-10-28 2014-05-28 ナガセケムテックス株式会社 Composite resin composition
JP5471386B2 (en) * 2009-12-09 2014-04-16 東洋紡株式会社 Modified polyester resin, method for producing modified polyester resin, photocurable / thermosetting resin composition, photocurable / thermosetting layer, ink, adhesive, and printed circuit board
JP5862021B2 (en) * 2010-03-05 2016-02-16 株式会社リコー Actinic ray curable ink composition, actinic ray curable inkjet ink composition and printing method thereof
JP6160870B2 (en) * 2014-04-21 2017-07-12 荒川化学工業株式会社 Hydroxyl group-containing polymerizable copolymer, method for producing the same, active energy ray-curable resin composition, and cured product
KR102109539B1 (en) * 2014-05-12 2020-05-14 주식회사 와이더블유잉크 Modified epoxy resin curable by heat or photo, manufacturing method thereof and composition for solder resist of flexible substrate
JP6362272B2 (en) * 2015-03-13 2018-07-25 日本化薬株式会社 Carboxyl group-containing reactive compound, curable resin composition using the same, and use thereof.
KR101890899B1 (en) * 2015-10-21 2018-08-22 닛산 가가쿠 가부시키가이샤 Composition for optical waveguide formation
CN106814537B (en) * 2015-11-30 2020-02-21 乐凯华光印刷科技有限公司 Photosensitive imaging composition containing cyclohexane amide monofunctional acrylate copolymer
CN105601900A (en) * 2016-01-29 2016-05-25 深圳市容大感光科技股份有限公司 Polyester-type alkaline-water-soluble photocuring resin and preparation method thereof, and photoinduced imaging agent
WO2017209289A1 (en) * 2016-06-02 2017-12-07 三菱ケミカル株式会社 Polyester resin for toners, method for producing same, toner and method for producing toner

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5239432B2 (en) * 1972-09-29 1977-10-05
JPH044142A (en) * 1990-04-20 1992-01-08 Teijin Ltd Antistatic polyester film
JP3063903B2 (en) 1998-03-20 2000-07-12 日本電信電話株式会社 Optical waveguide
JP2001051415A (en) * 1999-08-09 2001-02-23 Nippon Kayaku Co Ltd Resin composition, soldering resist resin composition and their cured bodies
JP2002138140A (en) * 2000-11-02 2002-05-14 Nippon Kayaku Co Ltd Polyester resin and photosensitive resin composition using the same
JP2003002958A (en) * 2001-06-26 2003-01-08 Nippon Kayaku Co Ltd Polyester soluble in alkaline aqueous solution and photosensitive resin composition and cured product thereof using the same

Also Published As

Publication number Publication date
TWI277626B (en) 2007-04-01
JPWO2003072634A1 (en) 2005-06-23
GB2405875A (en) 2005-03-16
US7361450B2 (en) 2008-04-22
WO2003072634A1 (en) 2003-09-04
JP4262097B2 (en) 2009-05-13
KR100974053B1 (en) 2010-08-04
CN1272361C (en) 2006-08-30
GB0421211D0 (en) 2004-10-27
DE10392612T5 (en) 2005-06-30
CN1639227A (en) 2005-07-13
GB2405875B (en) 2005-09-14
TW200307702A (en) 2003-12-16
KR20040086430A (en) 2004-10-08
US20050153230A1 (en) 2005-07-14

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase