AU2002353021A1 - Chemical vapor deposition reactor - Google Patents
Chemical vapor deposition reactorInfo
- Publication number
- AU2002353021A1 AU2002353021A1 AU2002353021A AU2002353021A AU2002353021A1 AU 2002353021 A1 AU2002353021 A1 AU 2002353021A1 AU 2002353021 A AU2002353021 A AU 2002353021A AU 2002353021 A AU2002353021 A AU 2002353021A AU 2002353021 A1 AU2002353021 A1 AU 2002353021A1
- Authority
- AU
- Australia
- Prior art keywords
- vapor deposition
- chemical vapor
- deposition reactor
- reactor
- chemical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005229 chemical vapour deposition Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45502—Flow conditions in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US33763901P | 2001-12-04 | 2001-12-04 | |
| US60/337,639 | 2001-12-04 | ||
| US10/214,272 US20020195055A1 (en) | 2000-10-16 | 2002-08-06 | Vortex based CVD reactor |
| US10/214,272 | 2002-08-06 | ||
| PCT/US2002/038565 WO2003048414A1 (en) | 2001-12-04 | 2002-12-04 | Chemical vapor deposition reactor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2002353021A1 true AU2002353021A1 (en) | 2003-06-17 |
Family
ID=26908840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2002353021A Abandoned AU2002353021A1 (en) | 2001-12-04 | 2002-12-04 | Chemical vapor deposition reactor |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1451387A1 (enExample) |
| JP (1) | JP2005511895A (enExample) |
| AU (1) | AU2002353021A1 (enExample) |
| WO (1) | WO2003048414A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011055061A1 (de) * | 2011-11-04 | 2013-05-08 | Aixtron Se | CVD-Reaktor bzw. Substrathalter für einen CVD-Reaktor |
| US8985152B2 (en) * | 2012-06-15 | 2015-03-24 | Novellus Systems, Inc. | Point of use valve manifold for semiconductor fabrication equipment |
| TWI502096B (zh) * | 2013-06-17 | 2015-10-01 | Ind Tech Res Inst | 用於化學氣相沉積的反應裝置及反應製程 |
| CN103456593B (zh) * | 2013-09-02 | 2016-02-10 | 东莞市中镓半导体科技有限公司 | 一种改进多片式外延材料厚度分布均匀性的氢化物气相沉积装置与方法 |
| JP6478103B2 (ja) * | 2015-01-29 | 2019-03-06 | 株式会社Flosfia | 成膜装置および成膜方法 |
| CA2974387A1 (en) * | 2016-08-30 | 2018-02-28 | Rolls-Royce Corporation | Swirled flow chemical vapor deposition |
| WO2023140824A2 (en) * | 2022-01-24 | 2023-07-27 | Tobb Ekonomi Ve Teknoloji Universitesi | A reactor |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5375857A (en) * | 1976-12-17 | 1978-07-05 | Nec Corp | Vapor phase growth apparatus |
| JPS54111771A (en) * | 1978-02-22 | 1979-09-01 | Toshiba Corp | Gas phase reaction unit of semiconductor substrate |
| JPS6134933A (ja) * | 1984-07-26 | 1986-02-19 | Fujitsu Ltd | プラズマ気相成長装置 |
| US4596208A (en) * | 1984-11-05 | 1986-06-24 | Spire Corporation | CVD reaction chamber |
| US5134963A (en) * | 1991-10-28 | 1992-08-04 | International Business Machines Corporation | LPCVD reactor for high efficiency, high uniformity deposition |
-
2002
- 2002-12-04 WO PCT/US2002/038565 patent/WO2003048414A1/en not_active Ceased
- 2002-12-04 AU AU2002353021A patent/AU2002353021A1/en not_active Abandoned
- 2002-12-04 EP EP02789987A patent/EP1451387A1/en not_active Withdrawn
- 2002-12-04 JP JP2003549589A patent/JP2005511895A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005511895A (ja) | 2005-04-28 |
| EP1451387A1 (en) | 2004-09-01 |
| WO2003048414A1 (en) | 2003-06-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |