AU2002236430A1 - Atomic layer doping apparatus and method - Google Patents
Atomic layer doping apparatus and methodInfo
- Publication number
- AU2002236430A1 AU2002236430A1 AU2002236430A AU3643002A AU2002236430A1 AU 2002236430 A1 AU2002236430 A1 AU 2002236430A1 AU 2002236430 A AU2002236430 A AU 2002236430A AU 3643002 A AU3643002 A AU 3643002A AU 2002236430 A1 AU2002236430 A1 AU 2002236430A1
- Authority
- AU
- Australia
- Prior art keywords
- doping
- doping regions
- atomic layer
- doping apparatus
- regions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000758 substrate Substances 0.000 abstract 3
- 239000002019 doping agent Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000002356 single layer Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67213—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
An improved atomic layer doping apparatus is disclosed as having multiple doping regions in which individual monolayer species are first deposited and then dopant atoms contained therein are diffused into the substrate. Each doping region is chemically separated from adjacent doping regions. A loading assembly is programmed to follow pre-defined transfer sequences for moving semiconductor substrates into and out of the respective adjacent doping regions. According to the number of doping regions provided, a plurality of substrates could be simultaneously processed and run through the cycle of doping regions until a desired doping profile is obtained.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/653,553 | 2000-08-31 | ||
US09/653,553 US6541353B1 (en) | 2000-08-31 | 2000-08-31 | Atomic layer doping apparatus and method |
PCT/US2001/026079 WO2002038841A2 (en) | 2000-08-31 | 2001-08-22 | Atomic layer doping apparatus and method |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002236430A1 true AU2002236430A1 (en) | 2002-05-21 |
Family
ID=24621343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002236430A Abandoned AU2002236430A1 (en) | 2000-08-31 | 2001-08-22 | Atomic layer doping apparatus and method |
Country Status (9)
Country | Link |
---|---|
US (3) | US6541353B1 (en) |
EP (1) | EP1335998B1 (en) |
JP (1) | JP2004513525A (en) |
KR (1) | KR100564977B1 (en) |
CN (1) | CN1267589C (en) |
AT (1) | ATE282101T1 (en) |
AU (1) | AU2002236430A1 (en) |
DE (1) | DE60107111T2 (en) |
WO (1) | WO2002038841A2 (en) |
Families Citing this family (89)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7554829B2 (en) * | 1999-07-30 | 2009-06-30 | Micron Technology, Inc. | Transmission lines for CMOS integrated circuits |
US20020195056A1 (en) * | 2000-05-12 | 2002-12-26 | Gurtej Sandhu | Versatile atomic layer deposition apparatus |
DE10101014A1 (en) * | 2001-01-05 | 2002-07-11 | Zeiss Carl | Coating of optical elements, especially for use with ultraviolet light |
MXPA03008564A (en) * | 2001-02-23 | 2012-06-12 | Gates Corp | Process for directly bonding rubber to at least a second substrate, and the resulting article. |
US6852167B2 (en) * | 2001-03-01 | 2005-02-08 | Micron Technology, Inc. | Methods, systems, and apparatus for uniform chemical-vapor depositions |
US6953730B2 (en) * | 2001-12-20 | 2005-10-11 | Micron Technology, Inc. | Low-temperature grown high quality ultra-thin CoTiO3 gate dielectrics |
US6893984B2 (en) * | 2002-02-20 | 2005-05-17 | Micron Technology Inc. | Evaporated LaA1O3 films for gate dielectrics |
US6800172B2 (en) * | 2002-02-22 | 2004-10-05 | Micron Technology, Inc. | Interfacial structure for semiconductor substrate processing chambers and substrate transfer chambers and for semiconductor substrate processing chambers and accessory attachments, and semiconductor substrate processor |
DE10208450B4 (en) * | 2002-02-27 | 2004-09-16 | Infineon Technologies Ag | Process for the deposition of thin layers by means of ALD / CVD processes in connection with fast thermal processes |
US6962644B2 (en) * | 2002-03-18 | 2005-11-08 | Applied Materials, Inc. | Tandem etch chamber plasma processing system |
US6932871B2 (en) * | 2002-04-16 | 2005-08-23 | Applied Materials, Inc. | Multi-station deposition apparatus and method |
US6858264B2 (en) * | 2002-04-24 | 2005-02-22 | Micron Technology, Inc. | Chemical vapor deposition methods |
US6814813B2 (en) | 2002-04-24 | 2004-11-09 | Micron Technology, Inc. | Chemical vapor deposition apparatus |
US7160577B2 (en) | 2002-05-02 | 2007-01-09 | Micron Technology, Inc. | Methods for atomic-layer deposition of aluminum oxides in integrated circuits |
US6896730B2 (en) * | 2002-06-05 | 2005-05-24 | Micron Technology, Inc. | Atomic layer deposition apparatus and methods |
US7887711B2 (en) * | 2002-06-13 | 2011-02-15 | International Business Machines Corporation | Method for etching chemically inert metal oxides |
US7221586B2 (en) | 2002-07-08 | 2007-05-22 | Micron Technology, Inc. | Memory utilizing oxide nanolaminates |
US6921702B2 (en) * | 2002-07-30 | 2005-07-26 | Micron Technology Inc. | Atomic layer deposited nanolaminates of HfO2/ZrO2 films as gate dielectrics |
US20040058293A1 (en) * | 2002-08-06 | 2004-03-25 | Tue Nguyen | Assembly line processing system |
US7153542B2 (en) * | 2002-08-06 | 2006-12-26 | Tegal Corporation | Assembly line processing method |
US6790791B2 (en) * | 2002-08-15 | 2004-09-14 | Micron Technology, Inc. | Lanthanide doped TiOx dielectric films |
US6884739B2 (en) * | 2002-08-15 | 2005-04-26 | Micron Technology Inc. | Lanthanide doped TiOx dielectric films by plasma oxidation |
US7084078B2 (en) * | 2002-08-29 | 2006-08-01 | Micron Technology, Inc. | Atomic layer deposited lanthanide doped TiOx dielectric films |
US6916374B2 (en) * | 2002-10-08 | 2005-07-12 | Micron Technology, Inc. | Atomic layer deposition methods and atomic layer deposition tools |
US6958302B2 (en) | 2002-12-04 | 2005-10-25 | Micron Technology, Inc. | Atomic layer deposited Zr-Sn-Ti-O films using TiI4 |
US7101813B2 (en) * | 2002-12-04 | 2006-09-05 | Micron Technology Inc. | Atomic layer deposited Zr-Sn-Ti-O films |
US6926775B2 (en) * | 2003-02-11 | 2005-08-09 | Micron Technology, Inc. | Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces |
US7192892B2 (en) * | 2003-03-04 | 2007-03-20 | Micron Technology, Inc. | Atomic layer deposited dielectric layers |
US6972055B2 (en) * | 2003-03-28 | 2005-12-06 | Finens Corporation | Continuous flow deposition system |
US7135369B2 (en) | 2003-03-31 | 2006-11-14 | Micron Technology, Inc. | Atomic layer deposited ZrAlxOy dielectric layers including Zr4AlO9 |
US6970053B2 (en) * | 2003-05-22 | 2005-11-29 | Micron Technology, Inc. | Atomic layer deposition (ALD) high permeability layered magnetic films to reduce noise in high speed interconnection |
US7192824B2 (en) * | 2003-06-24 | 2007-03-20 | Micron Technology, Inc. | Lanthanide oxide / hafnium oxide dielectric layers |
US7220665B2 (en) * | 2003-08-05 | 2007-05-22 | Micron Technology, Inc. | H2 plasma treatment |
DE10339991A1 (en) * | 2003-08-29 | 2005-03-31 | Advanced Micro Devices, Inc., Sunnyvale | Improved technique for adjusting a penetration depth during the implantation of ions into a semiconductor region |
US7282239B2 (en) * | 2003-09-18 | 2007-10-16 | Micron Technology, Inc. | Systems and methods for depositing material onto microfeature workpieces in reaction chambers |
US7647886B2 (en) * | 2003-10-15 | 2010-01-19 | Micron Technology, Inc. | Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers |
US7258892B2 (en) | 2003-12-10 | 2007-08-21 | Micron Technology, Inc. | Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition |
US7906393B2 (en) | 2004-01-28 | 2011-03-15 | Micron Technology, Inc. | Methods for forming small-scale capacitor structures |
US8133554B2 (en) | 2004-05-06 | 2012-03-13 | Micron Technology, Inc. | Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces |
US7699932B2 (en) | 2004-06-02 | 2010-04-20 | Micron Technology, Inc. | Reactors, systems and methods for depositing thin films onto microfeature workpieces |
JP5032986B2 (en) * | 2004-06-24 | 2012-09-26 | ベネク・オサケユキテュア | Method for doping materials and doped materials |
US7601649B2 (en) | 2004-08-02 | 2009-10-13 | Micron Technology, Inc. | Zirconium-doped tantalum oxide films |
US7368368B2 (en) * | 2004-08-18 | 2008-05-06 | Cree, Inc. | Multi-chamber MOCVD growth apparatus for high performance/high throughput |
US7081421B2 (en) | 2004-08-26 | 2006-07-25 | Micron Technology, Inc. | Lanthanide oxide dielectric layer |
US7494939B2 (en) | 2004-08-31 | 2009-02-24 | Micron Technology, Inc. | Methods for forming a lanthanum-metal oxide dielectric layer |
US7588988B2 (en) | 2004-08-31 | 2009-09-15 | Micron Technology, Inc. | Method of forming apparatus having oxide films formed using atomic layer deposition |
US20060137609A1 (en) * | 2004-09-13 | 2006-06-29 | Puchacz Jerzy P | Multi-single wafer processing apparatus |
US20060125030A1 (en) * | 2004-12-13 | 2006-06-15 | Micron Technology, Inc. | Hybrid ALD-CVD of PrxOy/ZrO2 films as gate dielectrics |
KR100579860B1 (en) * | 2004-12-23 | 2006-05-12 | 동부일렉트로닉스 주식회사 | Method for forming p type polysilicon using ald and iii group heavy metal |
US7560395B2 (en) | 2005-01-05 | 2009-07-14 | Micron Technology, Inc. | Atomic layer deposited hafnium tantalum oxide dielectrics |
US7508648B2 (en) | 2005-02-08 | 2009-03-24 | Micron Technology, Inc. | Atomic layer deposition of Dy doped HfO2 films as gate dielectrics |
US7374964B2 (en) * | 2005-02-10 | 2008-05-20 | Micron Technology, Inc. | Atomic layer deposition of CeO2/Al2O3 films as gate dielectrics |
US7399666B2 (en) * | 2005-02-15 | 2008-07-15 | Micron Technology, Inc. | Atomic layer deposition of Zr3N4/ZrO2 films as gate dielectrics |
US7687409B2 (en) | 2005-03-29 | 2010-03-30 | Micron Technology, Inc. | Atomic layer deposited titanium silicon oxide films |
EP1865537A1 (en) * | 2005-03-30 | 2007-12-12 | Matsushita Electric Industrial Co., Ltd. | Impurity introduction apparatus and method of impurity introduction |
US7544398B1 (en) * | 2005-04-26 | 2009-06-09 | The Regents Of The Univesity Of California | Controlled nano-doping of ultra thin films |
US20060237138A1 (en) * | 2005-04-26 | 2006-10-26 | Micron Technology, Inc. | Apparatuses and methods for supporting microelectronic devices during plasma-based fabrication processes |
US7662729B2 (en) | 2005-04-28 | 2010-02-16 | Micron Technology, Inc. | Atomic layer deposition of a ruthenium layer to a lanthanide oxide dielectric layer |
KR100760428B1 (en) * | 2005-05-13 | 2007-09-20 | 오재응 | Vapor Deposition Reactor |
US7927948B2 (en) | 2005-07-20 | 2011-04-19 | Micron Technology, Inc. | Devices with nanocrystals and methods of formation |
US7393736B2 (en) * | 2005-08-29 | 2008-07-01 | Micron Technology, Inc. | Atomic layer deposition of Zrx Hfy Sn1-x-y O2 films as high k gate dielectrics |
US20070065576A1 (en) * | 2005-09-09 | 2007-03-22 | Vikram Singh | Technique for atomic layer deposition |
US20070087581A1 (en) * | 2005-09-09 | 2007-04-19 | Varian Semiconductor Equipment Associates, Inc. | Technique for atomic layer deposition |
CN1937175B (en) * | 2005-09-20 | 2012-10-03 | 中芯国际集成电路制造(上海)有限公司 | Method for depositing material atomic layer for semiconductor device by using atmosphere |
US20070151842A1 (en) * | 2005-12-15 | 2007-07-05 | Fluens Corporation | Apparatus for reactive sputtering |
US7709402B2 (en) | 2006-02-16 | 2010-05-04 | Micron Technology, Inc. | Conductive layers for hafnium silicon oxynitride films |
US20070212859A1 (en) | 2006-03-08 | 2007-09-13 | Paul Carey | Method of thermal processing structures formed on a substrate |
US7605030B2 (en) | 2006-08-31 | 2009-10-20 | Micron Technology, Inc. | Hafnium tantalum oxynitride high-k dielectric and metal gates |
KR101447184B1 (en) * | 2006-11-10 | 2014-10-08 | 엘아이지에이디피 주식회사 | Process chamber having apparatus for opening and closing gate slit |
US20080194072A1 (en) * | 2007-02-12 | 2008-08-14 | Chen-Hua Yu | Polysilicon gate formation by in-situ doping |
US7892909B2 (en) * | 2007-02-12 | 2011-02-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polysilicon gate formation by in-situ doping |
US7759237B2 (en) * | 2007-06-28 | 2010-07-20 | Micron Technology, Inc. | Method of forming lutetium and lanthanum dielectric structures |
US20090081356A1 (en) | 2007-09-26 | 2009-03-26 | Fedorovskaya Elena A | Process for forming thin film encapsulation layers |
TWI471961B (en) * | 2007-10-26 | 2015-02-01 | Sosul Co Ltd | Baffle, substrate supporting apparatus and plasma processing apparatus and plasma processing method |
US8361895B2 (en) * | 2008-09-16 | 2013-01-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Ultra-shallow junctions using atomic-layer doping |
US7790535B2 (en) * | 2008-09-16 | 2010-09-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Depletion-free MOS using atomic-layer doping |
JP2010153278A (en) * | 2008-12-26 | 2010-07-08 | Hitachi High-Technologies Corp | Charged particle beam processing device |
JP5295095B2 (en) * | 2008-12-29 | 2013-09-18 | ケー.シー.テック カンパニー リミテッド | Atomic layer deposition equipment |
FI122940B (en) * | 2009-02-09 | 2012-09-14 | Beneq Oy | reaction chamber |
US20100221426A1 (en) * | 2009-03-02 | 2010-09-02 | Fluens Corporation | Web Substrate Deposition System |
US8828835B2 (en) * | 2009-03-06 | 2014-09-09 | Texas Instruments Incorporated | Ultrashallow emitter formation using ALD and high temperature short time annealing |
US8828138B2 (en) | 2010-05-17 | 2014-09-09 | International Business Machines Corporation | FET nanopore sensor |
US8518829B2 (en) | 2011-04-22 | 2013-08-27 | International Business Machines Corporation | Self-sealed fluidic channels for nanopore array |
US20140065799A1 (en) * | 2012-09-03 | 2014-03-06 | Intermolecular, Inc. | Methods and Systems for Low Resistance Contact Formation |
US20140199854A1 (en) * | 2013-01-16 | 2014-07-17 | United Microelectronics Corp. | Method of forming film on different surfaces |
US8940646B1 (en) * | 2013-07-12 | 2015-01-27 | Lam Research Corporation | Sequential precursor dosing in an ALD multi-station/batch reactor |
US20160002784A1 (en) * | 2014-07-07 | 2016-01-07 | Varian Semiconductor Equipment Associates, Inc. | Method and apparatus for depositing a monolayer on a three dimensional structure |
KR102477302B1 (en) * | 2015-10-05 | 2022-12-13 | 주성엔지니어링(주) | Substrate treatment apparatus having exhaust gas cracker and exhaust gas treatment method of the same |
KR102622159B1 (en) * | 2021-07-14 | 2024-01-09 | 한국생산기술연구원 | atomic layer deposition chamber |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4089735A (en) * | 1968-06-05 | 1978-05-16 | Siemens Aktiengesellschaft | Method for epitactic precipitation of crystalline material from a gaseous phase, particularly for semiconductors |
DE1758751A1 (en) * | 1968-08-01 | 1971-02-25 | Telefunken Patent | Oven for the diffusion of interference points in semiconductor bodies |
US3602192A (en) * | 1969-05-19 | 1971-08-31 | Ibm | Semiconductor wafer processing |
US3618919A (en) * | 1969-11-03 | 1971-11-09 | Btu Eng Corp | Adjustable heat and gas barrier |
US3811826A (en) * | 1972-11-03 | 1974-05-21 | Sowell J | Diffusion furnace process tube |
JPS6055478B2 (en) | 1982-10-19 | 1985-12-05 | 松下電器産業株式会社 | Vapor phase growth method |
US4593644A (en) * | 1983-10-26 | 1986-06-10 | Rca Corporation | Continuous in-line deposition system |
US4576830A (en) * | 1984-11-05 | 1986-03-18 | Chronar Corp. | Deposition of materials |
US5298452A (en) * | 1986-09-12 | 1994-03-29 | International Business Machines Corporation | Method and apparatus for low temperature, low pressure chemical vapor deposition of epitaxial silicon layers |
US4951601A (en) * | 1986-12-19 | 1990-08-28 | Applied Materials, Inc. | Multi-chamber integrated process system |
US4786616A (en) * | 1987-06-12 | 1988-11-22 | American Telephone And Telegraph Company | Method for heteroepitaxial growth using multiple MBE chambers |
JPH01278714A (en) * | 1988-04-30 | 1989-11-09 | Sharp Corp | Atomic layer planar doping method |
US5013683A (en) * | 1989-01-23 | 1991-05-07 | The Regents Of The University Of California | Method for growing tilted superlattices |
JPH0824191B2 (en) * | 1989-03-17 | 1996-03-06 | 富士通株式会社 | Thin film transistor |
AU5977190A (en) | 1989-07-27 | 1991-01-31 | Nishizawa, Junichi | Impurity doping method with adsorbed diffusion source |
US5071670A (en) * | 1990-06-11 | 1991-12-10 | Kelly Michael A | Method for chemical vapor deposition under a single reactor vessel divided into separate reaction chambers each with its own depositing and exhausting means |
US5225366A (en) | 1990-06-22 | 1993-07-06 | The United States Of America As Represented By The Secretary Of The Navy | Apparatus for and a method of growing thin films of elemental semiconductors |
DE59010916D1 (en) | 1990-12-21 | 2000-11-30 | Siemens Ag | Process for the production of a smooth polycrystalline silicon layer doped with arsenic for highly integrated circuits |
JPH0812847B2 (en) * | 1991-04-22 | 1996-02-07 | 株式会社半導体プロセス研究所 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
JP3049894B2 (en) * | 1991-11-27 | 2000-06-05 | 日本ゼオン株式会社 | Acrylic ester copolymer plastisol composition |
JPH0964336A (en) | 1995-08-25 | 1997-03-07 | Advantest Corp | Ohmic electrode structure of semiconductor and its forming method by atomic layer doping |
US5667592A (en) * | 1996-04-16 | 1997-09-16 | Gasonics International | Process chamber sleeve with ring seals for isolating individual process modules in a common cluster |
US5792700A (en) * | 1996-05-31 | 1998-08-11 | Micron Technology, Inc. | Semiconductor processing method for providing large grain polysilicon films |
US5747113A (en) * | 1996-07-29 | 1998-05-05 | Tsai; Charles Su-Chang | Method of chemical vapor deposition for producing layer variation by planetary susceptor rotation |
US5916365A (en) * | 1996-08-16 | 1999-06-29 | Sherman; Arthur | Sequential chemical vapor deposition |
JP3239779B2 (en) * | 1996-10-29 | 2001-12-17 | 日新電機株式会社 | Substrate processing apparatus and substrate processing method |
ES2159084T3 (en) * | 1997-01-07 | 2001-09-16 | Siegfried Dr Stramke | DEVICE FOR THE SURFACE TREATMENT BY PLASMA OF WORK PIECES. |
US6174377B1 (en) * | 1997-03-03 | 2001-01-16 | Genus, Inc. | Processing chamber for atomic layer deposition processes |
GB2343550A (en) * | 1997-07-29 | 2000-05-10 | Silicon Genesis Corp | Cluster tool method and apparatus using plasma immersion ion implantation |
US6143082A (en) * | 1998-10-08 | 2000-11-07 | Novellus Systems, Inc. | Isolation of incompatible processes in a multi-station processing chamber |
US6305314B1 (en) * | 1999-03-11 | 2001-10-23 | Genvs, Inc. | Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition |
US6503330B1 (en) * | 1999-12-22 | 2003-01-07 | Genus, Inc. | Apparatus and method to achieve continuous interface and ultrathin film during atomic layer deposition |
US6576062B2 (en) * | 2000-01-06 | 2003-06-10 | Tokyo Electron Limited | Film forming apparatus and film forming method |
US6527866B1 (en) * | 2000-02-09 | 2003-03-04 | Conductus, Inc. | Apparatus and method for deposition of thin films |
US20020195056A1 (en) * | 2000-05-12 | 2002-12-26 | Gurtej Sandhu | Versatile atomic layer deposition apparatus |
US6482733B2 (en) * | 2000-05-15 | 2002-11-19 | Asm Microchemistry Oy | Protective layers prior to alternating layer deposition |
US20030054133A1 (en) * | 2000-08-07 | 2003-03-20 | Wadley Hadyn N.G. | Apparatus and method for intra-layer modulation of the material deposition and assist beam and the multilayer structure produced therefrom |
-
2000
- 2000-08-31 US US09/653,553 patent/US6541353B1/en not_active Expired - Lifetime
-
2001
- 2001-08-22 CN CNB018166695A patent/CN1267589C/en not_active Expired - Fee Related
- 2001-08-22 KR KR1020037003141A patent/KR100564977B1/en not_active IP Right Cessation
- 2001-08-22 DE DE60107111T patent/DE60107111T2/en not_active Expired - Lifetime
- 2001-08-22 AT AT01985952T patent/ATE282101T1/en not_active IP Right Cessation
- 2001-08-22 JP JP2002541151A patent/JP2004513525A/en active Pending
- 2001-08-22 AU AU2002236430A patent/AU2002236430A1/en not_active Abandoned
- 2001-08-22 EP EP01985952A patent/EP1335998B1/en not_active Expired - Lifetime
- 2001-08-22 WO PCT/US2001/026079 patent/WO2002038841A2/en active IP Right Grant
- 2001-10-22 US US09/982,954 patent/US20020046705A1/en not_active Abandoned
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2002
- 2002-11-22 US US10/301,573 patent/US6746934B2/en not_active Expired - Lifetime
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US20030073318A1 (en) | 2003-04-17 |
WO2002038841A2 (en) | 2002-05-16 |
US20020046705A1 (en) | 2002-04-25 |
DE60107111D1 (en) | 2004-12-16 |
DE60107111T2 (en) | 2005-10-20 |
KR100564977B1 (en) | 2006-03-28 |
US6541353B1 (en) | 2003-04-01 |
KR20030064395A (en) | 2003-07-31 |
EP1335998A2 (en) | 2003-08-20 |
CN1267589C (en) | 2006-08-02 |
JP2004513525A (en) | 2004-04-30 |
US6746934B2 (en) | 2004-06-08 |
CN1468329A (en) | 2004-01-14 |
EP1335998B1 (en) | 2004-11-10 |
WO2002038841A3 (en) | 2003-05-01 |
ATE282101T1 (en) | 2004-11-15 |
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