AU2002220163A1 - Electromagnetic shielding and cooling device for printed circuit board - Google Patents
Electromagnetic shielding and cooling device for printed circuit boardInfo
- Publication number
- AU2002220163A1 AU2002220163A1 AU2002220163A AU2016302A AU2002220163A1 AU 2002220163 A1 AU2002220163 A1 AU 2002220163A1 AU 2002220163 A AU2002220163 A AU 2002220163A AU 2016302 A AU2016302 A AU 2016302A AU 2002220163 A1 AU2002220163 A1 AU 2002220163A1
- Authority
- AU
- Australia
- Prior art keywords
- circuit board
- printed circuit
- cooling device
- electromagnetic shielding
- shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US24820300P | 2000-11-15 | 2000-11-15 | |
US60/248,203 | 2000-11-15 | ||
PCT/US2001/046122 WO2002041679A2 (fr) | 2000-11-15 | 2001-11-15 | Dispositif de blindage electromagnetique et de refroidissement pour carte a circuit imprime |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002220163A1 true AU2002220163A1 (en) | 2002-05-27 |
Family
ID=22938123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002220163A Abandoned AU2002220163A1 (en) | 2000-11-15 | 2001-11-15 | Electromagnetic shielding and cooling device for printed circuit board |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2002220163A1 (fr) |
WO (1) | WO2002041679A2 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030067757A1 (en) * | 2001-10-05 | 2003-04-10 | Richardson Patrick J. | Apparatus and method for shielding a device |
JP2003298283A (ja) * | 2002-03-28 | 2003-10-17 | Seiko Epson Corp | 電磁波シールド部材、記録装置 |
TWI404957B (zh) * | 2010-11-16 | 2013-08-11 | Univ Lunghwa Sci & Technology | 具電磁干擾防護功能之模組化電路測試板 |
TWI488155B (zh) * | 2013-09-30 | 2015-06-11 | 唐明中 | 一種電路建構輔助裝置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5357404A (en) * | 1991-11-18 | 1994-10-18 | The Whitaker Corporation | EMI shield, and assembly using same |
SE9302243L (sv) * | 1993-06-29 | 1994-12-30 | Ericsson Telefon Ab L M | Anordning för skärmning och kylning av elektronikkomponent |
DE9404266U1 (de) * | 1994-03-14 | 1994-05-19 | Siemens Nixdorf Inf Syst | Kühl- und Abschirmvorrichtung für eine integrierte Schaltung |
SE9401203L (sv) * | 1994-04-11 | 1995-10-12 | Ellemtel Utvecklings Ab | Skärm och kylare |
-
2001
- 2001-11-15 AU AU2002220163A patent/AU2002220163A1/en not_active Abandoned
- 2001-11-15 WO PCT/US2001/046122 patent/WO2002041679A2/fr not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO2002041679A3 (fr) | 2002-08-29 |
WO2002041679A2 (fr) | 2002-05-23 |
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