AU2002219826A1 - Liquid cooled heat exchanger with enhanced flow - Google Patents

Liquid cooled heat exchanger with enhanced flow

Info

Publication number
AU2002219826A1
AU2002219826A1 AU2002219826A AU1982602A AU2002219826A1 AU 2002219826 A1 AU2002219826 A1 AU 2002219826A1 AU 2002219826 A AU2002219826 A AU 2002219826A AU 1982602 A AU1982602 A AU 1982602A AU 2002219826 A1 AU2002219826 A1 AU 2002219826A1
Authority
AU
Australia
Prior art keywords
heat exchanger
cooled heat
liquid cooled
enhanced flow
enhanced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002219826A
Inventor
Douglas P. Calaman
Mathew J. Connors
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermal Corp
Original Assignee
Thermal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermal Corp filed Critical Thermal Corp
Publication of AU2002219826A1 publication Critical patent/AU2002219826A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU2002219826A 2000-11-21 2001-11-16 Liquid cooled heat exchanger with enhanced flow Abandoned AU2002219826A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/717,860 US6578626B1 (en) 2000-11-21 2000-11-21 Liquid cooled heat exchanger with enhanced flow
US09717860 2000-11-21
US09/717,860 2000-11-21
PCT/US2001/043757 WO2002042703A2 (en) 2000-11-21 2001-11-16 Liquid cooled heat exchanger with enhanced flow

Publications (1)

Publication Number Publication Date
AU2002219826A1 true AU2002219826A1 (en) 2002-06-03

Family

ID=24883783

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002219826A Abandoned AU2002219826A1 (en) 2000-11-21 2001-11-16 Liquid cooled heat exchanger with enhanced flow

Country Status (3)

Country Link
US (2) US6578626B1 (en)
AU (1) AU2002219826A1 (en)
WO (1) WO2002042703A2 (en)

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WO2002042703A2 (en) 2002-05-30
US6578626B1 (en) 2003-06-17
US20020185260A1 (en) 2002-12-12
WO2002042703A3 (en) 2002-07-18

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