AU2002211645A1 - Surface mount connector lead - Google Patents

Surface mount connector lead

Info

Publication number
AU2002211645A1
AU2002211645A1 AU2002211645A AU1164502A AU2002211645A1 AU 2002211645 A1 AU2002211645 A1 AU 2002211645A1 AU 2002211645 A AU2002211645 A AU 2002211645A AU 1164502 A AU1164502 A AU 1164502A AU 2002211645 A1 AU2002211645 A1 AU 2002211645A1
Authority
AU
Australia
Prior art keywords
joint thickness
lead
enhanced joint
surface mount
mount connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002211645A
Other languages
English (en)
Inventor
Terrance Dishongh
Prateek Dujari
Bin Lian
Damion Searls
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of AU2002211645A1 publication Critical patent/AU2002211645A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/707—Soldering or welding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Lead Frames For Integrated Circuits (AREA)
AU2002211645A 2000-10-27 2001-10-12 Surface mount connector lead Abandoned AU2002211645A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/698,898 US6774310B1 (en) 2000-10-27 2000-10-27 Surface mount connector lead
US09/698,898 2000-10-27
PCT/US2001/031815 WO2002035655A2 (en) 2000-10-27 2001-10-12 Surface mount connector lead

Publications (1)

Publication Number Publication Date
AU2002211645A1 true AU2002211645A1 (en) 2002-05-06

Family

ID=24807111

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002211645A Abandoned AU2002211645A1 (en) 2000-10-27 2001-10-12 Surface mount connector lead

Country Status (13)

Country Link
US (1) US6774310B1 (zh)
EP (1) EP1329002B1 (zh)
JP (1) JP4037754B2 (zh)
KR (1) KR100507907B1 (zh)
CN (1) CN1248365C (zh)
AT (1) ATE403956T1 (zh)
AU (1) AU2002211645A1 (zh)
DE (2) DE10196822B4 (zh)
GB (1) GB2384921B (zh)
HK (1) HK1054841A1 (zh)
MY (1) MY125005A (zh)
TW (1) TW538563B (zh)
WO (1) WO2002035655A2 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6988900B1 (en) 2004-12-17 2006-01-24 Scinetific-Atlanta, Inc. Surface mount connector assembly
JP4877455B2 (ja) * 2005-03-28 2012-02-15 ミツミ電機株式会社 二次電池保護モジュールおよびリード実装方法
US7059867B1 (en) 2005-03-30 2006-06-13 Artesyn Technologies, Inc. High density multi-lead surface mount interconnect and devices including same
JP4556135B2 (ja) * 2005-08-22 2010-10-06 住友電装株式会社 基板用コネクタ
TW200952294A (en) * 2008-06-06 2009-12-16 Asustek Comp Inc Connector
US8913034B2 (en) * 2009-05-25 2014-12-16 Pixart Imaging Inc. Connector of connecting light sensor and substrate and method of fabricating light sensor
JP2010272844A (ja) * 2009-05-25 2010-12-02 Pixart Imaging Inc 光センサと基板とを接続するコネクタ及び光センサの製造方法
JP5528050B2 (ja) * 2009-10-14 2014-06-25 矢崎総業株式会社 コネクタ固定金具、コネクタ及びコネクタの製造方法
DK3576491T3 (da) * 2011-05-10 2023-11-20 Saint Gobain Rude med elektrisk forbindelseselement
AU2012252671B2 (en) 2011-05-10 2015-05-14 Saint-Gobain Glass France Disk having an electric connecting element
EP2635097B1 (en) * 2012-02-28 2021-07-07 Electrolux Home Products Corporation N.V. An electric and/or electronic circuit including a printed circuit board, a separate circuit board and a power connector
JP6741456B2 (ja) * 2016-03-31 2020-08-19 Fdk株式会社 多層回路基板
TWI719790B (zh) * 2019-12-31 2021-02-21 技嘉科技股份有限公司 電源供應裝置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4537461A (en) * 1982-07-28 1985-08-27 At&T Technologies, Inc. Lead having a solder-preform and preform-carrying finger engageable directly with a contact pad
US4873615A (en) * 1986-10-09 1989-10-10 Amp Incorporated Semiconductor chip carrier system
US4737115A (en) * 1986-12-19 1988-04-12 North American Specialties Corp. Solderable lead
DE4028105C1 (en) * 1990-09-05 1991-12-12 Leopold Kostal Gmbh & Co Kg, 5880 Luedenscheid, De Coupling plate shaped modules and PCB(s) - establishing electrical contact by row of contacts stamped and bowed out from metal strip
JP2529849Y2 (ja) 1990-12-25 1997-03-19 ヒロセ電機株式会社 表面実装用コネクタの補強金具構造
JPH10275662A (ja) 1997-03-26 1998-10-13 Whitaker Corp:The １対の基板間の電気的接続方法、電気的接続構造、電気コネクタ及び電子回路モジュール
US5910885A (en) 1997-12-03 1999-06-08 White Electronic Designs Corporation Electronic stack module
US5940277A (en) * 1997-12-31 1999-08-17 Micron Technology, Inc. Semiconductor device including combed bond pad opening, assemblies and methods
US5962922A (en) * 1998-03-18 1999-10-05 Wang; Bily Cavity grid array integrated circuit package
FR2778274B1 (fr) 1998-04-29 2000-06-30 Framatome Connectors France Procede et dispositif de positionnement et de verrouillage pour connecteur d'entree/sortie et connecteur comportant un tel dispositif
TW388572U (en) * 1998-12-22 2000-04-21 Hon Hai Prec Ind Co Ltd Electrical connector
TW415680U (en) 1999-01-12 2000-12-11 Hon Hai Prec Ind Co Ltd Electric connector
US6217348B1 (en) * 1999-08-09 2001-04-17 Hon Hai Precision Ind. Co., Ltd. Electrical connector
DE19962120A1 (de) * 1999-12-21 2001-06-28 Mannesmann Vdo Ag Steckeraufnahme

Also Published As

Publication number Publication date
MY125005A (en) 2006-07-31
DE10196822B4 (de) 2007-08-30
KR20040007408A (ko) 2004-01-24
US6774310B1 (en) 2004-08-10
GB0310705D0 (en) 2003-06-11
GB2384921B (en) 2004-07-21
TW538563B (en) 2003-06-21
GB2384921A (en) 2003-08-06
WO2002035655A3 (en) 2002-08-29
DE10196822T5 (de) 2004-05-06
DE60135241D1 (de) 2008-09-18
KR100507907B1 (ko) 2005-08-17
ATE403956T1 (de) 2008-08-15
EP1329002A2 (en) 2003-07-23
JP4037754B2 (ja) 2008-01-23
JP2004512657A (ja) 2004-04-22
CN1248365C (zh) 2006-03-29
WO2002035655A2 (en) 2002-05-02
EP1329002B1 (en) 2008-08-06
HK1054841A1 (en) 2003-12-12
CN1484878A (zh) 2004-03-24

Similar Documents

Publication Publication Date Title
TW200503126A (en) Method for the packaging of electronic components
AU2002211645A1 (en) Surface mount connector lead
TW200629662A (en) Electronic device package and electronic equipment
DK1090538T3 (da) Overflademonteringsteknologikompatibelt EMI-mellemlæg og en fremgangsmåde til at montere et EMI-mellemlæg på et jordplan
TW200618685A (en) Compressible films surrounding solder connectors
TW200618233A (en) Connecting substrate, connecting structure, connection method and electronic apparatus
EP1523229A3 (en) Assembly of an electronic component with spring packaging
EP1635457A3 (en) Electronic component, circuit board, electronic apparatus, and method for manufacturing the electronic component
TW200721421A (en) Semiconductor structure and method of assembly
TW200617491A (en) Electro-optical device and electronic apparatus
EP1675171A3 (en) Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument
EP1387403A3 (en) Semiconductor packaging
WO2004038798A3 (en) Stacked electronic structures including offset substrates
WO2005112113A3 (en) Mounting with auxiliary bumps
EP1496733A3 (en) Electronic package having controlled height stand-off solder joint
EP2048109A3 (en) Electronic device, electronic module, and methods for manufacturing the same
TW200721418A (en) Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronlc device
EP1065751A3 (en) Mounting electronic components on circuit boards
MY131124A (en) Wire bond-less electronic component for use with an external circuit and method of manufacture
TW474513U (en) Electrical connector, socket for connecting electrical component to substrate, and electrical device
TW200515552A (en) Substrate having bond pads for bonding redundant solder beads
TW200631242A (en) Connector equipped with thermosetting adhesive film and connection method using the same
WO2008052045A3 (en) Ceramic header method and system
EP1303006A3 (en) Circuit board-to-board interconnection device
DE60204896D1 (de) Buchse zur horizontalen befestigung einer komponente