AU2001291177A1 - Semiconductor stacked die devices and methods of forming semiconductor stacked die devices - Google Patents

Semiconductor stacked die devices and methods of forming semiconductor stacked die devices

Info

Publication number
AU2001291177A1
AU2001291177A1 AU2001291177A AU9117701A AU2001291177A1 AU 2001291177 A1 AU2001291177 A1 AU 2001291177A1 AU 2001291177 A AU2001291177 A AU 2001291177A AU 9117701 A AU9117701 A AU 9117701A AU 2001291177 A1 AU2001291177 A1 AU 2001291177A1
Authority
AU
Australia
Prior art keywords
semiconductor stacked
stacked die
die devices
methods
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001291177A
Inventor
Belgacem Haba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rambus Inc
Original Assignee
Rambus Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rambus Inc filed Critical Rambus Inc
Publication of AU2001291177A1 publication Critical patent/AU2001291177A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06572—Auxiliary carrier between devices, the carrier having an electrical connection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06582—Housing for the assembly, e.g. chip scale package [CSP]
    • H01L2225/06586—Housing with external bump or bump-like connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU2001291177A 2000-10-03 2001-09-19 Semiconductor stacked die devices and methods of forming semiconductor stacked die devices Abandoned AU2001291177A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/679,143 US6674161B1 (en) 2000-10-03 2000-10-03 Semiconductor stacked die devices
US09/679,143 2000-10-03
PCT/US2001/029578 WO2002029890A2 (en) 2000-10-03 2001-09-19 Semiconductor stacked die devices and methods of forming semiconductor stacked die devices

Publications (1)

Publication Number Publication Date
AU2001291177A1 true AU2001291177A1 (en) 2002-04-15

Family

ID=24725738

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001291177A Abandoned AU2001291177A1 (en) 2000-10-03 2001-09-19 Semiconductor stacked die devices and methods of forming semiconductor stacked die devices

Country Status (3)

Country Link
US (3) US6674161B1 (en)
AU (1) AU2001291177A1 (en)
WO (1) WO2002029890A2 (en)

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US6674161B1 (en) * 2000-10-03 2004-01-06 Rambus Inc. Semiconductor stacked die devices
JP2002184934A (en) * 2000-12-13 2002-06-28 Shinko Electric Ind Co Ltd Semiconductor device and manufacturing method thereof
US7777321B2 (en) * 2002-04-22 2010-08-17 Gann Keith D Stacked microelectronic layer and module with three-axis channel T-connects
US6806559B2 (en) * 2002-04-22 2004-10-19 Irvine Sensors Corporation Method and apparatus for connecting vertically stacked integrated circuit chips
US6936913B2 (en) * 2002-12-11 2005-08-30 Northrop Grumman Corporation High performance vias for vertical IC packaging
US7244671B2 (en) * 2003-07-25 2007-07-17 Unitive International Limited Methods of forming conductive structures including titanium-tungsten base layers and related structures
US20070109756A1 (en) * 2005-02-10 2007-05-17 Stats Chippac Ltd. Stacked integrated circuits package system
US7907420B2 (en) * 2005-03-09 2011-03-15 Panasonic Corporation Bare chip mounted structure and mounting method
US7829989B2 (en) * 2005-09-07 2010-11-09 Alpha & Omega Semiconductor, Ltd. Vertical packaged IC device modules with interconnected 3D laminates directly contacts wafer backside
US8093717B2 (en) * 2005-12-09 2012-01-10 Intel Corporation Microstrip spacer for stacked chip scale packages, methods of making same, methods of operating same, and systems containing same
US7781877B2 (en) 2007-08-07 2010-08-24 Micron Technology, Inc. Packaged integrated circuit devices with through-body conductive vias, and methods of making same
US8017451B2 (en) 2008-04-04 2011-09-13 The Charles Stark Draper Laboratory, Inc. Electronic modules and methods for forming the same
US8273603B2 (en) 2008-04-04 2012-09-25 The Charles Stark Draper Laboratory, Inc. Interposers, electronic modules, and methods for forming the same
DE102008018982A1 (en) 2008-04-14 2009-11-05 Merz, Hartmut, Prof. Dr. med. Automatic device for carrying out detection reactions and method for dispensing reagents on microscope slides
US7821107B2 (en) * 2008-04-22 2010-10-26 Micron Technology, Inc. Die stacking with an annular via having a recessed socket
US20110034045A1 (en) * 2009-08-06 2011-02-10 Qimonda Ag Stacking Technique for Circuit Devices
US9398700B2 (en) * 2013-06-21 2016-07-19 Invensas Corporation Method of forming a reliable microelectronic assembly

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US4394712A (en) * 1981-03-18 1983-07-19 General Electric Company Alignment-enhancing feed-through conductors for stackable silicon-on-sapphire wafers
US4954875A (en) * 1986-07-17 1990-09-04 Laser Dynamics, Inc. Semiconductor wafer array with electrically conductive compliant material
US5229647A (en) * 1991-03-27 1993-07-20 Micron Technology, Inc. High density data storage using stacked wafers
US5270261A (en) * 1991-09-13 1993-12-14 International Business Machines Corporation Three dimensional multichip package methods of fabrication
US5397916A (en) 1991-12-10 1995-03-14 Normington; Peter J. C. Semiconductor device including stacked die
WO1993023873A1 (en) * 1992-05-15 1993-11-25 Irvine Sensors Corporation Non-conductive end layer for integrated stack of ic chips
US5291061A (en) 1993-04-06 1994-03-01 Micron Semiconductor, Inc. Multi-chip stacked devices
US5434745A (en) 1994-07-26 1995-07-18 White Microelectronics Div. Of Bowmar Instrument Corp. Stacked silicon die carrier assembly
DE4433845A1 (en) * 1994-09-22 1996-03-28 Fraunhofer Ges Forschung Method of manufacturing a three-dimensional integrated circuit
US5682062A (en) * 1995-06-05 1997-10-28 Harris Corporation System for interconnecting stacked integrated circuits
US5691248A (en) * 1995-07-26 1997-11-25 International Business Machines Corporation Methods for precise definition of integrated circuit chip edges
US5874781A (en) 1995-08-16 1999-02-23 Micron Technology, Inc. Angularly offset stacked die multichip device and method of manufacture
US5973396A (en) * 1996-02-16 1999-10-26 Micron Technology, Inc. Surface mount IC using silicon vias in an area array format or same size as die array
EP2270846A3 (en) * 1996-10-29 2011-12-21 ALLVIA, Inc. Integrated circuits and methods for their fabrication
US5864177A (en) 1996-12-12 1999-01-26 Honeywell Inc. Bypass capacitors for chip and wire circuit assembly
US5869895A (en) * 1997-12-15 1999-02-09 Micron Technology, Inc. Embedded memory assembly
US6104082A (en) * 1998-04-24 2000-08-15 International Business Machines Corporation Metallization structure for altering connections
JP3563604B2 (en) * 1998-07-29 2004-09-08 株式会社東芝 Multi-chip semiconductor device and memory card
US6109929A (en) * 1998-07-29 2000-08-29 Agilent Technologies, Inc. High speed stackable memory system and device
US6381141B2 (en) * 1998-10-15 2002-04-30 Micron Technology, Inc. Integrated device and method for routing a signal through the device
US6093938A (en) 1999-05-25 2000-07-25 Intel Corporation Stacked die integrated circuit device
KR100333388B1 (en) * 1999-06-29 2002-04-18 박종섭 chip size stack package and method of fabricating the same
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US6350633B1 (en) * 2000-08-22 2002-02-26 Charles W. C. Lin Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint
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US6674161B1 (en) * 2000-10-03 2004-01-06 Rambus Inc. Semiconductor stacked die devices

Also Published As

Publication number Publication date
WO2002029890A3 (en) 2003-08-07
WO2002029890A2 (en) 2002-04-11
US6902953B2 (en) 2005-06-07
US6674161B1 (en) 2004-01-06
US20040097010A1 (en) 2004-05-20
US7078790B2 (en) 2006-07-18
US20050202592A1 (en) 2005-09-15

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