AU2001279126A1 - In-situ method and apparatus for end point detection in chemical mechanical polishing - Google Patents

In-situ method and apparatus for end point detection in chemical mechanical polishing

Info

Publication number
AU2001279126A1
AU2001279126A1 AU2001279126A AU7912601A AU2001279126A1 AU 2001279126 A1 AU2001279126 A1 AU 2001279126A1 AU 2001279126 A AU2001279126 A AU 2001279126A AU 7912601 A AU7912601 A AU 7912601A AU 2001279126 A1 AU2001279126 A1 AU 2001279126A1
Authority
AU
Australia
Prior art keywords
end point
mechanical polishing
chemical mechanical
point detection
situ method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001279126A
Other languages
English (en)
Inventor
Jamie Nam
Hilario L. Oh
Nannaji Saka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML US Inc
Original Assignee
ASML US Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/628,471 external-priority patent/US6476921B1/en
Application filed by ASML US Inc filed Critical ASML US Inc
Publication of AU2001279126A1 publication Critical patent/AU2001279126A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU2001279126A 2000-07-31 2001-07-31 In-situ method and apparatus for end point detection in chemical mechanical polishing Abandoned AU2001279126A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09628471 2000-07-31
US09/628,471 US6476921B1 (en) 2000-07-31 2000-07-31 In-situ method and apparatus for end point detection in chemical mechanical polishing
US25893100P 2000-12-29 2000-12-29
US60258931 2000-12-29
PCT/US2001/024146 WO2002010729A1 (en) 2000-07-31 2001-07-31 In-situ method and apparatus for end point detection in chemical mechanical polishing

Publications (1)

Publication Number Publication Date
AU2001279126A1 true AU2001279126A1 (en) 2002-02-13

Family

ID=26946968

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001279126A Abandoned AU2001279126A1 (en) 2000-07-31 2001-07-31 In-situ method and apparatus for end point detection in chemical mechanical polishing

Country Status (9)

Country Link
US (1) US6798529B2 (zh)
EP (1) EP1322940A4 (zh)
JP (1) JP2004514273A (zh)
KR (1) KR20030025281A (zh)
CN (1) CN1466676A (zh)
AU (1) AU2001279126A1 (zh)
MY (1) MY128145A (zh)
TW (1) TW491753B (zh)
WO (1) WO2002010729A1 (zh)

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Also Published As

Publication number Publication date
MY128145A (en) 2007-01-31
EP1322940A1 (en) 2003-07-02
JP2004514273A (ja) 2004-05-13
KR20030025281A (ko) 2003-03-28
US6798529B2 (en) 2004-09-28
CN1466676A (zh) 2004-01-07
WO2002010729A1 (en) 2002-02-07
EP1322940A4 (en) 2006-03-15
US20030045100A1 (en) 2003-03-06
TW491753B (en) 2002-06-21

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