AU2001259566A1 - Method and apparatus for end-point detection - Google Patents

Method and apparatus for end-point detection

Info

Publication number
AU2001259566A1
AU2001259566A1 AU2001259566A AU5956601A AU2001259566A1 AU 2001259566 A1 AU2001259566 A1 AU 2001259566A1 AU 2001259566 A AU2001259566 A AU 2001259566A AU 5956601 A AU5956601 A AU 5956601A AU 2001259566 A1 AU2001259566 A1 AU 2001259566A1
Authority
AU
Australia
Prior art keywords
point detection
detection
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001259566A
Inventor
Hui Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ACM Research Inc
Original Assignee
ACM Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ACM Research Inc filed Critical ACM Research Inc
Publication of AU2001259566A1 publication Critical patent/AU2001259566A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/16—Polishing
    • C25F3/22—Polishing of heavy metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/7684—Smoothing; Planarisation
AU2001259566A 2000-05-12 2001-05-03 Method and apparatus for end-point detection Abandoned AU2001259566A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09570566 2000-05-12
US09/570,566 US6447668B1 (en) 1998-07-09 2000-05-12 Methods and apparatus for end-point detection
PCT/US2001/014652 WO2001088229A1 (en) 2000-05-12 2001-05-03 Method and apparatus for end-point detection

Publications (1)

Publication Number Publication Date
AU2001259566A1 true AU2001259566A1 (en) 2001-11-26

Family

ID=24280146

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001259566A Abandoned AU2001259566A1 (en) 2000-05-12 2001-05-03 Method and apparatus for end-point detection

Country Status (6)

Country Link
US (1) US6447668B1 (en)
EP (1) EP1290249A4 (en)
AU (1) AU2001259566A1 (en)
CA (1) CA2409755A1 (en)
TW (1) TW494049B (en)
WO (1) WO2001088229A1 (en)

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US6756307B1 (en) * 1999-10-05 2004-06-29 Novellus Systems, Inc. Apparatus for electrically planarizing semiconductor wafers
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US6848970B2 (en) 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US7678245B2 (en) 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US6991526B2 (en) * 2002-09-16 2006-01-31 Applied Materials, Inc. Control of removal profile in electrochemically assisted CMP
US6537144B1 (en) 2000-02-17 2003-03-25 Applied Materials, Inc. Method and apparatus for enhanced CMP using metals having reductive properties
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US6962524B2 (en) 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6428673B1 (en) * 2000-07-08 2002-08-06 Semitool, Inc. Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology
US6747734B1 (en) * 2000-07-08 2004-06-08 Semitool, Inc. Apparatus and method for processing a microelectronic workpiece using metrology
JP2002093761A (en) * 2000-09-19 2002-03-29 Sony Corp Polishing method, polishing system, plating method and plating system
US6591160B2 (en) * 2000-12-04 2003-07-08 Asyst Technologies, Inc. Self teaching robot
US7160432B2 (en) * 2001-03-14 2007-01-09 Applied Materials, Inc. Method and composition for polishing a substrate
US6899804B2 (en) * 2001-12-21 2005-05-31 Applied Materials, Inc. Electrolyte composition and treatment for electrolytic chemical mechanical polishing
TW584899B (en) * 2001-07-20 2004-04-21 Nutool Inc Planar metal electroprocessing
US6881664B2 (en) * 2001-08-28 2005-04-19 Lsi Logic Corporation Process for planarizing upper surface of damascene wiring structure for integrated circuit structures
US6720263B2 (en) * 2001-10-16 2004-04-13 Applied Materials Inc. Planarization of metal layers on a semiconductor wafer through non-contact de-plating and control with endpoint detection
US20030072639A1 (en) * 2001-10-17 2003-04-17 Applied Materials, Inc. Substrate support
WO2003042433A1 (en) * 2001-11-13 2003-05-22 Acm Research, Inc. Electropolishing assembly and methods for electropolishing conductive layers
US6770565B2 (en) 2002-01-08 2004-08-03 Applied Materials Inc. System for planarizing metal conductive layers
US6621099B2 (en) * 2002-01-11 2003-09-16 Xerox Corporation Polythiophenes and devices thereof
US6837983B2 (en) * 2002-01-22 2005-01-04 Applied Materials, Inc. Endpoint detection for electro chemical mechanical polishing and electropolishing processes
US6848975B2 (en) 2002-04-09 2005-02-01 Rensselaer Polytechnic Institute Electrochemical planarization of metal feature surfaces
AU2003243506A1 (en) * 2002-06-12 2003-12-31 Faraday Technology, Inc. Electrolytic etching of metal layers
TW200409223A (en) * 2002-07-22 2004-06-01 Acm Res Inc Adaptive electropolishing using thickness measurements and removal of barrier and sacrificial layers
US7799200B1 (en) 2002-07-29 2010-09-21 Novellus Systems, Inc. Selective electrochemical accelerator removal
US6783657B2 (en) * 2002-08-29 2004-08-31 Micron Technology, Inc. Systems and methods for the electrolytic removal of metals from substrates
US20040040863A1 (en) * 2002-08-29 2004-03-04 Micron Technology, Inc. Systems for electrolytic removal of metals from substrates
US7112270B2 (en) * 2002-09-16 2006-09-26 Applied Materials, Inc. Algorithm for real-time process control of electro-polishing
US20050061674A1 (en) * 2002-09-16 2005-03-24 Yan Wang Endpoint compensation in electroprocessing
US7842169B2 (en) 2003-03-04 2010-11-30 Applied Materials, Inc. Method and apparatus for local polishing control
US6821899B2 (en) 2003-03-14 2004-11-23 Lam Research Corporation System, method and apparatus for improved local dual-damascene planarization
US6939796B2 (en) 2003-03-14 2005-09-06 Lam Research Corporation System, method and apparatus for improved global dual-damascene planarization
US6930782B1 (en) 2003-03-28 2005-08-16 Lam Research Corporation End point detection with imaging matching in semiconductor processing
US20040235297A1 (en) * 2003-05-23 2004-11-25 Bih-Tiao Lin Reverse electroplating for damascene conductive region formation
US8530359B2 (en) 2003-10-20 2013-09-10 Novellus Systems, Inc. Modulated metal removal using localized wet etching
US8158532B2 (en) * 2003-10-20 2012-04-17 Novellus Systems, Inc. Topography reduction and control by selective accelerator removal
WO2005055283A2 (en) * 2003-11-26 2005-06-16 Acm Research, Inc. Monitoring an electropolishing process in integrated circuit fabrication
US7186164B2 (en) * 2003-12-03 2007-03-06 Applied Materials, Inc. Processing pad assembly with zone control
US20070131561A1 (en) * 2003-12-17 2007-06-14 Acm Research, Inc. Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication
US20050145506A1 (en) * 2003-12-29 2005-07-07 Taylor E. J. Electrochemical etching of circuitry for high density interconnect electronic modules
US20060207888A1 (en) * 2003-12-29 2006-09-21 Taylor E J Electrochemical etching of circuitry for high density interconnect electronic modules
TWI354316B (en) * 2004-02-23 2011-12-11 Acm Res Inc Controlling removal rate uniformity of an electrop
US20050218009A1 (en) * 2004-04-02 2005-10-06 Jinshan Huo Electrochemical planarization system and method of electrochemical planarization
US20050247673A1 (en) * 2004-05-07 2005-11-10 International Business Machines Corporation Confinement of fluids on surfaces
US7655565B2 (en) * 2005-01-26 2010-02-02 Applied Materials, Inc. Electroprocessing profile control
US20110094895A1 (en) * 2005-05-20 2011-04-28 Stephen Mazur Optical detection of planarization, breakthrough and end-point in membrane-mediated electropolishing of metal layers
US20070181441A1 (en) * 2005-10-14 2007-08-09 Applied Materials, Inc. Method and apparatus for electropolishing
US7938927B2 (en) * 2006-03-01 2011-05-10 Camfil Ab Method of making a filter assembly
US7422982B2 (en) * 2006-07-07 2008-09-09 Applied Materials, Inc. Method and apparatus for electroprocessing a substrate with edge profile control
US8168540B1 (en) 2009-12-29 2012-05-01 Novellus Systems, Inc. Methods and apparatus for depositing copper on tungsten
JP6128941B2 (en) * 2013-05-10 2017-05-17 ルネサスエレクトロニクス株式会社 Semiconductor device manufacturing method and semiconductor manufacturing apparatus
CN104894634A (en) * 2014-03-03 2015-09-09 盛美半导体设备（上海）有限公司 Novel electrochemical polishing device
CN111632779B (en) * 2020-05-21 2023-03-24 国网宁夏电力有限公司检修公司 Conductive liquid spraying device for high-voltage isolating switch

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Also Published As

Publication number Publication date
US6447668B1 (en) 2002-09-10
EP1290249A4 (en) 2006-09-13
CA2409755A1 (en) 2001-11-22
WO2001088229A1 (en) 2001-11-22
TW494049B (en) 2002-07-11
EP1290249A1 (en) 2003-03-12

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