AU2001267913A1 - Operation monitoring method for treatment apparatus - Google Patents
Operation monitoring method for treatment apparatusInfo
- Publication number
- AU2001267913A1 AU2001267913A1 AU2001267913A AU6791301A AU2001267913A1 AU 2001267913 A1 AU2001267913 A1 AU 2001267913A1 AU 2001267913 A AU2001267913 A AU 2001267913A AU 6791301 A AU6791301 A AU 6791301A AU 2001267913 A1 AU2001267913 A1 AU 2001267913A1
- Authority
- AU
- Australia
- Prior art keywords
- treatment apparatus
- monitoring method
- operation monitoring
- treatment
- monitoring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title 1
- 238000012544 monitoring process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000201731A JP4610021B2 (ja) | 2000-07-04 | 2000-07-04 | 処理装置の運転方法及び処理装置の異常検出方法 |
JP2000-201731 | 2000-07-04 | ||
JP2000-201729 | 2000-07-04 | ||
JP2000201729A JP4570736B2 (ja) | 2000-07-04 | 2000-07-04 | 運転状態の監視方法 |
PCT/JP2001/005758 WO2002003441A1 (fr) | 2000-07-04 | 2001-07-03 | Procede de surveillance de fonctionnement pour appareil de traitement |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001267913A1 true AU2001267913A1 (en) | 2002-01-14 |
Family
ID=26595307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001267913A Abandoned AU2001267913A1 (en) | 2000-07-04 | 2001-07-03 | Operation monitoring method for treatment apparatus |
Country Status (5)
Country | Link |
---|---|
US (1) | US7054786B2 (zh) |
CN (1) | CN1197130C (zh) |
AU (1) | AU2001267913A1 (zh) |
TW (1) | TW499702B (zh) |
WO (1) | WO2002003441A1 (zh) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2003235901A1 (en) * | 2002-05-16 | 2003-12-02 | Tokyo Electron Limited | Method of predicting processing device condition or processed result |
US7505879B2 (en) | 2002-06-05 | 2009-03-17 | Tokyo Electron Limited | Method for generating multivariate analysis model expression for processing apparatus, method for executing multivariate analysis of processing apparatus, control device of processing apparatus and control system for processing apparatus |
KR100628392B1 (ko) * | 2002-06-05 | 2006-09-26 | 동경 엘렉트론 주식회사 | 처리 장치의 다변량 해석 모델식 작성 방법, 처리장치용의 다변량 해석 방법, 처리 장치의 제어 장치, 처리장치의 제어 시스템 |
JP2004047885A (ja) * | 2002-07-15 | 2004-02-12 | Matsushita Electric Ind Co Ltd | 半導体製造装置のモニタリングシステム及びモニタリング方法 |
TWI264043B (en) * | 2002-10-01 | 2006-10-11 | Tokyo Electron Ltd | Method and system for analyzing data from a plasma process |
US7010374B2 (en) | 2003-03-04 | 2006-03-07 | Hitachi High-Technologies Corporation | Method for controlling semiconductor processing apparatus |
CN1295757C (zh) * | 2003-03-04 | 2007-01-17 | 株式会社日立高新技术 | 半导体处理装置的控制方法 |
JP2004335841A (ja) * | 2003-05-09 | 2004-11-25 | Tokyo Electron Ltd | プラズマ処理装置の予測装置及び予測方法 |
JP4342921B2 (ja) * | 2003-12-09 | 2009-10-14 | 東京エレクトロン株式会社 | 基板処理装置の制御方法及び基板処理装置 |
US8676538B2 (en) * | 2004-11-02 | 2014-03-18 | Advanced Micro Devices, Inc. | Adjusting weighting of a parameter relating to fault detection based on a detected fault |
US7231321B2 (en) * | 2004-11-10 | 2007-06-12 | Tokyo Electron Limited | Method of resetting substrate processing apparatus, storage medium storing program for implementing the method, and substrate processing apparatus |
JP4972277B2 (ja) * | 2004-11-10 | 2012-07-11 | 東京エレクトロン株式会社 | 基板処理装置の復帰方法、該装置の復帰プログラム、及び基板処理装置 |
JP4569956B2 (ja) * | 2005-01-24 | 2010-10-27 | 東京エレクトロン株式会社 | 基板処理装置の復旧処理方法,基板処理装置,プログラム |
US8572472B2 (en) * | 2006-09-28 | 2013-10-29 | Mitsubishi Electric Corporation | Fault detection apparatus, fault detection method, and fault detection program |
CN101330030B (zh) * | 2007-06-21 | 2010-09-29 | 中芯国际集成电路制造(上海)有限公司 | 检测数据中异常点的去除方法 |
US9666417B2 (en) * | 2013-08-28 | 2017-05-30 | Sakai Display Products Corporation | Plasma processing apparatus and method for monitoring plasma processing apparatus |
CN103943452B (zh) * | 2014-04-28 | 2016-04-27 | 南方科技大学 | 一种等离子体处理的工艺控制方法及装置 |
GB2535456A (en) | 2015-02-12 | 2016-08-24 | Edwards Ltd | Processing tool monitoring |
EP3373089B1 (en) | 2016-01-13 | 2021-03-10 | Mitsubishi Electric Corporation | Operating state classification device |
JP6676020B2 (ja) | 2017-09-20 | 2020-04-08 | 株式会社日立ハイテク | プラズマ処理装置及びプラズマ処理装置状態予測方法 |
JP6914211B2 (ja) | 2018-01-30 | 2021-08-04 | 株式会社日立ハイテク | プラズマ処理装置及び状態予測装置 |
JP7029362B2 (ja) * | 2018-08-16 | 2022-03-03 | 三菱重工業株式会社 | 異常検出装置、異常検出方法、及びプログラム |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5442562A (en) | 1993-12-10 | 1995-08-15 | Eastman Kodak Company | Method of controlling a manufacturing process using multivariate analysis |
US5691642A (en) * | 1995-07-28 | 1997-11-25 | Trielectrix | Method and apparatus for characterizing a plasma using broadband microwave spectroscopic measurements |
US5658423A (en) * | 1995-11-27 | 1997-08-19 | International Business Machines Corporation | Monitoring and controlling plasma processes via optical emission using principal component analysis |
US6351683B1 (en) * | 1997-09-17 | 2002-02-26 | Tokyo Electron Limited | System and method for monitoring and controlling gas plasma processes |
US6341257B1 (en) * | 1999-03-04 | 2002-01-22 | Sandia Corporation | Hybrid least squares multivariate spectral analysis methods |
US6442445B1 (en) * | 1999-03-19 | 2002-08-27 | International Business Machines Corporation, | User configurable multivariate time series reduction tool control method |
US6368975B1 (en) * | 1999-07-07 | 2002-04-09 | Applied Materials, Inc. | Method and apparatus for monitoring a process by employing principal component analysis |
WO2001013401A1 (de) * | 1999-08-12 | 2001-02-22 | Infineon Technologies Ag | Verfahren zur überwachung eines herstellungsprozesses zur bearbeitung eines substrats in der halbleiterfertigung |
US6238937B1 (en) * | 1999-09-08 | 2001-05-29 | Advanced Micro Devices, Inc. | Determining endpoint in etching processes using principal components analysis of optical emission spectra with thresholding |
US6582618B1 (en) * | 1999-09-08 | 2003-06-24 | Advanced Micro Devices, Inc. | Method of determining etch endpoint using principal components analysis of optical emission spectra |
US6413867B1 (en) * | 1999-12-23 | 2002-07-02 | Applied Materials, Inc. | Film thickness control using spectral interferometry |
WO2001056072A1 (de) * | 2000-01-25 | 2001-08-02 | Infineon Technologies Ag | Verfahren zur überwachung eines herstellungsprozesses |
AU4733601A (en) * | 2000-03-10 | 2001-09-24 | Cyrano Sciences Inc | Control for an industrial process using one or more multidimensional variables |
AU2001251216A1 (en) * | 2000-03-30 | 2001-10-15 | Tokyo Electron Limited | Optical monitoring and control system and method for plasma reactors |
AU2001273306A1 (en) * | 2000-07-05 | 2002-01-14 | Camo, Inc. | Method and system for the dynamic analysis of data |
JP3634734B2 (ja) * | 2000-09-22 | 2005-03-30 | 株式会社日立製作所 | プラズマ処理装置および処理方法 |
US6627463B1 (en) * | 2000-10-19 | 2003-09-30 | Applied Materials, Inc. | Situ measurement of film nitridation using optical emission spectroscopy |
US6789052B1 (en) * | 2000-10-24 | 2004-09-07 | Advanced Micro Devices, Inc. | Method of using control models for data compression |
US6549864B1 (en) * | 2001-08-13 | 2003-04-15 | General Electric Company | Multivariate statistical process analysis systems and methods for the production of melt polycarbonate |
US6616759B2 (en) * | 2001-09-06 | 2003-09-09 | Hitachi, Ltd. | Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor |
US6723574B1 (en) * | 2002-09-26 | 2004-04-20 | Lam Research Corporation | Method for quantifying uniformity patterns and including expert knowledge for tool development and control |
-
2001
- 2001-07-03 US US10/332,011 patent/US7054786B2/en not_active Expired - Lifetime
- 2001-07-03 WO PCT/JP2001/005758 patent/WO2002003441A1/ja active Application Filing
- 2001-07-03 AU AU2001267913A patent/AU2001267913A1/en not_active Abandoned
- 2001-07-03 CN CNB018122485A patent/CN1197130C/zh not_active Expired - Lifetime
- 2001-07-03 TW TW090116292A patent/TW499702B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US7054786B2 (en) | 2006-05-30 |
TW499702B (en) | 2002-08-21 |
WO2002003441A1 (fr) | 2002-01-10 |
US20040254761A1 (en) | 2004-12-16 |
CN1197130C (zh) | 2005-04-13 |
CN1451174A (zh) | 2003-10-22 |
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