AU2001259294A1 - Self teaching robotic wafer handling system - Google Patents

Self teaching robotic wafer handling system

Info

Publication number
AU2001259294A1
AU2001259294A1 AU2001259294A AU5929401A AU2001259294A1 AU 2001259294 A1 AU2001259294 A1 AU 2001259294A1 AU 2001259294 A AU2001259294 A AU 2001259294A AU 5929401 A AU5929401 A AU 5929401A AU 2001259294 A1 AU2001259294 A1 AU 2001259294A1
Authority
AU
Australia
Prior art keywords
handling system
wafer handling
robotic wafer
self teaching
teaching robotic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001259294A
Inventor
Sanjay K. Aggarwal
Kevin D. D'souza
Nathan H. Harding
Paul Sagues
Robert T. Wiggers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Berkeley Process Control Inc
Original Assignee
Berkeley Process Control Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Berkeley Process Control Inc filed Critical Berkeley Process Control Inc
Publication of AU2001259294A1 publication Critical patent/AU2001259294A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1679—Programme controls characterised by the tasks executed
    • B25J9/1692—Calibration of manipulator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37275—Laser, interferometer
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/39—Robotics, robotics to robotics hand
    • G05B2219/39024—Calibration of manipulator
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/39—Robotics, robotics to robotics hand
    • G05B2219/39048—Closed loop kinematic self calibration, grip part of robot with hand
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/39—Robotics, robotics to robotics hand
    • G05B2219/39056—On line relative position error and orientation error calibration
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40623—Track position of end effector by laser beam
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
AU2001259294A 2000-05-03 2001-04-30 Self teaching robotic wafer handling system Abandoned AU2001259294A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09564300 2000-05-03
US09/564,300 US6323616B1 (en) 1999-03-15 2000-05-03 Self teaching robotic wafer handling system
PCT/US2001/013972 WO2001083171A1 (en) 2000-05-03 2001-04-30 Self teaching robotic wafer handling system

Publications (1)

Publication Number Publication Date
AU2001259294A1 true AU2001259294A1 (en) 2001-11-12

Family

ID=24253933

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001259294A Abandoned AU2001259294A1 (en) 2000-05-03 2001-04-30 Self teaching robotic wafer handling system

Country Status (5)

Country Link
US (1) US6323616B1 (en)
EP (1) EP1282486A4 (en)
JP (1) JP5236852B2 (en)
AU (1) AU2001259294A1 (en)
WO (1) WO2001083171A1 (en)

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US6304051B1 (en) * 1999-03-15 2001-10-16 Berkeley Process Control, Inc. Self teaching robotic carrier handling system
CN100431806C (en) * 2001-09-07 2008-11-12 株式会社安川电机 Wafer position teaching method and teaching jig
WO2003080479A2 (en) * 2002-03-20 2003-10-02 Fsi International, Inc. Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector
CN1307027C (en) * 2002-07-11 2007-03-28 上海交通大学 Multifunctional dual-arm robot for education
US6996456B2 (en) * 2002-10-21 2006-02-07 Fsi International, Inc. Robot with tactile sensor device
US6852644B2 (en) * 2002-11-25 2005-02-08 The Boc Group, Inc. Atmospheric robot handling equipment
US6748293B1 (en) * 2003-03-24 2004-06-08 Varian Semiconductor Equipment Associates, Inc. Methods and apparatus for high speed object handling
US7230702B2 (en) * 2003-11-13 2007-06-12 Applied Materials, Inc. Monitoring of smart pin transition timing
US7433759B2 (en) * 2004-07-22 2008-10-07 Applied Materials, Inc. Apparatus and methods for positioning wafers
CN100490108C (en) * 2005-04-27 2009-05-20 平田机工株式会社 Indication device and method for indicating workpiece delivery position to robot
JP4962488B2 (en) * 2006-03-01 2012-06-27 富士通株式会社 Torque measuring device
JP2009049250A (en) * 2007-08-22 2009-03-05 Yaskawa Electric Corp Cassette stage equipped with teaching mechanism, substrate transfer apparatus having the same, and semiconductor manufacturing device
JP5235376B2 (en) * 2007-10-05 2013-07-10 川崎重工業株式会社 Robot target position detector
JP4993614B2 (en) * 2008-02-29 2012-08-08 東京エレクトロン株式会社 Teaching method for conveying means, storage medium, and substrate processing apparatus
NL1036673A1 (en) * 2008-04-09 2009-10-12 Asml Holding Nv Robot Position Calibration Tool (RPCT).
US8242730B2 (en) * 2008-06-10 2012-08-14 Nichols Michael J Automated robot teach tool and method of use
JP5246550B2 (en) * 2009-03-03 2013-07-24 川崎重工業株式会社 Robot and control method thereof
US8459922B2 (en) * 2009-11-13 2013-06-11 Brooks Automation, Inc. Manipulator auto-teach and position correction system
JP5835722B2 (en) 2009-12-10 2015-12-24 オルボテック エルティ ソラー，エルエルシー Automatic ranking multi-directional serial processor
US8692503B2 (en) * 2009-12-18 2014-04-08 Varian Medical Systems, Inc. Homing and establishing reference frames for motion axes in radiation systems
US8459276B2 (en) * 2011-05-24 2013-06-11 Orbotech LT Solar, LLC. Broken wafer recovery system
JP5401748B2 (en) * 2012-08-30 2014-01-29 川崎重工業株式会社 Robot and teaching method thereof
WO2014197537A1 (en) * 2013-06-05 2014-12-11 Persimmon Technologies, Corp. Robot and adaptive placement system and method
JP6438189B2 (en) * 2013-10-01 2018-12-12 川崎重工業株式会社 Robot and robot control method
US9666465B2 (en) * 2013-12-12 2017-05-30 Seagate Technology Llc Positioning apparatus
US9349629B2 (en) 2014-01-23 2016-05-24 Lam Research Corporation Touch auto-calibration of process modules
KR102516801B1 (en) 2014-11-10 2023-03-31 브룩스 오토메이션 인코퍼레이티드 Tool auto-teach method and apparatus
US10741433B2 (en) * 2017-11-29 2020-08-11 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for wafer pod alignment
US11279032B2 (en) * 2019-04-11 2022-03-22 Applied Materials, Inc. Apparatus, systems, and methods for improved joint coordinate teaching accuracy of robots
KR102069894B1 (en) * 2019-04-12 2020-01-23 (주)세스텍 An glass transer system with an on-the-spot auto teaching of transfer robot and an auto teaching method of transfer robot therof
KR20200133506A (en) * 2019-05-20 2020-11-30 에스케이하이닉스 주식회사 Semiconductor Wafer Processing Apparatus and Operating Method thereof
US11276593B2 (en) 2019-07-22 2022-03-15 Rorze Automation, Inc. Systems and methods for horizontal wafer packaging
US11370114B2 (en) 2019-12-09 2022-06-28 Applied Materials, Inc. Autoteach enclosure system
US11676845B2 (en) 2020-06-30 2023-06-13 Brooks Automation Us, Llc Automated teach apparatus for robotic systems and method therefor
US20220344185A1 (en) * 2021-04-22 2022-10-27 Taiwan Semiconductor Manufacturing Company, Ltd. Calibration pod for robotic wafer carrier handling and calibration performed using same
WO2023213864A1 (en) 2022-05-04 2023-11-09 F. Hoffmann-La Roche Ag Slide imaging apparatus

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JPH06227626A (en) 1993-02-02 1994-08-16 Kokusai Electric Co Ltd Boat position detector of semiconductor manufacture device
US5563798A (en) * 1994-04-05 1996-10-08 Applied Materials, Inc. Wafer positioning system
JPH09246349A (en) * 1996-03-06 1997-09-19 Dainippon Screen Mfg Co Ltd Conveyor for material-to-be-treated
US5789890A (en) * 1996-03-22 1998-08-04 Genmark Automation Robot having multiple degrees of freedom
JPH106262A (en) * 1996-06-20 1998-01-13 Toshiba Corp Instructing method and its device for robot
JPH10233426A (en) * 1997-02-20 1998-09-02 Tokyo Electron Ltd Automatic teaching method
EP0996963A4 (en) * 1997-07-11 2006-01-18 Genmark Automation Inc Multiple point position scanning system
KR20010043979A (en) * 1998-07-03 2001-05-25 오노 시게오 Exposure system, method of manufacture thereof, method of wafer transfer, device and method of manufacture device
US20040075822A1 (en) * 1998-07-03 2004-04-22 Nikon Corporation Exposure apparatus and its making method, substrate carrying method, device manufacturing method and device
JP3215086B2 (en) * 1998-07-09 2001-10-02 ファナック株式会社 Robot controller
US6256555B1 (en) * 1998-12-02 2001-07-03 Newport Corporation Robot arm with specimen edge gripping end effector

Also Published As

Publication number Publication date
WO2001083171A1 (en) 2001-11-08
EP1282486A4 (en) 2007-06-06
JP5236852B2 (en) 2013-07-17
EP1282486A1 (en) 2003-02-12
US6323616B1 (en) 2001-11-27
JP2004500993A (en) 2004-01-15

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