US6420262B1
(en)
|
2000-01-18 |
2002-07-16 |
Micron Technology, Inc. |
Structures and methods to enhance copper metallization
|
DE60139682D1
(en)
*
|
2000-06-21 |
2009-10-08 |
Koninkl Philips Electronics Nv |
MAGNETIC MULTILAYER STRUCTURE WITH IMPROVED MAGNETIC FIELD AREA
|
US6392922B1
(en)
*
|
2000-08-14 |
2002-05-21 |
Micron Technology, Inc. |
Passivated magneto-resistive bit structure and passivation method therefor
|
US6515352B1
(en)
*
|
2000-09-25 |
2003-02-04 |
Micron Technology, Inc. |
Shielding arrangement to protect a circuit from stray magnetic fields
|
US6979586B2
(en)
*
|
2000-10-06 |
2005-12-27 |
Headway Technologies, Inc. |
Magnetic random access memory array with coupled soft adjacent magnetic layer
|
US6555858B1
(en)
*
|
2000-11-15 |
2003-04-29 |
Motorola, Inc. |
Self-aligned magnetic clad write line and its method of formation
|
US6511609B2
(en)
*
|
2001-02-20 |
2003-01-28 |
Industrial Technology Research Institute |
Cu seed layer deposition for ULSI metalization
|
US6413788B1
(en)
|
2001-02-28 |
2002-07-02 |
Micron Technology, Inc. |
Keepers for MRAM electrodes
|
US6475812B2
(en)
*
|
2001-03-09 |
2002-11-05 |
Hewlett Packard Company |
Method for fabricating cladding layer in top conductor
|
JP5013494B2
(en)
*
|
2001-04-06 |
2012-08-29 |
ルネサスエレクトロニクス株式会社 |
Manufacturing method of magnetic memory
|
JP2002367998A
(en)
*
|
2001-06-11 |
2002-12-20 |
Ebara Corp |
Semiconductor device and manufacturing method therefor
|
US6510080B1
(en)
|
2001-08-28 |
2003-01-21 |
Micron Technology Inc. |
Three terminal magnetic random access memory
|
US6545906B1
(en)
*
|
2001-10-16 |
2003-04-08 |
Motorola, Inc. |
Method of writing to scalable magnetoresistance random access memory element
|
US6720597B2
(en)
*
|
2001-11-13 |
2004-04-13 |
Motorola, Inc. |
Cladding of a conductive interconnect for programming a MRAM device using multiple magnetic layers
|
KR100452618B1
(en)
*
|
2001-11-20 |
2004-10-15 |
한국과학기술연구원 |
Wordline manufacturing method applicable to magnetic memory and sensors
|
TW569442B
(en)
*
|
2001-12-18 |
2004-01-01 |
Toshiba Corp |
Magnetic memory device having magnetic shield layer, and manufacturing method thereof
|
US6743641B2
(en)
*
|
2001-12-20 |
2004-06-01 |
Micron Technology, Inc. |
Method of improving surface planarity prior to MRAM bit material deposition
|
US6525957B1
(en)
*
|
2001-12-21 |
2003-02-25 |
Motorola, Inc. |
Magnetic memory cell having magnetic flux wrapping around a bit line and method of manufacturing thereof
|
JP2003197875A
(en)
*
|
2001-12-28 |
2003-07-11 |
Toshiba Corp |
Magnetic storage device
|
US7167372B2
(en)
*
|
2003-08-26 |
2007-01-23 |
Belkin Corporation |
Universal serial bus hub and method of manufacturing same
|
US6906305B2
(en)
*
|
2002-01-08 |
2005-06-14 |
Brion Technologies, Inc. |
System and method for aerial image sensing
|
US6906396B2
(en)
*
|
2002-01-15 |
2005-06-14 |
Micron Technology, Inc. |
Magnetic shield for integrated circuit packaging
|
TWI266443B
(en)
*
|
2002-01-16 |
2006-11-11 |
Toshiba Corp |
Magnetic memory
|
JP4053825B2
(en)
*
|
2002-01-22 |
2008-02-27 |
株式会社東芝 |
Semiconductor integrated circuit device
|
US6548849B1
(en)
*
|
2002-01-31 |
2003-04-15 |
Sharp Laboratories Of America, Inc. |
Magnetic yoke structures in MRAM devices to reduce programming power consumption and a method to make the same
|
US6927072B2
(en)
*
|
2002-03-08 |
2005-08-09 |
Freescale Semiconductor, Inc. |
Method of applying cladding material on conductive lines of MRAM devices
|
US6812040B2
(en)
*
|
2002-03-12 |
2004-11-02 |
Freescale Semiconductor, Inc. |
Method of fabricating a self-aligned via contact for a magnetic memory element
|
JP3596536B2
(en)
*
|
2002-03-26 |
2004-12-02 |
ソニー株式会社 |
Magnetic memory device and method of manufacturing the same
|
JP3993522B2
(en)
*
|
2002-03-29 |
2007-10-17 |
株式会社東芝 |
Method for manufacturing magnetic storage device
|
US6903396B2
(en)
*
|
2002-04-12 |
2005-06-07 |
Micron Technology, Inc. |
Control of MTJ tunnel area
|
US6815248B2
(en)
*
|
2002-04-18 |
2004-11-09 |
Infineon Technologies Ag |
Material combinations for tunnel junction cap layer, tunnel junction hard mask and tunnel junction stack seed layer in MRAM processing
|
US6783995B2
(en)
*
|
2002-04-30 |
2004-08-31 |
Micron Technology, Inc. |
Protective layers for MRAM devices
|
US6724652B2
(en)
*
|
2002-05-02 |
2004-04-20 |
Micron Technology, Inc. |
Low remanence flux concentrator for MRAM devices
|
US6927073B2
(en)
*
|
2002-05-16 |
2005-08-09 |
Nova Research, Inc. |
Methods of fabricating magnetoresistive memory devices
|
US6778433B1
(en)
|
2002-06-06 |
2004-08-17 |
Taiwan Semiconductor Manufacturing Company |
High programming efficiency MRAM cell structure
|
US6780653B2
(en)
|
2002-06-06 |
2004-08-24 |
Micron Technology, Inc. |
Methods of forming magnetoresistive memory device assemblies
|
JP2004040006A
(en)
*
|
2002-07-08 |
2004-02-05 |
Sony Corp |
Magnetic memory device and its manufacturing method
|
US6806523B2
(en)
*
|
2002-07-15 |
2004-10-19 |
Micron Technology, Inc. |
Magnetoresistive memory devices
|
US7095646B2
(en)
*
|
2002-07-17 |
2006-08-22 |
Freescale Semiconductor, Inc. |
Multi-state magnetoresistance random access cell with improved memory storage density
|
US6770491B2
(en)
*
|
2002-08-07 |
2004-08-03 |
Micron Technology, Inc. |
Magnetoresistive memory and method of manufacturing the same
|
US6914805B2
(en)
*
|
2002-08-21 |
2005-07-05 |
Micron Technology, Inc. |
Method for building a magnetic keeper or flux concentrator used for writing magnetic bits on a MRAM device
|
US6740948B2
(en)
*
|
2002-08-30 |
2004-05-25 |
Hewlett-Packard Development Company, L.P. |
Magnetic shielding for reducing magnetic interference
|
US6831312B2
(en)
*
|
2002-08-30 |
2004-12-14 |
Freescale Semiconductor, Inc. |
Amorphous alloys for magnetic devices
|
JP3866641B2
(en)
*
|
2002-09-24 |
2007-01-10 |
株式会社東芝 |
Magnetic storage device and manufacturing method thereof
|
KR100515053B1
(en)
*
|
2002-10-02 |
2005-09-14 |
삼성전자주식회사 |
Magnetic memory device implementing read operation tolerant of bitline clamp voltage(VREF)
|
JP3906139B2
(en)
*
|
2002-10-16 |
2007-04-18 |
株式会社東芝 |
Magnetic random access memory
|
US7183120B2
(en)
*
|
2002-10-31 |
2007-02-27 |
Honeywell International Inc. |
Etch-stop material for improved manufacture of magnetic devices
|
JP3935049B2
(en)
*
|
2002-11-05 |
2007-06-20 |
株式会社東芝 |
Magnetic storage device and manufacturing method thereof
|
US6660568B1
(en)
|
2002-11-07 |
2003-12-09 |
International Business Machines Corporation |
BiLevel metallization for embedded back end of the line structures
|
US6740947B1
(en)
*
|
2002-11-13 |
2004-05-25 |
Hewlett-Packard Development Company, L.P. |
MRAM with asymmetric cladded conductor
|
KR102220703B1
(en)
*
|
2002-11-15 |
2021-02-26 |
프레지던트 앤드 펠로우즈 오브 하바드 칼리지 |
Atomic Layer Deposition Using Metal Amidinates
|
US6885074B2
(en)
*
|
2002-11-27 |
2005-04-26 |
Freescale Semiconductor, Inc. |
Cladded conductor for use in a magnetoelectronics device and method for fabricating the same
|
US6909633B2
(en)
*
|
2002-12-09 |
2005-06-21 |
Applied Spintronics Technology, Inc. |
MRAM architecture with a flux closed data storage layer
|
US6909630B2
(en)
*
|
2002-12-09 |
2005-06-21 |
Applied Spintronics Technology, Inc. |
MRAM memories utilizing magnetic write lines
|
US6870759B2
(en)
*
|
2002-12-09 |
2005-03-22 |
Applied Spintronics Technology, Inc. |
MRAM array with segmented magnetic write lines
|
US6943038B2
(en)
*
|
2002-12-19 |
2005-09-13 |
Freescale Semiconductor, Inc. |
Method for fabricating a flux concentrating system for use in a magnetoelectronics device
|
US6864551B2
(en)
*
|
2003-02-05 |
2005-03-08 |
Applied Spintronics Technology, Inc. |
High density and high programming efficiency MRAM design
|
US6812538B2
(en)
*
|
2003-02-05 |
2004-11-02 |
Applied Spintronics Technology, Inc. |
MRAM cells having magnetic write lines with a stable magnetic state at the end regions
|
US7002228B2
(en)
*
|
2003-02-18 |
2006-02-21 |
Micron Technology, Inc. |
Diffusion barrier for improving the thermal stability of MRAM devices
|
US6940749B2
(en)
*
|
2003-02-24 |
2005-09-06 |
Applied Spintronics Technology, Inc. |
MRAM array with segmented word and bit lines
|
US6759297B1
(en)
|
2003-02-28 |
2004-07-06 |
Union Semiconductor Technology Corporatin |
Low temperature deposition of dielectric materials in magnetoresistive random access memory devices
|
US20040175845A1
(en)
*
|
2003-03-03 |
2004-09-09 |
Molla Jaynal A. |
Method of forming a flux concentrating layer of a magnetic device
|
JP2004273969A
(en)
*
|
2003-03-12 |
2004-09-30 |
Sony Corp |
Process for fabricating magnetic storage
|
US6963500B2
(en)
*
|
2003-03-14 |
2005-11-08 |
Applied Spintronics Technology, Inc. |
Magnetic tunneling junction cell array with shared reference layer for MRAM applications
|
US7067866B2
(en)
*
|
2003-03-31 |
2006-06-27 |
Applied Spintronics Technology, Inc. |
MRAM architecture and a method and system for fabricating MRAM memories utilizing the architecture
|
US6933550B2
(en)
*
|
2003-03-31 |
2005-08-23 |
Applied Spintronics Technology, Inc. |
Method and system for providing a magnetic memory having a wrapped write line
|
US6921953B2
(en)
*
|
2003-04-09 |
2005-07-26 |
Micron Technology, Inc. |
Self-aligned, low-resistance, efficient MRAM read/write conductors
|
US6982445B2
(en)
*
|
2003-05-05 |
2006-01-03 |
Applied Spintronics Technology, Inc. |
MRAM architecture with a bit line located underneath the magnetic tunneling junction device
|
KR100552682B1
(en)
*
|
2003-06-02 |
2006-02-20 |
삼성전자주식회사 |
High density magnetoresistance memory and Manufacturing method the same
|
JP2005005605A
(en)
*
|
2003-06-13 |
2005-01-06 |
Fujitsu Ltd |
Semiconductor device
|
US7477538B2
(en)
*
|
2003-06-20 |
2009-01-13 |
Nec Corporation |
Magnetic random access memory
|
US6956763B2
(en)
*
|
2003-06-27 |
2005-10-18 |
Freescale Semiconductor, Inc. |
MRAM element and methods for writing the MRAM element
|
US7220665B2
(en)
*
|
2003-08-05 |
2007-05-22 |
Micron Technology, Inc. |
H2 plasma treatment
|
KR100555514B1
(en)
*
|
2003-08-22 |
2006-03-03 |
삼성전자주식회사 |
Semiconductor memory device having tungsten line with low resistance and method for manufacturing the same
|
US6967366B2
(en)
*
|
2003-08-25 |
2005-11-22 |
Freescale Semiconductor, Inc. |
Magnetoresistive random access memory with reduced switching field variation
|
US8014170B2
(en)
|
2003-08-26 |
2011-09-06 |
Belkin International, Inc. |
Cable management device and method of cable management
|
US7329152B2
(en)
*
|
2003-08-26 |
2008-02-12 |
Belkin International, Inc. |
Universal serial bus hub and method of manufacturing same
|
US7078239B2
(en)
*
|
2003-09-05 |
2006-07-18 |
Micron Technology, Inc. |
Integrated circuit structure formed by damascene process
|
US6990012B2
(en)
*
|
2003-10-07 |
2006-01-24 |
Hewlett-Packard Development Company, L.P. |
Magnetic memory device
|
US20050095855A1
(en)
*
|
2003-11-05 |
2005-05-05 |
D'urso John J. |
Compositions and methods for the electroless deposition of NiFe on a work piece
|
US7053429B2
(en)
*
|
2003-11-06 |
2006-05-30 |
Honeywell International Inc. |
Bias-adjusted giant magnetoresistive (GMR) devices for magnetic random access memory (MRAM) applications
|
US7114240B2
(en)
*
|
2003-11-12 |
2006-10-03 |
Honeywell International, Inc. |
Method for fabricating giant magnetoresistive (GMR) devices
|
WO2009105668A1
(en)
|
2008-02-20 |
2009-08-27 |
President And Fellows Of Harvard College |
Bicyclic guanidines, metal complexes thereof and their use in vapor deposition
|
US7072209B2
(en)
*
|
2003-12-29 |
2006-07-04 |
Micron Technology, Inc. |
Magnetic memory having synthetic antiferromagnetic pinned layer
|
US7211874B2
(en)
*
|
2004-04-06 |
2007-05-01 |
Headway Technologies, Inc. |
Magnetic random access memory array with free layer locking mechanism
|
US7105879B2
(en)
*
|
2004-04-20 |
2006-09-12 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Write line design in MRAM
|
US7112861B2
(en)
*
|
2004-05-14 |
2006-09-26 |
International Business Machines Corporation |
Magnetic tunnel junction cap structure and method for forming the same
|
JP3863536B2
(en)
*
|
2004-05-17 |
2006-12-27 |
株式会社東芝 |
Magnetic random access memory and data writing method of the magnetic random access memory
|
US7132707B2
(en)
*
|
2004-08-03 |
2006-11-07 |
Headway Technologies, Inc. |
Magnetic random access memory array with proximate read and write lines cladded with magnetic material
|
US7067330B2
(en)
|
2004-07-16 |
2006-06-27 |
Headway Technologies, Inc. |
Magnetic random access memory array with thin conduction electrical read and write lines
|
US7344896B2
(en)
*
|
2004-07-26 |
2008-03-18 |
Infineon Technologies Ag |
Ferromagnetic liner for conductive lines of magnetic memory cells and methods of manufacturing thereof
|
US7576956B2
(en)
*
|
2004-07-26 |
2009-08-18 |
Grandis Inc. |
Magnetic tunnel junction having diffusion stop layer
|
US7072208B2
(en)
*
|
2004-07-28 |
2006-07-04 |
Headway Technologies, Inc. |
Vortex magnetic random access memory
|
US20060022286A1
(en)
*
|
2004-07-30 |
2006-02-02 |
Rainer Leuschner |
Ferromagnetic liner for conductive lines of magnetic memory cells
|
US7075807B2
(en)
*
|
2004-08-18 |
2006-07-11 |
Infineon Technologies Ag |
Magnetic memory with static magnetic offset field
|
CN1328781C
(en)
*
|
2004-09-08 |
2007-07-25 |
中芯国际集成电路制造(上海)有限公司 |
Production of semiconductor device
|
US7129098B2
(en)
*
|
2004-11-24 |
2006-10-31 |
Freescale Semiconductor, Inc. |
Reduced power magnetoresistive random access memory elements
|
TWI297928B
(en)
*
|
2005-01-20 |
2008-06-11 |
Macronix Int Co Ltd |
Memory cell
|
US7083990B1
(en)
*
|
2005-01-28 |
2006-08-01 |
Infineon Technologies Ag |
Method of fabricating MRAM cells
|
US7087972B1
(en)
*
|
2005-01-31 |
2006-08-08 |
Freescale Semiconductor, Inc. |
Magnetoelectronic devices utilizing protective capping layers and methods of fabricating the same
|
US7444740B1
(en)
|
2005-01-31 |
2008-11-04 |
Western Digital (Fremont), Llc |
Damascene process for fabricating poles in recording heads
|
US7806723B2
(en)
*
|
2007-01-05 |
2010-10-05 |
Belkin International, Inc. |
Electrical grommet device
|
US20060258195A1
(en)
*
|
2005-05-11 |
2006-11-16 |
Ameriwood Industries, Inc. |
Connectivity system, method of assembling same, and desk containing same
|
US7381095B2
(en)
*
|
2005-06-20 |
2008-06-03 |
Belkin International, Inc. |
Multi-standard connection hub and method of manufacturing same
|
KR100744672B1
(en)
*
|
2005-06-24 |
2007-08-01 |
주식회사 하이닉스반도체 |
Method for fabricating contact hole in semiconductor device
|
US7859034B2
(en)
*
|
2005-09-20 |
2010-12-28 |
Grandis Inc. |
Magnetic devices having oxide antiferromagnetic layer next to free ferromagnetic layer
|
US7777261B2
(en)
*
|
2005-09-20 |
2010-08-17 |
Grandis Inc. |
Magnetic device having stabilized free ferromagnetic layer
|
US7973349B2
(en)
*
|
2005-09-20 |
2011-07-05 |
Grandis Inc. |
Magnetic device having multilayered free ferromagnetic layer
|
US7430135B2
(en)
*
|
2005-12-23 |
2008-09-30 |
Grandis Inc. |
Current-switched spin-transfer magnetic devices with reduced spin-transfer switching current density
|
UA90089C2
(en)
*
|
2006-02-08 |
2010-04-12 |
Григорий БЕРЕЗИН |
Method for production of coke from the non-coking ranks of coal and the apparatus for its realization
|
US7432150B2
(en)
*
|
2006-02-10 |
2008-10-07 |
Everspin Technologies, Inc. |
Method of manufacturing a magnetoelectronic device
|
US20070246787A1
(en)
*
|
2006-03-29 |
2007-10-25 |
Lien-Chang Wang |
On-plug magnetic tunnel junction devices based on spin torque transfer switching
|
US8141235B1
(en)
|
2006-06-09 |
2012-03-27 |
Western Digital (Fremont), Llc |
Method for manufacturing a perpendicular magnetic recording transducers
|
US7502249B1
(en)
|
2006-07-17 |
2009-03-10 |
Grandis, Inc. |
Method and system for using a pulsed field to assist spin transfer induced switching of magnetic memory elements
|
US7532505B1
(en)
|
2006-07-17 |
2009-05-12 |
Grandis, Inc. |
Method and system for using a pulsed field to assist spin transfer induced switching of magnetic memory elements
|
KR100744419B1
(en)
|
2006-08-03 |
2007-07-30 |
동부일렉트로닉스 주식회사 |
Semiconductor device and method for fabricating thereof
|
US7851840B2
(en)
*
|
2006-09-13 |
2010-12-14 |
Grandis Inc. |
Devices and circuits based on magnetic tunnel junctions utilizing a multilayer barrier
|
US7738287B2
(en)
*
|
2007-03-27 |
2010-06-15 |
Grandis, Inc. |
Method and system for providing field biased magnetic memory devices
|
US20080296711A1
(en)
*
|
2007-05-30 |
2008-12-04 |
Freescale Semiconductor, Inc. |
Magnetoelectronic device having enhanced permeability dielectric and method of manufacture
|
US7957179B2
(en)
*
|
2007-06-27 |
2011-06-07 |
Grandis Inc. |
Magnetic shielding in magnetic multilayer structures
|
US7982275B2
(en)
*
|
2007-08-22 |
2011-07-19 |
Grandis Inc. |
Magnetic element having low saturation magnetization
|
US8015692B1
(en)
|
2007-11-07 |
2011-09-13 |
Western Digital (Fremont), Llc |
Method for providing a perpendicular magnetic recording (PMR) head
|
US7894248B2
(en)
*
|
2008-09-12 |
2011-02-22 |
Grandis Inc. |
Programmable and redundant circuitry based on magnetic tunnel junction (MTJ)
|
US7833806B2
(en)
*
|
2009-01-30 |
2010-11-16 |
Everspin Technologies, Inc. |
Structure and method for fabricating cladded conductive lines in magnetic memories
|
US9099118B1
(en)
*
|
2009-05-26 |
2015-08-04 |
Western Digital (Fremont), Llc |
Dual damascene process for producing a PMR write pole
|
US8486285B2
(en)
|
2009-08-20 |
2013-07-16 |
Western Digital (Fremont), Llc |
Damascene write poles produced via full film plating
|
JP5527649B2
(en)
*
|
2009-08-28 |
2014-06-18 |
ルネサスエレクトロニクス株式会社 |
Semiconductor device and manufacturing method thereof
|
US8169816B2
(en)
*
|
2009-09-15 |
2012-05-01 |
Magic Technologies, Inc. |
Fabrication methods of partial cladded write line to enhance write margin for magnetic random access memory
|
US8390283B2
(en)
*
|
2009-09-25 |
2013-03-05 |
Everspin Technologies, Inc. |
Three axis magnetic field sensor
|
US8518734B2
(en)
|
2010-03-31 |
2013-08-27 |
Everspin Technologies, Inc. |
Process integration of a single chip three axis magnetic field sensor
|
US8411497B2
(en)
|
2010-05-05 |
2013-04-02 |
Grandis, Inc. |
Method and system for providing a magnetic field aligned spin transfer torque random access memory
|
US8976577B2
(en)
|
2011-04-07 |
2015-03-10 |
Tom A. Agan |
High density magnetic random access memory
|
US9070456B2
(en)
|
2011-04-07 |
2015-06-30 |
Tom A. Agan |
High density magnetic random access memory
|
US9297959B2
(en)
*
|
2011-09-29 |
2016-03-29 |
Seagate Technology Llc |
Optical articles and methods of making same
|
ITTO20121080A1
(en)
|
2012-12-14 |
2014-06-15 |
St Microelectronics Srl |
SEMICONDUCTOR DEVICE WITH INTEGRATED MAGNETIC ELEMENT PROVIDED WITH A METALLIC CONTAMINATION BARRIER STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
|
US10043967B2
(en)
*
|
2014-08-07 |
2018-08-07 |
Qualcomm Incorporated |
Self-compensation of stray field of perpendicular magnetic elements
|
US9614143B2
(en)
*
|
2015-06-09 |
2017-04-04 |
Qualcomm Incorporated |
De-integrated trench formation for advanced MRAM integration
|
US9917027B2
(en)
*
|
2015-12-30 |
2018-03-13 |
Globalfoundries Singapore Pte. Ltd. |
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|