AU2001245664A1 - Processes and apparatus for treating electronic components - Google Patents

Processes and apparatus for treating electronic components

Info

Publication number
AU2001245664A1
AU2001245664A1 AU2001245664A AU4566401A AU2001245664A1 AU 2001245664 A1 AU2001245664 A1 AU 2001245664A1 AU 2001245664 A AU2001245664 A AU 2001245664A AU 4566401 A AU4566401 A AU 4566401A AU 2001245664 A1 AU2001245664 A1 AU 2001245664A1
Authority
AU
Australia
Prior art keywords
processes
electronic components
treating electronic
treating
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001245664A
Other languages
English (en)
Inventor
Lewis Liu
Christopher F McConnell
C. Wade Sheen
Steven Verhaverbeke
Alan E Walter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CFMT Inc
Original Assignee
CFMT Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CFMT Inc filed Critical CFMT Inc
Publication of AU2001245664A1 publication Critical patent/AU2001245664A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/005—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being ozonated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2230/00—Other cleaning aspects applicable to all B08B range
    • B08B2230/01—Cleaning with steam

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
AU2001245664A 2000-03-13 2001-03-13 Processes and apparatus for treating electronic components Abandoned AU2001245664A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US18889500P 2000-03-13 2000-03-13
US60188895 2000-03-13
PCT/US2001/007959 WO2001068277A1 (en) 2000-03-13 2001-03-13 Processes and apparatus for treating electronic components

Publications (1)

Publication Number Publication Date
AU2001245664A1 true AU2001245664A1 (en) 2001-09-24

Family

ID=22695008

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001245664A Abandoned AU2001245664A1 (en) 2000-03-13 2001-03-13 Processes and apparatus for treating electronic components

Country Status (7)

Country Link
US (1) US6491763B2 (ko)
EP (1) EP1272288A1 (ko)
JP (1) JP2003526936A (ko)
KR (1) KR20030019323A (ko)
CN (1) CN1460037A (ko)
AU (1) AU2001245664A1 (ko)
WO (1) WO2001068277A1 (ko)

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US20060137723A1 (en) * 1997-05-09 2006-06-29 Bergman Eric J Workpiece processing using ozone gas and solvents
TW466558B (en) * 1999-09-30 2001-12-01 Purex Co Ltd Method of removing contamination adhered to surfaces and apparatus used therefor
US6794229B2 (en) * 2000-04-28 2004-09-21 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method for semiconductor device
WO2002027775A1 (fr) * 2000-09-28 2002-04-04 Mitsubishi Denki Kabushiki Kaisha Procede et appareil de traitement de plaquettes
JP4014127B2 (ja) * 2000-10-04 2007-11-28 東京エレクトロン株式会社 基板処理方法及び基板処理装置
US6532974B2 (en) * 2001-04-06 2003-03-18 Akrion Llc Process tank with pressurized mist generation
US20050087209A1 (en) * 2001-07-16 2005-04-28 Nicolosi Thomas J.Jr. Megasonic processing system with gasified fluid
US7156111B2 (en) * 2001-07-16 2007-01-02 Akrion Technologies, Inc Megasonic cleaning using supersaturated cleaning solution
US6635590B2 (en) * 2002-01-08 2003-10-21 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for in-situ removal of polymer residue
US20030136429A1 (en) * 2002-01-22 2003-07-24 Semitool, Inc. Vapor cleaning and liquid rinsing process vessel
US6716290B1 (en) * 2002-12-04 2004-04-06 The United States Of America As Represented By The Secretary Of The Navy Method for removing soldering flux residue from a substrate
WO2004064244A2 (en) * 2003-01-13 2004-07-29 S.C. Fluids Inc. Method for releasing and drying moveable elements of micro-electronic mechanical structures with organic thin film sacrificial layers
US6897661B2 (en) * 2003-03-14 2005-05-24 Steris Inc. Method and apparatus for detection of contaminants in a fluid
US6930493B2 (en) * 2003-03-14 2005-08-16 Steris Inc. Method and apparatus for monitoring detergent concentration in a decontamination process
US6946852B2 (en) * 2003-03-14 2005-09-20 Steris Inc. Method and apparatus for measuring concentration of a chemical component in a gas mixture
US6960921B2 (en) 2003-03-14 2005-11-01 Steris Inc. Method and apparatus for real time monitoring of metallic cation concentrations in a solution
US6927582B2 (en) * 2003-03-14 2005-08-09 Steris Inc. Method and apparatus for monitoring the state of a chemical solution for decontamination of chemical and biological warfare agents
US6933733B2 (en) 2003-03-14 2005-08-23 Steris Inc. Method and apparatus for measuring the concentration of hydrogen peroxide in a fluid
US6992494B2 (en) * 2003-03-14 2006-01-31 Steris Inc. Method and apparatus for monitoring the purity and/or quality of steam
US20050139487A1 (en) * 2003-05-02 2005-06-30 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Method for the oxidative treatment of components comprised of or containing elementary silicon and/or substantially inorganic silicon compounds
US6917885B2 (en) * 2003-06-06 2005-07-12 Steris Inc. Method and apparatus for formulating and controlling chemical concentration in a gas mixture
US6909972B2 (en) * 2003-06-06 2005-06-21 Steris Inc. Method and apparatus for formulating and controlling chemical concentrations in a solution
KR20050011510A (ko) * 2003-07-23 2005-01-29 동부전자 주식회사 반도체 공정의 폴리머 제거용 에천트
US20050130420A1 (en) * 2003-12-10 2005-06-16 Huang Chih Y. Cleaning method using ozone DI process
US20050191584A1 (en) * 2004-02-27 2005-09-01 Kevin Shea Surface treatment of a dry-developed hard mask and surface treatment compositions used therefor
US20050274396A1 (en) * 2004-06-09 2005-12-15 Hong Shih Methods for wet cleaning quartz surfaces of components for plasma processing chambers
US7431886B2 (en) * 2004-09-24 2008-10-07 Steris Corporation Method of monitoring operational status of sensing devices for determining the concentration of chemical components in a fluid
US20060196525A1 (en) * 2005-03-03 2006-09-07 Vrtis Raymond N Method for removing a residue from a chamber
US7432177B2 (en) * 2005-06-15 2008-10-07 Applied Materials, Inc. Post-ion implant cleaning for silicon on insulator substrate preparation
US7442319B2 (en) * 2005-06-28 2008-10-28 Micron Technology, Inc. Poly etch without separate oxide decap
US20070261718A1 (en) * 2006-05-10 2007-11-15 Rubinder Randhawa Method and apparatus for ozone-enhanced cleaning of flat objects with pulsed liquid jet
US7977121B2 (en) 2006-11-17 2011-07-12 Air Products And Chemicals, Inc. Method and composition for restoring dielectric properties of porous dielectric materials
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
CN105845547A (zh) * 2015-01-15 2016-08-10 中芯国际集成电路制造(上海)有限公司 一种半导体器件及其制备方法、电子装置
US11261797B2 (en) * 2018-11-05 2022-03-01 General Electric Company System and method for cleaning, restoring, and protecting gas turbine engine components
KR102121237B1 (ko) * 2018-12-06 2020-06-10 세메스 주식회사 기판 처리 장치 및 방법
JP2020155721A (ja) * 2019-03-22 2020-09-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
US11555413B2 (en) 2020-09-22 2023-01-17 General Electric Company System and method for treating an installed and assembled gas turbine engine

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US3988256A (en) * 1974-04-03 1976-10-26 Allied Chemical Corporation Photoresist stripper rinse
US4740249A (en) 1984-05-21 1988-04-26 Christopher F. McConnell Method of treating wafers with fluid
US4778532A (en) * 1985-06-24 1988-10-18 Cfm Technologies Limited Partnership Process and apparatus for treating wafers with process fluids
US4577650A (en) 1984-05-21 1986-03-25 Mcconnell Christopher F Vessel and system for treating wafers with fluids
US4738272A (en) 1984-05-21 1988-04-19 Mcconnell Christopher F Vessel and system for treating wafers with fluids
US4633893A (en) 1984-05-21 1987-01-06 Cfm Technologies Limited Partnership Apparatus for treating semiconductor wafers
US4856544A (en) 1984-05-21 1989-08-15 Cfm Technologies, Inc. Vessel and system for treating wafers with fluids
US4984597B1 (en) 1984-05-21 1999-10-26 Cfmt Inc Apparatus for rinsing and drying surfaces
US4911761A (en) 1984-05-21 1990-03-27 Cfm Technologies Research Associates Process and apparatus for drying surfaces
DE3585797D1 (de) 1985-06-24 1992-05-07 Cfm Technologies Inc Behandlung von halbleiterscheiben mit einer fluessigkeitsstroemung.
US4795497A (en) 1985-08-13 1989-01-03 Mcconnell Christopher F Method and system for fluid treatment of semiconductor wafers
US5181985A (en) 1988-06-01 1993-01-26 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Process for the wet-chemical surface treatment of semiconductor wafers
US5082518A (en) 1990-10-29 1992-01-21 Submicron Systems, Inc. Sparger plate for ozone gas diffusion
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JP3154814B2 (ja) 1991-06-28 2001-04-09 株式会社東芝 半導体ウエハの洗浄方法および洗浄装置
US5583921A (en) 1992-09-21 1996-12-10 Casio Computer Co., Ltd. Data transmitting/receiving apparatus and data communication system
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US5383484A (en) 1993-07-16 1995-01-24 Cfmt, Inc. Static megasonic cleaning system for cleaning objects
US5464480A (en) 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
DE4413077C2 (de) 1994-04-15 1997-02-06 Steag Micro Tech Gmbh Verfahren und Vorrichtung zur chemischen Behandlung von Substraten
US5516730A (en) 1994-08-26 1996-05-14 Memc Electronic Materials, Inc. Pre-thermal treatment cleaning process of wafers
US5571337A (en) 1994-11-14 1996-11-05 Yieldup International Method for cleaning and drying a semiconductor wafer
US6132522A (en) 1996-07-19 2000-10-17 Cfmt, Inc. Wet processing methods for the manufacture of electronic components using sequential chemical processing
JP3036478B2 (ja) 1997-08-08 2000-04-24 日本電気株式会社 ウェハの洗浄及び乾燥方法
TW426874B (en) 1998-10-14 2001-03-21 United Microelectronics Corp Method for cleaning a semiconductor wafer
US6245185B1 (en) 1999-07-15 2001-06-12 International Business Machines Corporation Method of making a multilayer ceramic product with thin layers

Also Published As

Publication number Publication date
EP1272288A1 (en) 2003-01-08
WO2001068277A1 (en) 2001-09-20
US20020033186A1 (en) 2002-03-21
US6491763B2 (en) 2002-12-10
KR20030019323A (ko) 2003-03-06
CN1460037A (zh) 2003-12-03
JP2003526936A (ja) 2003-09-09

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