AU2001241701A1 - Electronic supports and methods and apparatus for forming apertures in electronic supports - Google Patents

Electronic supports and methods and apparatus for forming apertures in electronic supports

Info

Publication number
AU2001241701A1
AU2001241701A1 AU2001241701A AU4170101A AU2001241701A1 AU 2001241701 A1 AU2001241701 A1 AU 2001241701A1 AU 2001241701 A AU2001241701 A AU 2001241701A AU 4170101 A AU4170101 A AU 4170101A AU 2001241701 A1 AU2001241701 A1 AU 2001241701A1
Authority
AU
Australia
Prior art keywords
electronic supports
methods
forming apertures
supports
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001241701A
Inventor
Charles B. Greenburg
Bruce E. Novich
Velpari Vedagiri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PPG Industries Ohio Inc
Original Assignee
PPG Industries Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PPG Industries Ohio Inc filed Critical PPG Industries Ohio Inc
Publication of AU2001241701A1 publication Critical patent/AU2001241701A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/465—Coatings containing composite materials
    • C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/03—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/44—Cutting by use of rotating axially moving tool with means to apply transient, fluent medium to work or product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/44—Cutting by use of rotating axially moving tool with means to apply transient, fluent medium to work or product
    • Y10T408/45—Cutting by use of rotating axially moving tool with means to apply transient, fluent medium to work or product including Tool with duct
    • Y10T408/455—Conducting channel extending to end of Tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Organic Chemistry (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Lubricants (AREA)
AU2001241701A 2000-02-22 2001-02-22 Electronic supports and methods and apparatus for forming apertures in electronic supports Abandoned AU2001241701A1 (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US18397900P 2000-02-22 2000-02-22
US18402600P 2000-02-22 2000-02-22
US60184026 2000-02-22
US60183979 2000-02-22
US23361900P 2000-09-18 2000-09-18
US60233619 2000-09-18
US09/783,540 US20020085888A1 (en) 2000-02-22 2001-02-15 Electronic supports and methods and apparatus for forming apertures in electronic supports
US09783540 2001-02-15
PCT/US2001/005840 WO2001063986A1 (en) 2000-02-22 2001-02-22 Electronic supports and methods and apparatus for forming apertures in electronic supports

Publications (1)

Publication Number Publication Date
AU2001241701A1 true AU2001241701A1 (en) 2001-09-03

Family

ID=27497586

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001241701A Abandoned AU2001241701A1 (en) 2000-02-22 2001-02-22 Electronic supports and methods and apparatus for forming apertures in electronic supports

Country Status (3)

Country Link
US (1) US20020085888A1 (en)
AU (1) AU2001241701A1 (en)
WO (1) WO2001063986A1 (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7521385B2 (en) 1999-11-30 2009-04-21 Building Materials Invest Corp Fire resistant structural material, fabrics made therefrom
US6858550B2 (en) 2001-09-18 2005-02-22 Elk Premium Building Products, Inc. Fire resistant fabric material
AU2001284510A1 (en) * 2000-09-14 2002-03-26 Ohtomo Chemical Ins., Corp. Entry boards for use in drilling small holes
DE10133003B4 (en) * 2001-07-06 2009-06-25 Dürr Ecoclean GmbH Method and device for machining a workpiece
US8017531B2 (en) 2001-09-18 2011-09-13 Elkcorp Composite material
US8030229B2 (en) 2002-01-29 2011-10-04 Elkcorp. Composite material
US7563733B2 (en) 2002-01-29 2009-07-21 Elkcorp Composite material
US20050112344A1 (en) * 2003-08-20 2005-05-26 Redfern Sean M. Apparatus and method for use in printed circuit board drilling applications
US7291390B2 (en) * 2003-11-07 2007-11-06 Ppg Industries Ohio, Inc. Sizing composition for glass fibers and sized fiber glass products
US20050215152A1 (en) 2004-03-23 2005-09-29 Elkcorp Fire resistant composite material and fabrics therefrom
US20050215150A1 (en) 2004-03-23 2005-09-29 Elkcorp Fire resistant composite material and fabrics therefrom
US7361617B2 (en) 2004-03-23 2008-04-22 Elkcorp Fire resistant composite material and fabrics therefrom
US8822355B2 (en) 2004-03-23 2014-09-02 Elkcorp Fire resistant composite material and fabrics made therefrom
US20050215149A1 (en) 2004-03-23 2005-09-29 Elkcorp Fire resistant composite material and fabrics therefrom
FR2877001B1 (en) * 2004-10-21 2006-12-15 Saint Gobain Vetrotex GLASS YARNS ELECTRO-CONDUCTOR ENSIMES.
EP1762335B1 (en) * 2005-09-07 2008-11-05 Luca Toncelli Process for machining with chip removal articles made of fibres where inert materials are bound with resins
US7709599B2 (en) * 2005-10-12 2010-05-04 Ppg Industries Ohio, Inc. Compounds, rosins, and sizing compositions
US8446734B2 (en) * 2006-03-30 2013-05-21 Kyocera Corporation Circuit board and mounting structure
EP2157135A4 (en) * 2007-05-21 2011-07-20 Ntn Toyo Bearing Co Ltd Resin composition for slide member and roller bearing
WO2009045932A1 (en) 2007-09-28 2009-04-09 Tri-Star Laminates, Inc. Improved systems and methods for drilling holes in printed circuit boards
US20090206526A1 (en) * 2008-02-18 2009-08-20 Huntsman Petrochemical Corporation Sintering aids
US8431833B2 (en) * 2008-12-29 2013-04-30 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
EP2752101A1 (en) * 2011-08-29 2014-07-09 Koninklijke Philips N.V. A flexible lighting assembly, a luminaire, and a method of manufacturing a flexible layer
EP3035778B1 (en) * 2013-08-14 2018-10-03 Denka Company Limited Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate
US20160368821A1 (en) * 2015-06-17 2016-12-22 International Business Machines Corporation Method of glass fabric production including resin adhesion for printed circuit board formation
JP6712774B2 (en) 2016-03-23 2020-06-24 パナソニックＩｐマネジメント株式会社 Manufacturing method of prepreg, metal-clad laminate, printed wiring board, and prepreg
CN109070240B (en) * 2016-04-25 2020-04-24 京瓷株式会社 Insert and cutting tool
CN113310829B (en) * 2021-04-14 2022-10-25 西南石油大学 Drillability testing device and experimental method for rock in impact mode

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB660129A (en) * 1948-07-15 1951-10-31 Birmingham Small Arms Co Ltd Improvements in or relating to cutting tools such as drills, milling cutters, lathe turning tools and the like
US3499821A (en) * 1965-05-18 1970-03-10 New England Laminates Co Inc Laminated board particularly for printed circuits,and method of manufacture
US4781495A (en) * 1986-10-14 1988-11-01 Lubra Sheet Corp. Dry lubricant drilling of thru-holes in printed circuit boards
US4826365A (en) * 1988-01-20 1989-05-02 White Engineering Corporation Material-working tools and method for lubricating
CN1047716C (en) * 1991-02-07 1999-12-22 霍尔德斯科技有限公司 Drilling printed circuit boards and entry and backing boards therefor
JPH04276694A (en) * 1991-03-05 1992-10-01 Matsushita Electric Ind Co Ltd Manufacture of circuit substrate
JP2984446B2 (en) * 1992-01-07 1999-11-29 三菱重工業株式会社 Drill
EP0555575A1 (en) * 1992-02-11 1993-08-18 Excellon Automation Method and apparatus for machining printed circuit boards
JPH07176843A (en) * 1993-12-21 1995-07-14 Sumitomo Bakelite Co Ltd Laminated board for printed circuit
JP2911113B2 (en) * 1997-06-02 1999-06-23 工業技術院長 High performance lubricating oil
BR9908621A (en) * 1998-03-03 2000-10-31 Ppg Ind Ohio Inc Fiberglass filaments coated with inorganic lubricant and products including these

Also Published As

Publication number Publication date
WO2001063986A1 (en) 2001-08-30
US20020085888A1 (en) 2002-07-04

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