AU2001243246A1 - High speed photoresist stripping chamber - Google Patents

High speed photoresist stripping chamber

Info

Publication number
AU2001243246A1
AU2001243246A1 AU2001243246A AU4324601A AU2001243246A1 AU 2001243246 A1 AU2001243246 A1 AU 2001243246A1 AU 2001243246 A AU2001243246 A AU 2001243246A AU 4324601 A AU4324601 A AU 4324601A AU 2001243246 A1 AU2001243246 A1 AU 2001243246A1
Authority
AU
Australia
Prior art keywords
high speed
photoresist stripping
stripping chamber
speed photoresist
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001243246A
Inventor
Wayne L. Johnson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2001243246A1 publication Critical patent/AU2001243246A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67213—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H01J2237/3342—Resist stripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU2001243246A 2000-03-20 2001-03-20 High speed photoresist stripping chamber Abandoned AU2001243246A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US19009900P 2000-03-20 2000-03-20
US60190099 2000-03-20
PCT/US2001/005821 WO2001072094A1 (en) 2000-03-20 2001-03-20 High speed photoresist stripping chamber

Publications (1)

Publication Number Publication Date
AU2001243246A1 true AU2001243246A1 (en) 2001-10-03

Family

ID=22700011

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001243246A Abandoned AU2001243246A1 (en) 2000-03-20 2001-03-20 High speed photoresist stripping chamber

Country Status (4)

Country Link
US (1) US20030029833A1 (en)
AU (1) AU2001243246A1 (en)
TW (1) TW567737B (en)
WO (1) WO2001072094A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5021112B2 (en) * 2000-08-11 2012-09-05 キヤノンアネルバ株式会社 Vacuum processing equipment
KR20040054091A (en) * 2002-12-17 2004-06-25 아남반도체 주식회사 Method for manufacturing semiconductor
KR101133090B1 (en) * 2005-03-30 2012-04-04 파나소닉 주식회사 Impurity introduction apparatus and method of impurity introduction
JP4860167B2 (en) * 2005-03-30 2012-01-25 東京エレクトロン株式会社 Load lock device, processing system, and processing method
JP2007201128A (en) * 2006-01-26 2007-08-09 Sumitomo Electric Ind Ltd Semiconductor manufacturing apparatus, and wafer holder therefor
US7605063B2 (en) * 2006-05-10 2009-10-20 Lam Research Corporation Photoresist stripping chamber and methods of etching photoresist on substrates
US7655933B2 (en) * 2006-08-15 2010-02-02 Varian Semiconductor Equipment Associates, Inc. Techniques for temperature-controlled ion implantation
US8450193B2 (en) * 2006-08-15 2013-05-28 Varian Semiconductor Equipment Associates, Inc. Techniques for temperature-controlled ion implantation
US7935942B2 (en) * 2006-08-15 2011-05-03 Varian Semiconductor Equipment Associates, Inc. Technique for low-temperature ion implantation
US20090056877A1 (en) 2007-08-31 2009-03-05 Tokyo Electron Limited Plasma processing apparatus
JP5410950B2 (en) * 2009-01-15 2014-02-05 株式会社日立ハイテクノロジーズ Plasma processing equipment
JP5099101B2 (en) * 2009-01-23 2012-12-12 東京エレクトロン株式会社 Plasma processing equipment
US20110039390A1 (en) * 2009-08-14 2011-02-17 Taiwan Semiconductor Manufacturing Company, Ltd. Reducing Local Mismatch of Devices Using Cryo-Implantation
JP5698043B2 (en) * 2010-08-04 2015-04-08 株式会社ニューフレアテクノロジー Semiconductor manufacturing equipment
US9663854B2 (en) * 2013-03-14 2017-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. High-throughput system and method for post-implantation single wafer warm-up
US10428426B2 (en) * 2016-04-22 2019-10-01 Applied Materials, Inc. Method and apparatus to prevent deposition rate/thickness drift, reduce particle defects and increase remote plasma system lifetime
CN113658891A (en) * 2021-08-19 2021-11-16 上海稷以科技有限公司 Wafer processing device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH573985A5 (en) * 1973-11-22 1976-03-31 Balzers Patent Beteilig Ag
US5259881A (en) * 1991-05-17 1993-11-09 Materials Research Corporation Wafer processing cluster tool batch preheating and degassing apparatus
KR0170391B1 (en) * 1989-06-16 1999-03-30 다카시마 히로시 Processing apparatus with a gas distributor having back and forth parallel movement relative to a workpiece support
JP2756502B2 (en) * 1989-06-16 1998-05-25 東京エレクトロン株式会社 Ashing processing apparatus and method
US5591269A (en) * 1993-06-24 1997-01-07 Tokyo Electron Limited Vacuum processing apparatus
US5982986A (en) * 1995-02-03 1999-11-09 Applied Materials, Inc. Apparatus and method for rotationally aligning and degassing semiconductor substrate within single vacuum chamber
US5863170A (en) * 1996-04-16 1999-01-26 Gasonics International Modular process system
US6217663B1 (en) * 1996-06-21 2001-04-17 Kokusai Electric Co., Ltd. Substrate processing apparatus and substrate processing method
US5802856A (en) * 1996-07-31 1998-09-08 Stanford University Multizone bake/chill thermal cycling module
JP3215643B2 (en) * 1997-01-31 2001-10-09 ワイエイシイ株式会社 Plasma processing equipment
DE19742923A1 (en) * 1997-09-29 1999-04-01 Leybold Systems Gmbh Device for coating a substantially flat, disc-shaped substrate
US6410172B1 (en) * 1999-11-23 2002-06-25 Advanced Ceramics Corporation Articles coated with aluminum nitride by chemical vapor deposition

Also Published As

Publication number Publication date
US20030029833A1 (en) 2003-02-13
WO2001072094A1 (en) 2001-09-27
TW567737B (en) 2003-12-21

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