AU2001241232A1 - Wet etching apparatus for semiconductor circuit and method for manufacturing etching needle used in apparatus - Google Patents

Wet etching apparatus for semiconductor circuit and method for manufacturing etching needle used in apparatus

Info

Publication number
AU2001241232A1
AU2001241232A1 AU2001241232A AU4123201A AU2001241232A1 AU 2001241232 A1 AU2001241232 A1 AU 2001241232A1 AU 2001241232 A AU2001241232 A AU 2001241232A AU 4123201 A AU4123201 A AU 4123201A AU 2001241232 A1 AU2001241232 A1 AU 2001241232A1
Authority
AU
Australia
Prior art keywords
etching
semiconductor circuit
needle used
manufacturing
wet etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001241232A
Inventor
Willy Eom
Young Il Jang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SAMBON TLG CO Ltd
Original Assignee
SAMBON TLG CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SAMBON TLG CO Ltd filed Critical SAMBON TLG CO Ltd
Publication of AU2001241232A1 publication Critical patent/AU2001241232A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
AU2001241232A 2000-03-08 2001-03-08 Wet etching apparatus for semiconductor circuit and method for manufacturing etching needle used in apparatus Abandoned AU2001241232A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR0011620 2000-03-08
KR10-2000-0011620A KR100397390B1 (en) 2000-03-08 2000-03-08 Wet etching apparatus for semiconductor circuit and manufacturing method for minute tip used in its apparatus
PCT/KR2001/000363 WO2001073833A1 (en) 2000-03-08 2001-03-08 Wet etching apparatus for semiconductor circuit and method for manufacturing etching needle used in apparatus

Publications (1)

Publication Number Publication Date
AU2001241232A1 true AU2001241232A1 (en) 2001-10-08

Family

ID=19653383

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001241232A Abandoned AU2001241232A1 (en) 2000-03-08 2001-03-08 Wet etching apparatus for semiconductor circuit and method for manufacturing etching needle used in apparatus

Country Status (4)

Country Link
KR (1) KR100397390B1 (en)
AU (1) AU2001241232A1 (en)
TW (1) TW457575B (en)
WO (1) WO2001073833A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150042017A1 (en) * 2013-08-06 2015-02-12 Applied Materials, Inc. Three-dimensional (3d) processing and printing with plasma sources
CN103658980B (en) * 2013-11-27 2015-04-08 武汉法利莱切割系统工程有限责任公司 Main unit of square tube laser cutting machine
CN106363307A (en) * 2016-11-24 2017-02-01 京磁材料科技股份有限公司 Novel machining method for NdFeB
CN108557887B (en) * 2018-06-01 2020-02-14 中科院合肥技术创新工程院 Preparation method of molybdate-containing solution
CN110373708B (en) * 2019-07-31 2021-04-30 东南大学 Nano needle tip preparation platform and method for adjusting concentration to realize needle tip cone angle control
TWI783693B (en) * 2021-09-22 2022-11-11 財團法人工業技術研究院 Method and device for making tapered capillary

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5041229A (en) * 1988-12-21 1991-08-20 Board Of Regents, The University Of Texas System Aerosol jet etching
JPH07245287A (en) * 1994-03-04 1995-09-19 Fuji Xerox Co Ltd Wet etching apparatus
JP2871614B2 (en) * 1996-09-05 1999-03-17 芝浦メカトロニクス株式会社 Wet etching method and apparatus
JPH10209112A (en) * 1997-01-27 1998-08-07 Tera Tec:Kk Etching method and equipment
JPH10270414A (en) * 1997-03-25 1998-10-09 Tera Tec:Kk Etching method and apparatus
DE19854743A1 (en) * 1998-11-27 2000-06-08 Sez Semiconduct Equip Zubehoer Device for wet etching an edge of a semiconductor wafer

Also Published As

Publication number Publication date
WO2001073833A1 (en) 2001-10-04
KR100397390B1 (en) 2003-09-13
TW457575B (en) 2001-10-01
KR20010087718A (en) 2001-09-21

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