AU2001232890A1 - Isolation technique for pressure sensing structure - Google Patents

Isolation technique for pressure sensing structure

Info

Publication number
AU2001232890A1
AU2001232890A1 AU2001232890A AU3289001A AU2001232890A1 AU 2001232890 A1 AU2001232890 A1 AU 2001232890A1 AU 2001232890 A AU2001232890 A AU 2001232890A AU 3289001 A AU3289001 A AU 3289001A AU 2001232890 A1 AU2001232890 A1 AU 2001232890A1
Authority
AU
Australia
Prior art keywords
pressure sensing
sensing structure
isolation technique
isolation
technique
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001232890A
Other languages
English (en)
Inventor
James H. Hoffman
Gerald Lopopolo
David E. Wagner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SILICON VALLEY SENSORS Inc
Original Assignee
SILICON VALLEY SENSORS Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SILICON VALLEY SENSORS Inc filed Critical SILICON VALLEY SENSORS Inc
Publication of AU2001232890A1 publication Critical patent/AU2001232890A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • G01L19/0645—Protection against aggressive medium in general using isolation membranes, specially adapted for protection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/145—Housings with stress relieving means
    • G01L19/146—Housings with stress relieving means using flexible element between the transducer and the support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Child & Adolescent Psychology (AREA)
  • Measuring Fluid Pressure (AREA)
AU2001232890A 2000-01-19 2001-01-19 Isolation technique for pressure sensing structure Abandoned AU2001232890A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/489,560 2000-01-19
US09/489,560 US6550337B1 (en) 2000-01-19 2000-01-19 Isolation technique for pressure sensing structure
PCT/US2001/001962 WO2001053789A1 (fr) 2000-01-19 2001-01-19 Technique d'isolation pour structure de detection de pression

Publications (1)

Publication Number Publication Date
AU2001232890A1 true AU2001232890A1 (en) 2001-07-31

Family

ID=23944355

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001232890A Abandoned AU2001232890A1 (en) 2000-01-19 2001-01-19 Isolation technique for pressure sensing structure

Country Status (3)

Country Link
US (2) US6550337B1 (fr)
AU (1) AU2001232890A1 (fr)
WO (1) WO2001053789A1 (fr)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6550337B1 (en) * 2000-01-19 2003-04-22 Measurement Specialties, Inc. Isolation technique for pressure sensing structure
JP3845615B2 (ja) * 2002-03-12 2006-11-15 アドバンス電気工業株式会社 流量センサー
JP2003315193A (ja) * 2002-04-24 2003-11-06 Denso Corp 圧力センサ
DE10228000A1 (de) * 2002-06-22 2004-01-08 Robert Bosch Gmbh Vorrichtung zur Druckmessung
JP3969228B2 (ja) * 2002-07-19 2007-09-05 松下電工株式会社 機械的変形量検出センサ及びそれを用いた加速度センサ、圧力センサ
JP4166528B2 (ja) * 2002-08-07 2008-10-15 株式会社デンソー 容量式力学量センサ
US6907787B2 (en) * 2003-04-30 2005-06-21 Honeywell International Inc. Surface acoustic wave pressure sensor with microstructure sensing elements
US7037805B2 (en) * 2003-05-07 2006-05-02 Honeywell International Inc. Methods and apparatus for attaching a die to a substrate
US6927098B2 (en) * 2003-05-07 2005-08-09 Honeywell International Inc. Methods and apparatus for attaching MEMS devices to housing
JP2004361308A (ja) * 2003-06-06 2004-12-24 Fuji Electric Device Technology Co Ltd 物理量検出装置および物理量検出手段格納ケース
US7082835B2 (en) * 2003-06-18 2006-08-01 Honeywell International Inc. Pressure sensor apparatus and method
US6923068B2 (en) * 2003-06-19 2005-08-02 Dynisco, Inc. Pressure transducer
EP1682859A4 (fr) * 2003-08-11 2007-08-22 Analog Devices Inc Capteur capacitif
US7415883B2 (en) * 2004-06-28 2008-08-26 Zuli Holdings Ltd Method for protecting resonating sensors and open protected resonating sensors
US8162839B2 (en) * 2003-08-27 2012-04-24 Microtech Medical Technologies Ltd. Protected passive resonating sensors
US8529724B2 (en) * 2003-10-01 2013-09-10 The Charles Stark Draper Laboratory, Inc. Anodic bonding of silicon carbide to glass
US7024937B2 (en) * 2003-12-03 2006-04-11 Honeywell International Inc. Isolated pressure transducer
US7000298B2 (en) * 2004-04-20 2006-02-21 Honeywell International Inc. Method a quartz sensor
JP4260678B2 (ja) * 2004-05-20 2009-04-30 日本炭酸瓦斯株式会社 支燃性又は可燃性を有する高圧ガスを収容する容器の封止方法
JP4185477B2 (ja) * 2004-07-23 2008-11-26 長野計器株式会社 圧力センサ
US7205701B2 (en) * 2004-09-03 2007-04-17 Honeywell International Inc. Passive wireless acoustic wave chemical sensor
US7165455B2 (en) * 2004-12-18 2007-01-23 Honeywell International Inc. Surface acoustic wave sensor methods and systems
KR100772039B1 (ko) * 2004-12-24 2007-10-31 엘지전자 주식회사 스캐닝 마이크로미러 패키지 및 그 제조 방법과, 이를사용한 광 스캐닝 장치
DE102005053861A1 (de) * 2005-11-11 2007-05-16 Bosch Gmbh Robert Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung
US20070114643A1 (en) * 2005-11-22 2007-05-24 Honeywell International Inc. Mems flip-chip packaging
US7491567B2 (en) * 2005-11-22 2009-02-17 Honeywell International Inc. MEMS device packaging methods
EP1837303A1 (fr) * 2006-03-24 2007-09-26 Infineon Technologies SensoNor AS Socle intégré pour monter une structure MEMS
US20080222884A1 (en) * 2007-03-14 2008-09-18 Honeywell International Inc. Packaging for chip-on-board pressure sensor
US20080277747A1 (en) * 2007-05-08 2008-11-13 Nazir Ahmad MEMS device support structure for sensor packaging
US7798010B2 (en) * 2007-10-11 2010-09-21 Honeywell International Inc. Sensor geometry for improved package stress isolation
US8643127B2 (en) * 2008-08-21 2014-02-04 S3C, Inc. Sensor device packaging
DE102008043644A1 (de) * 2008-11-11 2010-05-12 Robert Bosch Gmbh Drucksensor
US7775119B1 (en) * 2009-03-03 2010-08-17 S3C, Inc. Media-compatible electrically isolated pressure sensor for high temperature applications
US8037771B2 (en) * 2009-05-13 2011-10-18 Lsi Corporation Electronic pressure-sensing device
IT1394791B1 (it) * 2009-05-20 2012-07-13 Metallux Sa Sensore di pressione
US8371175B2 (en) * 2009-10-01 2013-02-12 Rosemount Inc. Pressure transmitter with pressure sensor mount
CN102125760B (zh) * 2010-01-14 2014-04-30 鸿富锦精密工业（深圳）有限公司 游戏鼓
US7997141B1 (en) * 2010-01-24 2011-08-16 Jui-Yang Lo Oil pressure sensor
WO2011103720A1 (fr) * 2010-02-26 2011-09-01 Ubotic Intellectual Property Co., Ltd. Boîtier de semi-conducteur pour dispositif mems et son procédé de fabrication
WO2011141534A1 (fr) * 2010-05-12 2011-11-17 Ifm Electronic Gmbh Ensemble permettant de relier un appareil de mesure à un récipient contenant le fluide à mesurer
US8371176B2 (en) * 2011-01-06 2013-02-12 Honeywell International Inc. Media isolated pressure sensor
US8171800B1 (en) * 2011-01-25 2012-05-08 Continental Automotive Systems, Inc. Differential pressure sensor using dual backside absolute pressure sensing
DE102011102837A1 (de) 2011-05-30 2012-12-06 Epcos Ag Drucksensor und Verfahren zur Herstellung eines Drucksensors
ITTO20110577A1 (it) * 2011-06-30 2012-12-31 Stmicroelectronics Malta Ltd Incapsulamento per un sensore mems e relativo procedimento di fabbricazione
US8516897B1 (en) 2012-02-21 2013-08-27 Honeywell International Inc. Pressure sensor
US9027410B2 (en) * 2012-09-14 2015-05-12 Sensata Technologies, Inc. Hermetically glass sealed pressure sensor
JP6425723B2 (ja) * 2013-07-19 2018-11-21 ローズマウント インコーポレイテッド ２ピース式の隔離プラグのある隔離部品を有する圧力伝送器
US9261425B2 (en) * 2014-01-02 2016-02-16 Rosemount Aerospace Inc. High temperature pressure sensor
US9310267B2 (en) 2014-02-28 2016-04-12 Measurement Specialities, Inc. Differential pressure sensor
US9316552B2 (en) 2014-02-28 2016-04-19 Measurement Specialties, Inc. Differential pressure sensing die
US9593995B2 (en) 2014-02-28 2017-03-14 Measurement Specialties, Inc. Package for a differential pressure sensing die
US9655262B2 (en) * 2014-04-18 2017-05-16 Rosemount Aerospace Inc. Header sub-assemblies
CN104259630B (zh) * 2014-09-16 2017-02-08 中国电子科技集团公司第二十研究所 一种测角天线的焊接方法及焊接系统
US9915577B2 (en) * 2014-12-02 2018-03-13 Sensata Technologies, Inc. Case isolated oil filled MEMS pressure sensor
DE102015104410B4 (de) * 2015-03-24 2018-09-13 Tdk-Micronas Gmbh Drucksensor
US9663357B2 (en) * 2015-07-15 2017-05-30 Texas Instruments Incorporated Open cavity package using chip-embedding technology
US10101234B2 (en) * 2016-02-11 2018-10-16 Rosemount Aerospace, Inc. Open diaphragm harsh environment pressure sensor
CN107290099B (zh) 2016-04-11 2021-06-08 森萨塔科技公司 压力传感器、用于压力传感器的插塞件和制造插塞件的方法
EP3236226B1 (fr) 2016-04-20 2019-07-24 Sensata Technologies, Inc. Procédé de fabrication d'un capteur de pression
US9945747B1 (en) * 2016-10-13 2018-04-17 Honeywell International Inc. Gel filled port pressure sensor for robust media sealing
US9878904B1 (en) * 2016-10-25 2018-01-30 Rosemount Aerospace Inc. MEMS sensor with electronics integration
CN106430085A (zh) * 2016-12-09 2017-02-22 苏州美仑凯力电子有限公司 一种mems压力传感器封装的保护方法
US10551261B2 (en) 2017-02-28 2020-02-04 Rosemount Inc. Joint for brittle materials
US10036676B1 (en) * 2017-03-15 2018-07-31 Honeywell International Inc. Microelectromechanical systems (MEMS) force die with buried cavity vented to the edges
US10545064B2 (en) 2017-05-04 2020-01-28 Sensata Technologies, Inc. Integrated pressure and temperature sensor
US10544040B2 (en) * 2017-05-05 2020-01-28 Dunan Microstaq, Inc. Method and structure for preventing solder flow into a MEMS pressure port during MEMS die attachment
US10323998B2 (en) 2017-06-30 2019-06-18 Sensata Technologies, Inc. Fluid pressure sensor
US10724907B2 (en) 2017-07-12 2020-07-28 Sensata Technologies, Inc. Pressure sensor element with glass barrier material configured for increased capacitive response
DE102017212422B4 (de) 2017-07-20 2024-06-27 Robert Bosch Gmbh Drucksensoranordnung und Verfahren zu deren Herstellung
DE102017212866A1 (de) * 2017-07-26 2019-01-31 Robert Bosch Gmbh Drucksensoranordnung, Messvorrichtung und Verfahren zu deren Herstellung
DE102017212838A1 (de) 2017-07-26 2019-01-31 Robert Bosch Gmbh Drucksensoranordnung, Messvorrichtung und Verfahren zu deren Herstellung
DE102017213354A1 (de) * 2017-08-02 2019-02-07 Robert Bosch Gmbh Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren
US10557770B2 (en) 2017-09-14 2020-02-11 Sensata Technologies, Inc. Pressure sensor with improved strain gauge
CN107907262A (zh) * 2017-12-20 2018-04-13 深圳瑞德感知科技有限公司 一种用于负压测量的mems充油压力传感器
CN108267259A (zh) * 2018-03-19 2018-07-10 深圳瑞德感知科技有限公司 陶瓷mems压力传感器
CN208721114U (zh) * 2018-09-21 2019-04-09 罗伯特·博世有限公司 一种传感器装置
US11460363B2 (en) 2019-03-29 2022-10-04 Honeywell International Inc. Pressure sensors and methods of manufacturing a pressure sensor
JP7319181B2 (ja) * 2019-12-05 2023-08-01 アズビル株式会社 封止構造およびその製造方法
US11573145B2 (en) 2020-03-31 2023-02-07 Rosemount Aerospace Inc. Capacitive MEMS pressure sensor and method of manufacture
WO2023186273A1 (fr) * 2022-03-29 2023-10-05 Zf Cv Systems Europe Bv Capteur de pression modulaire

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1138401A (en) 1965-05-06 1969-01-01 Mallory & Co Inc P R Bonding
US3697917A (en) 1971-08-02 1972-10-10 Gen Electric Semiconductor strain gage pressure transducer
US4006640A (en) * 1976-02-06 1977-02-08 Honeywell Inc. Seal for process pressure to current transmitter
US4454440A (en) 1978-12-22 1984-06-12 United Technologies Corporation Surface acoustic wave (SAW) pressure sensor structure
US4222277A (en) 1979-08-13 1980-09-16 Kulite Semiconductor Products, Inc. Media compatible pressure transducer
US4322980A (en) 1979-11-08 1982-04-06 Hitachi, Ltd. Semiconductor pressure sensor having plural pressure sensitive diaphragms and method
US4406993A (en) 1981-08-28 1983-09-27 Kulite Semiconductor Products, Inc. Oil filled pressure transducers
JPS58146827A (ja) * 1982-02-25 1983-09-01 Fuji Electric Co Ltd 半導体式圧力センサ
EP0195232B1 (fr) 1985-03-20 1991-12-11 Hitachi, Ltd. Capteur de la charge piézorésistif
US4716492A (en) * 1986-05-05 1987-12-29 Texas Instruments Incorporated Pressure sensor with improved capacitive pressure transducer
US4771639A (en) * 1987-09-02 1988-09-20 Yokogawa Electric Corporation Semiconductor pressure sensor
CH679700A5 (en) 1989-09-27 1992-03-31 Siemens Ag Albis Thick or thin film pressure sensor - has grooved ceramics substrate acting as flexure membrane with attached piezo-resistors
JP2595829B2 (ja) 1991-04-22 1997-04-02 株式会社日立製作所 差圧センサ、及び複合機能形差圧センサ
IL106790A (en) * 1992-09-01 1996-08-04 Rosemount Inc A capacitive pressure sensation consisting of the bracket and the process of creating it
US5461922A (en) 1993-07-27 1995-10-31 Lucas-Novasensor Pressure sensor isolated within housing having integral diaphragm and method of making same
US5465626A (en) 1994-04-04 1995-11-14 Motorola, Inc. Pressure sensor with stress isolation platform hermetically sealed to protect sensor die
US5454270A (en) 1994-06-06 1995-10-03 Motorola, Inc. Hermetically sealed pressure sensor and method thereof
JPH08178778A (ja) * 1994-12-27 1996-07-12 Mitsubishi Electric Corp 半導体圧力検出装置
US5591679A (en) 1995-04-12 1997-01-07 Sensonor A/S Sealed cavity arrangement method
US6323550B1 (en) * 1995-06-06 2001-11-27 Analog Devices, Inc. Package for sealing an integrated circuit die
JPH09222372A (ja) * 1996-02-19 1997-08-26 Mitsubishi Electric Corp 半導体式センサ
US5824910A (en) 1997-04-16 1998-10-20 The United States Of America As Represented By The Secretary Of The Navy Miniature hydrostat fabricated using multiple microelectromechanical processes
JPH11201846A (ja) * 1998-01-12 1999-07-30 Mitsubishi Electric Corp 半導体圧力検出装置
US6232150B1 (en) * 1998-12-03 2001-05-15 The Regents Of The University Of Michigan Process for making microstructures and microstructures made thereby
US6229190B1 (en) 1998-12-18 2001-05-08 Maxim Integrated Products, Inc. Compensated semiconductor pressure sensor
US6452238B1 (en) * 1999-10-04 2002-09-17 Texas Instruments Incorporated MEMS wafer level package
US6550337B1 (en) * 2000-01-19 2003-04-22 Measurement Specialties, Inc. Isolation technique for pressure sensing structure
US6272928B1 (en) * 2000-01-24 2001-08-14 Kulite Semiconductor Products Hermetically sealed absolute and differential pressure transducer
US6401545B1 (en) * 2000-01-25 2002-06-11 Motorola, Inc. Micro electro-mechanical system sensor with selective encapsulation and method therefor
US6441481B1 (en) * 2000-04-10 2002-08-27 Analog Devices, Inc. Hermetically sealed microstructure package
US6448109B1 (en) * 2000-11-15 2002-09-10 Analog Devices, Inc. Wafer level method of capping multiple MEMS elements
US6608370B1 (en) * 2002-01-28 2003-08-19 Motorola, Inc. Semiconductor wafer having a thin die and tethers and methods of making the same

Also Published As

Publication number Publication date
WO2001053789A9 (fr) 2002-10-24
WO2001053789A1 (fr) 2001-07-26
US6938490B2 (en) 2005-09-06
US6550337B1 (en) 2003-04-22
US20030150275A1 (en) 2003-08-14

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