AU2001223384A1 - Method for controlling plasma density or the distribution thereof - Google Patents

Method for controlling plasma density or the distribution thereof

Info

Publication number
AU2001223384A1
AU2001223384A1 AU2001223384A AU2338401A AU2001223384A1 AU 2001223384 A1 AU2001223384 A1 AU 2001223384A1 AU 2001223384 A AU2001223384 A AU 2001223384A AU 2338401 A AU2338401 A AU 2338401A AU 2001223384 A1 AU2001223384 A1 AU 2001223384A1
Authority
AU
Australia
Prior art keywords
distribution
plasma density
controlling plasma
controlling
density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001223384A
Inventor
Siegfried Krassnitzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OC Oerlikon Balzers AG
Original Assignee
Unaxis Balzers AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unaxis Balzers AG filed Critical Unaxis Balzers AG
Publication of AU2001223384A1 publication Critical patent/AU2001223384A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
AU2001223384A 2000-02-23 2001-01-12 Method for controlling plasma density or the distribution thereof Abandoned AU2001223384A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH3512000 2000-02-23
CH351/00 2000-02-23
PCT/CH2001/000021 WO2001063643A1 (en) 2000-02-23 2001-01-12 Method for controlling plasma density or the distribution thereof

Publications (1)

Publication Number Publication Date
AU2001223384A1 true AU2001223384A1 (en) 2001-09-03

Family

ID=4509359

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001223384A Abandoned AU2001223384A1 (en) 2000-02-23 2001-01-12 Method for controlling plasma density or the distribution thereof

Country Status (5)

Country Link
US (3) US6821397B2 (en)
EP (1) EP1258026B1 (en)
JP (1) JP5493196B2 (en)
AU (1) AU2001223384A1 (en)
WO (1) WO2001063643A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1258026B1 (en) * 2000-02-23 2016-12-28 Evatec AG Method for controlling plasma density or the distribution thereof in a magnetron sputter source and magnetron sputter source
DE10234859B4 (en) * 2002-07-31 2007-05-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Device and method for coating substrates
DE102005019100B4 (en) * 2005-04-25 2009-02-12 Steag Hamatech Ag Magnetic system for a sputtering cathode
US8008632B2 (en) * 2008-07-24 2011-08-30 Seagate Technology Llc Two-zone ion beam carbon deposition
US8066857B2 (en) 2008-12-12 2011-11-29 Fujifilm Corporation Shaped anode and anode-shield connection for vacuum physical vapor deposition
US8043487B2 (en) * 2008-12-12 2011-10-25 Fujifilm Corporation Chamber shield for vacuum physical vapor deposition
CN102859639B (en) * 2010-02-10 2016-03-09 欧瑞康先进科技股份公司 Magnetron source and manufacture method
US8133362B2 (en) * 2010-02-26 2012-03-13 Fujifilm Corporation Physical vapor deposition with multi-point clamp
US9181619B2 (en) * 2010-02-26 2015-11-10 Fujifilm Corporation Physical vapor deposition with heat diffuser
EP2729955B1 (en) * 2011-07-15 2018-12-19 IHI Hauzer Techno Coating B.V. Apparatus and method for the pretreatment and/or for the coating of an article in a vacuum chamber with a hipims power source
KR102360357B1 (en) 2013-02-08 2022-02-09 에바텍 아크티엔게젤샤프트 Method of HIPIMS sputtering and HIPIMS sputter system
WO2016126650A1 (en) 2015-02-03 2016-08-11 Cardinal Cg Company Sputtering apparatus including gas distribution system
US10056238B2 (en) 2016-06-27 2018-08-21 Cardinal Cg Company Adjustable return path magnet assembly and methods
US10151023B2 (en) 2016-06-27 2018-12-11 Cardinal Cg Company Laterally adjustable return path magnet assembly and methods
US10790127B2 (en) 2017-05-04 2020-09-29 Cardinal Cg Company Flexible adjustable return path magnet assembly and methods
US10536130B2 (en) 2017-08-29 2020-01-14 Mks Instruments, Inc. Balancing RF circuit and control for a cross-coupled SIMO distribution network
RU2691357C1 (en) * 2018-07-09 2019-06-11 Федеральное государственное бюджетное научное учреждение "Федеральный исследовательский центр "Красноярский научный центр Сибирского отделения Российской академии наук" (ФИЦ КНЦ СО РАН, КНЦ СО РАН) Device for ion-plasma sputtering
DE102018213534A1 (en) 2018-08-10 2020-02-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Device and method for producing layers with improved uniformity in coating systems with horizontally rotating substrate guidance
US20210020484A1 (en) * 2019-07-15 2021-01-21 Applied Materials, Inc. Aperture design for uniformity control in selective physical vapor deposition
DE102020201829A1 (en) 2020-02-13 2021-08-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Device and method for producing layers with improved uniformity in coating systems with horizontally rotating substrate guides with additional plasma sources

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3624150C2 (en) * 1986-07-17 1994-02-24 Leybold Ag Atomizing cathode based on the magnetron principle
JPH0718005B2 (en) * 1987-06-16 1995-03-01 株式会社日立製作所 Sputtering device
US5130005A (en) * 1990-10-31 1992-07-14 Materials Research Corporation Magnetron sputter coating method and apparatus with rotating magnet cathode
US5252194A (en) 1990-01-26 1993-10-12 Varian Associates, Inc. Rotating sputtering apparatus for selected erosion
DE4102102C2 (en) * 1991-01-25 1995-09-07 Leybold Ag Magnet arrangement with at least two permanent magnets and their use
JPH04259372A (en) * 1991-02-08 1992-09-14 Matsushita Electric Ind Co Ltd Sputtering apparatus
US5314597A (en) * 1992-03-20 1994-05-24 Varian Associates, Inc. Sputtering apparatus with a magnet array having a geometry for a specified target erosion profile
US5417833A (en) * 1993-04-14 1995-05-23 Varian Associates, Inc. Sputtering apparatus having a rotating magnet array and fixed electromagnets
US5616225A (en) * 1994-03-23 1997-04-01 The Boc Group, Inc. Use of multiple anodes in a magnetron for improving the uniformity of its plasma
JP3814764B2 (en) * 1995-02-23 2006-08-30 東京エレクトロン株式会社 Sputtering method
US5512150A (en) * 1995-03-09 1996-04-30 Hmt Technology Corporation Target assembly having inner and outer targets
US5659276A (en) * 1995-07-12 1997-08-19 Shin-Etsu Chemical Co., Ltd. Magnetic field generator for magnetron plasma
JP3919266B2 (en) * 1996-09-27 2007-05-23 キヤノンアネルバ株式会社 Magnetron cathode electrode of sputtering equipment
JPH10140345A (en) * 1996-11-14 1998-05-26 Hitachi Ltd Sputtering electrode and magnetron sputtering device
US5873989A (en) * 1997-02-06 1999-02-23 Intevac, Inc. Methods and apparatus for linear scan magnetron sputtering
US6464841B1 (en) 1997-03-04 2002-10-15 Tokyo Electron Limited Cathode having variable magnet configuration
JPH11158625A (en) * 1997-11-25 1999-06-15 Sony Corp Magnetron sputtering film forming device
JP4431910B2 (en) * 1999-05-07 2010-03-17 ソニー株式会社 Sputtering cathode and magnetron type sputtering apparatus provided with the same
US6402903B1 (en) * 2000-02-04 2002-06-11 Steag Hamatech Ag Magnetic array for sputtering system
EP1258026B1 (en) * 2000-02-23 2016-12-28 Evatec AG Method for controlling plasma density or the distribution thereof in a magnetron sputter source and magnetron sputter source

Also Published As

Publication number Publication date
JP2003524706A (en) 2003-08-19
US7368041B2 (en) 2008-05-06
US20080210548A1 (en) 2008-09-04
EP1258026B1 (en) 2016-12-28
WO2001063643A1 (en) 2001-08-30
US20050051423A1 (en) 2005-03-10
JP5493196B2 (en) 2014-05-14
US20030042130A1 (en) 2003-03-06
EP1258026A1 (en) 2002-11-20
US7678240B2 (en) 2010-03-16
US6821397B2 (en) 2004-11-23

Similar Documents

Publication Publication Date Title
AU2001223384A1 (en) Method for controlling plasma density or the distribution thereof
AU5346099A (en) Methods for controlling gibberellin levels
AU2001245283A1 (en) Methods for treating aneurysms
AU2002213831A1 (en) Actuating member and method for producing the same
AU2001272928A1 (en) Distribution system
AU2001265797A1 (en) Beam forming method
AU2001260985A1 (en) Control technique for microlithography lasers
AU2002300818A1 (en) Game machine and method for controlling the game machine
AU2002219136A1 (en) Method for stabilizing polyolefins
AU2001287815A1 (en) Method and assist-platform for controlling shops
AU2002333819A1 (en) Methods for controlling screenouts
AU2001290102A1 (en) Control apparatus
AU2000276782A1 (en) Spray-spin coating method
AU2001234730A1 (en) Method for inhibiting complement activation
AUPR152100A0 (en) Method for treating coral
AU2001279897A1 (en) Plasma coating method
AU2001233699A1 (en) Method for selecting products
AU2001287668A1 (en) Method for the sterilisation of objects
AU2002214487A1 (en) Method for inducing apoptiosis
AU2001256898A1 (en) Method for substrate noise distribution
AU5325300A (en) Erosion control apparatus
AU2001269283A1 (en) Distributed control method
AU2001244284A1 (en) Particle coating method
AU2001243297A1 (en) Method for treating or preventing depression
AU2002221904A1 (en) Ceiling and method for producing the same