AU2001218942A1 - Cleaning method and etching method - Google Patents
Cleaning method and etching methodInfo
- Publication number
- AU2001218942A1 AU2001218942A1 AU2001218942A AU1894201A AU2001218942A1 AU 2001218942 A1 AU2001218942 A1 AU 2001218942A1 AU 2001218942 A AU2001218942 A AU 2001218942A AU 1894201 A AU1894201 A AU 1894201A AU 2001218942 A1 AU2001218942 A1 AU 2001218942A1
- Authority
- AU
- Australia
- Prior art keywords
- cleaning
- etching
- etching method
- cleaning method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title 2
- 238000004140 cleaning Methods 0.000 title 1
- 238000005530 etching Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23K—FODDER
- A23K10/00—Animal feeding-stuffs
- A23K10/30—Animal feeding-stuffs from material of plant origin, e.g. roots, seeds or hay; from material of fungal origin, e.g. mushrooms
- A23K10/37—Animal feeding-stuffs from material of plant origin, e.g. roots, seeds or hay; from material of fungal origin, e.g. mushrooms from waste material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D11/00—Solvent extraction
- B01D11/04—Solvent extraction of solutions which are liquid
- B01D11/0488—Flow sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
- H01L21/02049—Dry cleaning only with gaseous HF
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
- Y02P60/80—Food processing, e.g. use of renewable energies or variable speed drives in handling, conveying or stacking
- Y02P60/87—Re-use of by-products of food processing for fodder production
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- Physiology (AREA)
- Food Science & Technology (AREA)
- Animal Husbandry (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Zoology (AREA)
- Mycology (AREA)
- Biotechnology (AREA)
- Molecular Biology (AREA)
- Botany (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2000/008974 WO2002050883A1 (fr) | 2000-12-18 | 2000-12-18 | Procede de nettoyage et procede d'attaque |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001218942A1 true AU2001218942A1 (en) | 2002-07-01 |
Family
ID=11736805
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001218942A Abandoned AU2001218942A1 (en) | 2000-12-18 | 2000-12-18 | Cleaning method and etching method |
AU2002222670A Abandoned AU2002222670A1 (en) | 2000-12-18 | 2001-12-17 | Cleaning and etching methods and their apparatuses |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002222670A Abandoned AU2002222670A1 (en) | 2000-12-18 | 2001-12-17 | Cleaning and etching methods and their apparatuses |
Country Status (6)
Country | Link |
---|---|
US (3) | US6939409B2 (zh) |
JP (2) | JPWO2002050883A1 (zh) |
CN (1) | CN1461493A (zh) |
AU (2) | AU2001218942A1 (zh) |
TW (1) | TW571340B (zh) |
WO (2) | WO2002050883A1 (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1461493A (zh) * | 2000-12-18 | 2003-12-10 | 住友精密工业株式会社 | 清洗方法和腐蚀方法 |
GB0413554D0 (en) * | 2004-06-17 | 2004-07-21 | Point 35 Microstructures Ltd | Improved method and apparartus for the etching of microstructures |
US7819981B2 (en) * | 2004-10-26 | 2010-10-26 | Advanced Technology Materials, Inc. | Methods for cleaning ion implanter components |
KR101299791B1 (ko) * | 2005-03-16 | 2013-08-23 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 시약의 고체 소스로부터 시약을 운반하기 위한 시스템 |
US20100112795A1 (en) * | 2005-08-30 | 2010-05-06 | Advanced Technology Materials, Inc. | Method of forming ultra-shallow junctions for semiconductor devices |
US8278222B2 (en) * | 2005-11-22 | 2012-10-02 | Air Products And Chemicals, Inc. | Selective etching and formation of xenon difluoride |
US20070117396A1 (en) * | 2005-11-22 | 2007-05-24 | Dingjun Wu | Selective etching of titanium nitride with xenon difluoride |
US20070129273A1 (en) * | 2005-12-07 | 2007-06-07 | Clark Philip G | In situ fluoride ion-generating compositions and uses thereof |
US7396770B2 (en) * | 2006-01-10 | 2008-07-08 | Hitachi Global Storage Technologies Netherlands B.V. | Post-parting etch to smooth silicon sliders |
US8603252B2 (en) * | 2006-04-26 | 2013-12-10 | Advanced Technology Materials, Inc. | Cleaning of semiconductor processing systems |
US20080142039A1 (en) * | 2006-12-13 | 2008-06-19 | Advanced Technology Materials, Inc. | Removal of nitride deposits |
JP4937724B2 (ja) * | 2006-12-15 | 2012-05-23 | 東京エレクトロン株式会社 | 基板載置台、基板載置台の製造方法、基板処理装置、流体供給機構 |
US8491752B2 (en) | 2006-12-15 | 2013-07-23 | Tokyo Electron Limited | Substrate mounting table and method for manufacturing same, substrate processing apparatus, and fluid supply mechanism |
TWI494975B (zh) | 2008-02-11 | 2015-08-01 | Advanced Tech Materials | 在半導體處理系統中離子源之清洗 |
JP2011018885A (ja) * | 2009-06-12 | 2011-01-27 | Seiko Epson Corp | パターン膜形成部材の製造方法、パターン膜形成部材、電気光学装置、電子機器 |
US20110021011A1 (en) | 2009-07-23 | 2011-01-27 | Advanced Technology Materials, Inc. | Carbon materials for carbon implantation |
GB2473851C (en) * | 2009-09-25 | 2013-08-21 | Memsstar Ltd | Improved selectivity in a xenon difluoride etch process |
CN108565198A (zh) | 2012-02-14 | 2018-09-21 | 恩特格里斯公司 | 用于改善注入束和源寿命性能的碳掺杂剂气体和协流 |
US10079150B2 (en) * | 2015-07-23 | 2018-09-18 | Spts Technologies Limited | Method and apparatus for dry gas phase chemically etching a structure |
US10651233B2 (en) * | 2018-08-21 | 2020-05-12 | Northrop Grumman Systems Corporation | Method for forming superconducting structures |
JP7224268B2 (ja) * | 2019-10-16 | 2023-02-17 | 三菱電機株式会社 | 光半導体装置の製造方法 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5298112A (en) * | 1987-08-28 | 1994-03-29 | Kabushiki Kaisha Toshiba | Method for removing composite attached to material by dry etching |
JP2724165B2 (ja) | 1987-08-28 | 1998-03-09 | 株式会社東芝 | 有機化合物膜の除去方法及び除去装置 |
DE3855636T2 (de) * | 1987-08-28 | 1997-03-27 | Toshiba Kawasaki Kk | Plasma-Entschichtungsverfahren für organische und anorganische Schichten |
JP2890432B2 (ja) * | 1989-01-10 | 1999-05-17 | 富士通株式会社 | 有機物の灰化方法 |
JPH0496222A (ja) | 1990-08-03 | 1992-03-27 | Fujitsu Ltd | 半導体装置の製造方法 |
US5182646A (en) | 1990-09-24 | 1993-01-26 | Thomson Consumer Electronics, Inc. | Linkable scan lists for a television receiver |
JPH07122539A (ja) * | 1993-10-25 | 1995-05-12 | Hitachi Ltd | 表面処理方法 |
US6124211A (en) * | 1994-06-14 | 2000-09-26 | Fsi International, Inc. | Cleaning method |
JPH0864559A (ja) * | 1994-06-14 | 1996-03-08 | Fsi Internatl Inc | 基板面から不要な物質を除去する方法 |
JPH08274072A (ja) | 1995-03-31 | 1996-10-18 | Toshiba Corp | 表面処理装置および表面処理方法 |
US6077451A (en) * | 1996-03-28 | 2000-06-20 | Kabushiki Kaisha Toshiba | Method and apparatus for etching of silicon materials |
JP3417239B2 (ja) | 1997-01-17 | 2003-06-16 | 三菱電機株式会社 | マイクロエレクトロメカニカルデバイスの作製方法 |
JP3337638B2 (ja) * | 1997-03-31 | 2002-10-21 | キヤノン株式会社 | フッ化物結晶の製造方法及び光学部品の製造方法 |
US6042738A (en) | 1997-04-16 | 2000-03-28 | Micrion Corporation | Pattern film repair using a focused particle beam system |
GB9709659D0 (en) * | 1997-05-13 | 1997-07-02 | Surface Tech Sys Ltd | Method and apparatus for etching a workpiece |
US6018065A (en) * | 1997-11-10 | 2000-01-25 | Advanced Technology Materials, Inc. | Method of fabricating iridium-based materials and structures on substrates, iridium source reagents therefor |
EP1049144A4 (en) * | 1997-12-17 | 2006-12-06 | Matsushita Electronics Corp | THIN SEMICONDUCTOR LAYER, METHOD AND DEVICE THEREOF, SEMICONDUCTOR COMPONENT AND METHOD FOR MANUFACTURING SAME |
JP2000164559A (ja) * | 1998-09-22 | 2000-06-16 | Seiko Epson Corp | シリコン系物質の選択エッチング方法および装置 |
US6482748B1 (en) * | 1999-09-03 | 2002-11-19 | Taiwan Semiconductor Manufacturing Company | Poly gate silicide inspection by back end etching |
JP2001102345A (ja) | 1999-09-27 | 2001-04-13 | Jun Kikuchi | 表面処理方法および装置 |
US7041224B2 (en) * | 1999-10-26 | 2006-05-09 | Reflectivity, Inc. | Method for vapor phase etching of silicon |
DE10028662A1 (de) * | 2000-06-09 | 2001-12-13 | Nokia Mobile Phones Ltd | Routefinder |
US6736987B1 (en) * | 2000-07-12 | 2004-05-18 | Techbank Corporation | Silicon etching apparatus using XeF2 |
CN1461493A (zh) * | 2000-12-18 | 2003-12-10 | 住友精密工业株式会社 | 清洗方法和腐蚀方法 |
US6936183B2 (en) * | 2001-10-17 | 2005-08-30 | Applied Materials, Inc. | Etch process for etching microstructures |
-
2000
- 2000-12-18 CN CN00820081A patent/CN1461493A/zh active Pending
- 2000-12-18 JP JP2002551892A patent/JPWO2002050883A1/ja not_active Withdrawn
- 2000-12-18 WO PCT/JP2000/008974 patent/WO2002050883A1/ja active Application Filing
- 2000-12-18 AU AU2001218942A patent/AU2001218942A1/en not_active Abandoned
- 2000-12-18 US US10/451,202 patent/US6939409B2/en not_active Expired - Fee Related
-
2001
- 2001-12-17 WO PCT/JP2001/011059 patent/WO2002050884A1/ja active Application Filing
- 2001-12-17 US US10/451,206 patent/US6913653B2/en not_active Expired - Fee Related
- 2001-12-17 JP JP2002551893A patent/JP4036751B2/ja not_active Expired - Fee Related
- 2001-12-17 AU AU2002222670A patent/AU2002222670A1/en not_active Abandoned
-
2002
- 2002-06-14 TW TW091113007A patent/TW571340B/zh not_active IP Right Cessation
-
2004
- 2004-12-27 US US11/024,163 patent/US20050109733A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US6939409B2 (en) | 2005-09-06 |
JPWO2002050883A1 (ja) | 2004-04-22 |
JP4036751B2 (ja) | 2008-01-23 |
CN1461493A (zh) | 2003-12-10 |
US20040069318A1 (en) | 2004-04-15 |
WO2002050884A1 (fr) | 2002-06-27 |
JPWO2002050884A1 (ja) | 2004-04-22 |
TW571340B (en) | 2004-01-11 |
US20040108296A1 (en) | 2004-06-10 |
AU2002222670A1 (en) | 2002-07-01 |
US20050109733A1 (en) | 2005-05-26 |
WO2002050883A1 (fr) | 2002-06-27 |
US6913653B2 (en) | 2005-07-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2001218942A1 (en) | Cleaning method and etching method | |
AU2001286589A1 (en) | Surface preparation agent and surface preparation method | |
EP1142507B8 (en) | Method and device for manufacturing brushes | |
AU2001281021A1 (en) | Gas-vapor cleaning method and system therefor | |
EP1158212A3 (en) | Hydraulic circuit cleaning apparatus and method | |
AU2002223874A1 (en) | Fabrication apparatus and method | |
GB0115878D0 (en) | Etching method | |
AU2000239097A1 (en) | Manufacturing apparatus and method | |
AU2001273646A1 (en) | Sanitizing device and associated method | |
AU3423701A (en) | Arrangement and method for cleaning fronts | |
AU2001237530A1 (en) | Method | |
EP1201517B8 (de) | Reinigungsanlage und Verfahren zum Betreiben derselben | |
AU2001241636A1 (en) | Halotherapy method | |
AU2001230253A1 (en) | Processing method | |
AU2001233002A1 (en) | Etching solution and method | |
AU2001290975A1 (en) | Cleaning device and associated method | |
AU2002256556A1 (en) | Sea-trosy and related methods | |
AU2002228949A1 (en) | Cervo circuit and method | |
AU2001260894A1 (en) | Method and device | |
AUPQ477799A0 (en) | Improved cleaning device and method | |
AU2001242939A1 (en) | Teat cleaning device and method | |
EP1121877A3 (en) | Cleaning device and method of construction | |
AU2001239619A1 (en) | Method and device for cleaning | |
AU2002228975A1 (en) | Method | |
AU2001235770A1 (en) | Method |