ATE73931T1 - Mehrschichtenstruktur zur bildung einer messvorrichtung bestehend aus einer kombination eines flussmessers und eines temperaturfuehlers sowie ein verfahren zur herstellung der messvorrichtung und dieser mehrschichtenstruktur. - Google Patents

Mehrschichtenstruktur zur bildung einer messvorrichtung bestehend aus einer kombination eines flussmessers und eines temperaturfuehlers sowie ein verfahren zur herstellung der messvorrichtung und dieser mehrschichtenstruktur.

Info

Publication number
ATE73931T1
ATE73931T1 AT87402415T AT87402415T ATE73931T1 AT E73931 T1 ATE73931 T1 AT E73931T1 AT 87402415 T AT87402415 T AT 87402415T AT 87402415 T AT87402415 T AT 87402415T AT E73931 T1 ATE73931 T1 AT E73931T1
Authority
AT
Austria
Prior art keywords
multilayer structure
metering device
copper
patterns
forming
Prior art date
Application number
AT87402415T
Other languages
English (en)
Inventor
Hebert Sallee
Daniel Quenard
Original Assignee
Centre Scient Tech Batiment
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre Scient Tech Batiment filed Critical Centre Scient Tech Batiment
Application granted granted Critical
Publication of ATE73931T1 publication Critical patent/ATE73931T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K17/00—Measuring quantity of heat
    • G01K17/06—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device
    • G01K17/08—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature
    • G01K17/20—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature across a radiating surface, combined with ascertainment of the heat transmission coefficient
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Measuring Volume Flow (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
  • Thermistors And Varistors (AREA)
AT87402415T 1986-11-05 1987-10-27 Mehrschichtenstruktur zur bildung einer messvorrichtung bestehend aus einer kombination eines flussmessers und eines temperaturfuehlers sowie ein verfahren zur herstellung der messvorrichtung und dieser mehrschichtenstruktur. ATE73931T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8615427A FR2606213B1 (fr) 1986-11-05 1986-11-05 Nouveau materiau composite de preference flexible, dispositif de mesure formant un fluxmetre et un capteur de temperature combines comprenant un tel materiau composite et procede de preparation d'un tel materiau
EP87402415A EP0269485B1 (de) 1986-11-05 1987-10-27 Mehrschichtenstruktur zur Bildung einer Messvorrichtung bestehend aus einer Kombination eines Flussmessers und eines Temperaturfühlers sowie ein Verfahren zur Herstellung der Messvorrichtung und dieser Mehrschichtenstruktur

Publications (1)

Publication Number Publication Date
ATE73931T1 true ATE73931T1 (de) 1992-04-15

Family

ID=9340555

Family Applications (1)

Application Number Title Priority Date Filing Date
AT87402415T ATE73931T1 (de) 1986-11-05 1987-10-27 Mehrschichtenstruktur zur bildung einer messvorrichtung bestehend aus einer kombination eines flussmessers und eines temperaturfuehlers sowie ein verfahren zur herstellung der messvorrichtung und dieser mehrschichtenstruktur.

Country Status (6)

Country Link
US (1) US4817436A (de)
EP (1) EP0269485B1 (de)
AT (1) ATE73931T1 (de)
CA (1) CA1293335C (de)
DE (1) DE3777552D1 (de)
FR (1) FR2606213B1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5180440A (en) * 1988-11-23 1993-01-19 Pace Incorporated Printed circuit thermocouple arrangements for personnel training and equipment evaluation purposes
FR2656089B1 (fr) * 1989-12-19 1992-04-10 Univ Lille Flandres Artois Procede et dispositif utilisant les effets thermoelectriques pour la mesure d'une grandeur physique dont la variation est apte a modifier les proprietes thermophysiques d'un milieu.
US5286304A (en) * 1991-10-24 1994-02-15 Enerdyne Corporation Thermoelectric device and method of manufacturing
FR2704979B1 (fr) * 1993-05-06 1995-07-21 Helverep Sa Procede de realisation d'un fluxmetre thermique et fluxmetre thermique obtenu selon ce procede.
GB9421707D0 (en) * 1994-10-27 1994-12-14 Raychem Sa Nv Environmental protection
NL1012709C2 (nl) * 1999-07-26 2001-02-01 Berkin Bv Werkwijze voor het vervaardigen van een thermozuil op een elektrisch isolerende drager.
JP4499274B2 (ja) * 2000-12-01 2010-07-07 東京エレクトロン株式会社 半導体処理装置における温度測定方法および半導体処理方法
US6651322B1 (en) * 2000-12-28 2003-11-25 Unisys Corporation Method of reworking a multilayer printed circuit board assembly
US6821015B2 (en) * 2002-01-25 2004-11-23 Robert Hammer Conducted heat vector sensor
FR2846091B1 (fr) * 2002-10-18 2005-01-28 Captec Comparateur de flux thermiques comportant un circuit d'activation
WO2006053386A1 (en) * 2004-11-18 2006-05-26 Rheem Australia Pty Limited Flexible pcb thermostrip
US7395717B2 (en) * 2006-02-10 2008-07-08 Milliken & Company Flexible capacitive sensor
US20150296607A1 (en) * 2014-04-11 2015-10-15 Apple Inc. Electronic Device With Flexible Printed Circuit Strain Gauge Sensor
US20150296622A1 (en) * 2014-04-11 2015-10-15 Apple Inc. Flexible Printed Circuit With Semiconductor Strain Gauge
CN113945295B (zh) * 2021-12-22 2022-04-22 广东则成科技有限公司 柔性热电堆式传感器及其制造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH413018A (de) * 1963-04-30 1966-05-15 Du Pont Thermoelektrischer Generator
US4050302A (en) * 1975-02-10 1977-09-27 Aluminum Company Of America Thermoelectric heat flow transducer
FR2413646A1 (fr) * 1978-01-02 1979-07-27 Saint Gobain Fluxmetre thermique
US4349958A (en) * 1979-06-01 1982-09-21 Gambro Ab Device for temperature measurement and a method for the manufacture of such a device
JPS5684987A (en) * 1979-12-14 1981-07-10 Seiko Epson Corp Ink system dot printer
JPS56108877A (en) * 1980-02-01 1981-08-28 Oki Electric Ind Co Ltd Manufacture of fluid spray nozzle
US4507854A (en) * 1980-09-25 1985-04-02 Gambro Crafon Ab Method of manufacturing temperature-sensitive instruments
JPS57200828A (en) * 1981-06-04 1982-12-09 Showa Denko Kk Manufacture of thermopile
JPS5810875A (ja) * 1981-07-14 1983-01-21 Toshiba Chem Corp シ−ト状熱電対の製造方法
JPS58117057A (ja) * 1981-12-30 1983-07-12 Fujitsu Ltd ビツト・パタ−ン発生回路
GB2116363B (en) * 1982-03-03 1985-10-16 Philips Electronic Associated Multi-level infra-red detectors and their manufacture
FR2536536B1 (fr) * 1982-11-18 1985-07-26 Anvar Fluxmetre thermique a thermocouples
JPS6010137A (ja) * 1983-06-30 1985-01-19 Toshiba Corp サ−モパイル

Also Published As

Publication number Publication date
FR2606213B1 (fr) 1989-03-31
EP0269485A1 (de) 1988-06-01
EP0269485B1 (de) 1992-03-18
CA1293335C (en) 1991-12-17
US4817436A (en) 1989-04-04
FR2606213A1 (fr) 1988-05-06
DE3777552D1 (de) 1992-04-23

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Legal Events

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UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee