ATE73931T1 - MULTILAYER STRUCTURE FOR FORMING A METERING DEVICE CONSISTING OF A COMBINATION OF A FLOW METER AND A TEMPERATURE SENSOR, AND A METHOD OF MANUFACTURING THE METERING DEVICE AND SUCH MULTILAYER STRUCTURE. - Google Patents

MULTILAYER STRUCTURE FOR FORMING A METERING DEVICE CONSISTING OF A COMBINATION OF A FLOW METER AND A TEMPERATURE SENSOR, AND A METHOD OF MANUFACTURING THE METERING DEVICE AND SUCH MULTILAYER STRUCTURE.

Info

Publication number
ATE73931T1
ATE73931T1 AT87402415T AT87402415T ATE73931T1 AT E73931 T1 ATE73931 T1 AT E73931T1 AT 87402415 T AT87402415 T AT 87402415T AT 87402415 T AT87402415 T AT 87402415T AT E73931 T1 ATE73931 T1 AT E73931T1
Authority
AT
Austria
Prior art keywords
multilayer structure
metering device
copper
patterns
forming
Prior art date
Application number
AT87402415T
Other languages
German (de)
Inventor
Hebert Sallee
Daniel Quenard
Original Assignee
Centre Scient Tech Batiment
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre Scient Tech Batiment filed Critical Centre Scient Tech Batiment
Application granted granted Critical
Publication of ATE73931T1 publication Critical patent/ATE73931T1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K17/00—Measuring quantity of heat
    • G01K17/06—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device
    • G01K17/08—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature
    • G01K17/20—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature across a radiating surface, combined with ascertainment of the heat transmission coefficient
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered

Abstract

The invention relates to a composite material, which comprises a sheet of insulating matter comprising on one face a meandering strip of Constantan covered with zones of copper, so as to define a fluxmeter formed by successive rows of individual thermocouples. Between the rows defined between the meanders of the strip are provided free spaces in which are made first patterns likewise of Constantan constituting a first arm of a thermocouple; the other face of the insulating sheet is coated with a sheet of copper in which are provided second patterns likewise of copper constituting a second arm of thermocouples. The first patterns and the second patterns are in electrical contact by metal welds also of copper, thus forming temperature detector thermocouples. A composite material is thus obtained forming a fluxmeter and a temperature sensor combined in a single device making it possible to detect the measurements in one plane, which is easy to manufacture.
AT87402415T 1986-11-05 1987-10-27 MULTILAYER STRUCTURE FOR FORMING A METERING DEVICE CONSISTING OF A COMBINATION OF A FLOW METER AND A TEMPERATURE SENSOR, AND A METHOD OF MANUFACTURING THE METERING DEVICE AND SUCH MULTILAYER STRUCTURE. ATE73931T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8615427A FR2606213B1 (en) 1986-11-05 1986-11-05 NOVEL COMPOSITE MATERIAL PREFERABLY FLEXIBLE, MEASURING DEVICE FORMING A FLUX METER AND A TEMPERATURE SENSOR COMPRISING SUCH A COMPOSITE MATERIAL AND METHOD FOR PREPARING SUCH A MATERIAL
EP87402415A EP0269485B1 (en) 1986-11-05 1987-10-27 Combination of a fluxmeter and a temperature-sensing device incorporating a multilayed structure, and process for preparing such a device and such a multilayed structure

Publications (1)

Publication Number Publication Date
ATE73931T1 true ATE73931T1 (en) 1992-04-15

Family

ID=9340555

Family Applications (1)

Application Number Title Priority Date Filing Date
AT87402415T ATE73931T1 (en) 1986-11-05 1987-10-27 MULTILAYER STRUCTURE FOR FORMING A METERING DEVICE CONSISTING OF A COMBINATION OF A FLOW METER AND A TEMPERATURE SENSOR, AND A METHOD OF MANUFACTURING THE METERING DEVICE AND SUCH MULTILAYER STRUCTURE.

Country Status (6)

Country Link
US (1) US4817436A (en)
EP (1) EP0269485B1 (en)
AT (1) ATE73931T1 (en)
CA (1) CA1293335C (en)
DE (1) DE3777552D1 (en)
FR (1) FR2606213B1 (en)

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US5180440A (en) * 1988-11-23 1993-01-19 Pace Incorporated Printed circuit thermocouple arrangements for personnel training and equipment evaluation purposes
FR2656089B1 (en) * 1989-12-19 1992-04-10 Univ Lille Flandres Artois METHOD AND DEVICE USING THERMOELECTRIC EFFECTS FOR THE MEASUREMENT OF A PHYSICAL QUANTITY WHOSE VARIATION IS CAPABLE OF MODIFYING THE THERMOPHYSICAL PROPERTIES OF A MEDIUM.
US5286304A (en) * 1991-10-24 1994-02-15 Enerdyne Corporation Thermoelectric device and method of manufacturing
FR2704979B1 (en) * 1993-05-06 1995-07-21 Helverep Sa PROCESS FOR PRODUCING A THERMAL FLUXMETER AND THERMAL FLUXMETER OBTAINED ACCORDING TO THIS PROCESS.
GB9421707D0 (en) * 1994-10-27 1994-12-14 Raychem Sa Nv Environmental protection
NL1012709C2 (en) * 1999-07-26 2001-02-01 Berkin Bv Method for manufacturing a thermopile on an electrically insulating support.
JP4499274B2 (en) * 2000-12-01 2010-07-07 東京エレクトロン株式会社 Temperature measuring method and semiconductor processing method in semiconductor processing apparatus
US6651322B1 (en) * 2000-12-28 2003-11-25 Unisys Corporation Method of reworking a multilayer printed circuit board assembly
US6821015B2 (en) * 2002-01-25 2004-11-23 Robert Hammer Conducted heat vector sensor
FR2846091B1 (en) * 2002-10-18 2005-01-28 Captec THERMAL FLOW COMPARATOR HAVING AN ACTIVATION CIRCUIT
WO2006053386A1 (en) * 2004-11-18 2006-05-26 Rheem Australia Pty Limited Flexible pcb thermostrip
US7395717B2 (en) * 2006-02-10 2008-07-08 Milliken & Company Flexible capacitive sensor
US20150296607A1 (en) * 2014-04-11 2015-10-15 Apple Inc. Electronic Device With Flexible Printed Circuit Strain Gauge Sensor
US20150296622A1 (en) * 2014-04-11 2015-10-15 Apple Inc. Flexible Printed Circuit With Semiconductor Strain Gauge
CN113945295B (en) * 2021-12-22 2022-04-22 广东则成科技有限公司 Flexible thermopile sensor and method of making same

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
CH413018A (en) * 1963-04-30 1966-05-15 Du Pont Thermoelectric generator
US4050302A (en) * 1975-02-10 1977-09-27 Aluminum Company Of America Thermoelectric heat flow transducer
FR2413646A1 (en) * 1978-01-02 1979-07-27 Saint Gobain THERMAL FLUXMETER
US4349958A (en) * 1979-06-01 1982-09-21 Gambro Ab Device for temperature measurement and a method for the manufacture of such a device
JPS5684987A (en) * 1979-12-14 1981-07-10 Seiko Epson Corp Ink system dot printer
JPS56108877A (en) * 1980-02-01 1981-08-28 Oki Electric Ind Co Ltd Manufacture of fluid spray nozzle
US4507854A (en) * 1980-09-25 1985-04-02 Gambro Crafon Ab Method of manufacturing temperature-sensitive instruments
JPS57200828A (en) * 1981-06-04 1982-12-09 Showa Denko Kk Manufacture of thermopile
JPS5810875A (en) * 1981-07-14 1983-01-21 Toshiba Chem Corp Manufacture of sheet shaped thermocouple
JPS58117057A (en) * 1981-12-30 1983-07-12 Fujitsu Ltd Bit pattern generating circuit
GB2116363B (en) * 1982-03-03 1985-10-16 Philips Electronic Associated Multi-level infra-red detectors and their manufacture
FR2536536B1 (en) * 1982-11-18 1985-07-26 Anvar THERMAL-COUPLED THERMAL FLUXMETER
JPS6010137A (en) * 1983-06-30 1985-01-19 Toshiba Corp Thermopile

Also Published As

Publication number Publication date
EP0269485A1 (en) 1988-06-01
FR2606213B1 (en) 1989-03-31
FR2606213A1 (en) 1988-05-06
DE3777552D1 (en) 1992-04-23
US4817436A (en) 1989-04-04
CA1293335C (en) 1991-12-17
EP0269485B1 (en) 1992-03-18

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Legal Events

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UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee