ATE555499T1 - N-kanal-esd-klemme mit verbesserter leistung - Google Patents
N-kanal-esd-klemme mit verbesserter leistungInfo
- Publication number
- ATE555499T1 ATE555499T1 AT07841332T AT07841332T ATE555499T1 AT E555499 T1 ATE555499 T1 AT E555499T1 AT 07841332 T AT07841332 T AT 07841332T AT 07841332 T AT07841332 T AT 07841332T AT E555499 T1 ATE555499 T1 AT E555499T1
- Authority
- AT
- Austria
- Prior art keywords
- esd
- nfet
- gate
- supply node
- nfets
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/003—Modifications for increasing the reliability for protection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/811—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements
- H10D89/819—Bias arrangements for gate electrodes of FETs, e.g. RC networks or voltage partitioning circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Logic Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US84027506P | 2006-08-24 | 2006-08-24 | |
| US11/738,336 US7724485B2 (en) | 2006-08-24 | 2007-04-20 | N-channel ESD clamp with improved performance |
| PCT/US2007/076763 WO2008024973A2 (en) | 2006-08-24 | 2007-08-24 | N-channel esd clamp with improved performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE555499T1 true ATE555499T1 (de) | 2012-05-15 |
Family
ID=39107719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT07841332T ATE555499T1 (de) | 2006-08-24 | 2007-08-24 | N-kanal-esd-klemme mit verbesserter leistung |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7724485B2 (de) |
| EP (1) | EP2057682B1 (de) |
| JP (1) | JP5074500B2 (de) |
| KR (1) | KR101109283B1 (de) |
| CN (1) | CN101506976B (de) |
| AT (1) | ATE555499T1 (de) |
| TW (1) | TW200820414A (de) |
| WO (1) | WO2008024973A2 (de) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8064175B2 (en) | 2005-09-15 | 2011-11-22 | Rambus Inc. | Power supply shunt |
| US8130481B2 (en) * | 2007-08-08 | 2012-03-06 | Texas Instruments Incorporated | Electrostatic discharge trigger circuits for self-protecting cascode stages |
| US20090268359A1 (en) * | 2008-04-25 | 2009-10-29 | International Business Machines Corporation | Electrostatic discharge power clamp with improved electrical overstress robustness |
| TWI382290B (zh) * | 2008-08-14 | 2013-01-11 | Realtek Semiconductor Corp | 靜電保護電路 |
| US8760827B2 (en) * | 2009-04-15 | 2014-06-24 | International Business Machines Corporation | Robust ESD protection circuit, method and design structure for tolerant and failsafe designs |
| TWI387093B (zh) * | 2009-08-26 | 2013-02-21 | Faraday Tech Corp | 利用低壓元件實現的低漏電高壓電源靜電放電保護電路 |
| CN102013672B (zh) * | 2009-09-08 | 2014-04-16 | 智原科技股份有限公司 | 利用低压元件实现的低漏电高压电源静电放电保护电路 |
| US8345394B2 (en) * | 2009-10-05 | 2013-01-01 | Analog Devices, Inc. | ESD protection circuit for a switching power converter |
| US8422180B2 (en) * | 2009-12-17 | 2013-04-16 | Faraday Technology Corp. | High-voltage-tolerant ESD clamp circuit with low leakage current fabricated by low-voltage CMOS process |
| US8217703B2 (en) | 2010-06-30 | 2012-07-10 | Analog Devices, Inc. | Low power fast level shifter |
| US9013842B2 (en) | 2011-01-10 | 2015-04-21 | Infineon Technologies Ag | Semiconductor ESD circuit and method |
| US8670219B2 (en) * | 2011-06-16 | 2014-03-11 | Monolithic Power Systems, Inc. | High-voltage devices with integrated over-voltage protection and associated methods |
| US9013938B1 (en) | 2011-12-02 | 2015-04-21 | Cypress Semiconductor Corporation | Systems and methods for discharging load capacitance circuits |
| US8929040B2 (en) | 2013-01-31 | 2015-01-06 | International Business Machines Corporation | ESD protection device for SST transmitter |
| KR102078340B1 (ko) * | 2013-07-17 | 2020-02-18 | 삼성디스플레이 주식회사 | 정전기 보호 회로 및 이를 구비한 전자 장치 |
| US20150084702A1 (en) * | 2013-09-26 | 2015-03-26 | Triquint Semiconductor, Inc. | Electrostatic discharge (esd) circuitry |
| WO2015065310A1 (en) * | 2013-10-28 | 2015-05-07 | Intel Corporation | Mesh performance improvement using dual voltage data transfer |
| US9413169B2 (en) | 2014-04-02 | 2016-08-09 | Globalfoundries Inc. | Electrostatic discharge protection circuit with a fail-safe mechanism |
| US9425185B2 (en) | 2014-05-29 | 2016-08-23 | Globalfoundries Inc. | Self-healing electrostatic discharge power clamp |
| US9537581B2 (en) * | 2014-06-30 | 2017-01-03 | Silicon Laboratories Inc. | Isolator including bi-directional regulator |
| US10630075B2 (en) | 2015-10-30 | 2020-04-21 | Intel IP Corporation | Multi-level output circuit having centralized ESD protection |
| GB2547730B (en) * | 2016-02-26 | 2018-08-01 | Cirrus Logic Int Semiconductor Ltd | Clamping audio signal paths |
| US10340687B2 (en) | 2016-03-07 | 2019-07-02 | Texas Instruments Incorporated | ESD protection circuit and method with high immunity to hot plug insertion and other transient events |
| US10170460B2 (en) | 2017-02-28 | 2019-01-01 | International Business Machines Corporation | Voltage balanced stacked clamp |
| CN116314177A (zh) | 2017-03-29 | 2023-06-23 | 意法半导体国际有限公司 | 使用遂穿场效应晶体管和碰撞电离mosfet器件的静电放电保护电路 |
| TW201929182A (zh) | 2017-12-27 | 2019-07-16 | 晨星半導體股份有限公司 | 靜電放電保護裝置 |
| US11063429B2 (en) | 2018-04-12 | 2021-07-13 | Stmicroelectronics International N.V. | Low leakage MOSFET supply clamp for electrostatic discharge (ESD) protection |
| US10944257B2 (en) | 2018-04-13 | 2021-03-09 | Stmicroelectronics International N.V. | Integrated silicon controlled rectifier (SCR) and a low leakage SCR supply clamp for electrostatic discharge (ESP) protection |
| US11088540B2 (en) * | 2018-10-30 | 2021-08-10 | Semiconductor Components Industries, Llc | Switch circuit with high voltage protection that reduces leakage currents |
| US11004843B2 (en) * | 2019-01-18 | 2021-05-11 | Nxp Usa, Inc. | Switch control circuit for a power switch with electrostatic discharge (ESD) protection |
| US10642303B1 (en) * | 2019-03-14 | 2020-05-05 | Nxp Usa, Inc. | Fast-enable current source |
| JP7110162B2 (ja) | 2019-09-13 | 2022-08-01 | 株式会社東芝 | 保護回路 |
| US10854604B1 (en) * | 2019-09-20 | 2020-12-01 | Qualcomm Incorporated | Offset gate contact |
| TWI878454B (zh) * | 2020-02-14 | 2025-04-01 | 美商賽納波狄克公司 | 用於cmos電路的靜電放電(esd)保護 |
| CN113270858A (zh) * | 2020-02-14 | 2021-08-17 | 辛纳普蒂克斯公司 | 用于cmos电路的静电放电(esd)保护 |
| DE102020132568A1 (de) * | 2020-03-31 | 2021-09-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Esd-schutzschaltung zum und zugehöriges betriebsverfahren |
| TWI769108B (zh) * | 2021-11-04 | 2022-06-21 | 瑞昱半導體股份有限公司 | 靜電放電保護電路 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0897362A (ja) * | 1994-09-28 | 1996-04-12 | Nittetsu Semiconductor Kk | 半導体集積回路の電源保護回路 |
| US5631793A (en) | 1995-09-05 | 1997-05-20 | Winbond Electronics Corporation | Capacitor-couple electrostatic discharge protection circuit |
| US6075686A (en) * | 1997-07-09 | 2000-06-13 | Industrial Technology Research Institute | ESD protection circuit for mixed mode integrated circuits with separated power pins |
| TW431042B (en) * | 1999-05-18 | 2001-04-21 | Sunplus Technology Co Ltd | Electrostatic discharge protection apparatus of polydiode |
| US6249410B1 (en) | 1999-08-23 | 2001-06-19 | Taiwan Semiconductor Manufacturing Company | ESD protection circuit without overstress gate-driven effect |
| US6552886B1 (en) * | 2000-06-29 | 2003-04-22 | Pericom Semiconductor Corp. | Active Vcc-to-Vss ESD clamp with hystersis for low supply chips |
| US6624992B1 (en) | 2000-10-06 | 2003-09-23 | Qualcomm, Incorporated | Electro-static discharge protection circuit |
| US7005708B2 (en) * | 2001-06-14 | 2006-02-28 | Sarnoff Corporation | Minimum-dimension, fully-silicided MOS driver and ESD protection design for optimized inter-finger coupling |
| US6943578B1 (en) * | 2004-03-31 | 2005-09-13 | International Business Machines Corporation | Method and application of PICA (picosecond imaging circuit analysis) for high current pulsed phenomena |
| US7256975B2 (en) | 2004-06-14 | 2007-08-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | ESD protection circuit and method |
| DE102004062205B4 (de) * | 2004-12-23 | 2007-04-05 | Infineon Technologies Ag | Schaltungsanordnung zum Schutz einer Schaltung vor elektrostatischen Entladungen |
| US8064175B2 (en) * | 2005-09-15 | 2011-11-22 | Rambus Inc. | Power supply shunt |
| US7405915B2 (en) * | 2006-03-03 | 2008-07-29 | Hynix Semiconductor Inc. | Protection circuit against electrostatic discharge in semiconductor device |
-
2007
- 2007-04-20 US US11/738,336 patent/US7724485B2/en active Active
- 2007-08-24 EP EP07841332A patent/EP2057682B1/de active Active
- 2007-08-24 TW TW096131488A patent/TW200820414A/zh unknown
- 2007-08-24 KR KR1020097006027A patent/KR101109283B1/ko active Active
- 2007-08-24 CN CN2007800314558A patent/CN101506976B/zh active Active
- 2007-08-24 AT AT07841332T patent/ATE555499T1/de active
- 2007-08-24 JP JP2009525794A patent/JP5074500B2/ja not_active Expired - Fee Related
- 2007-08-24 WO PCT/US2007/076763 patent/WO2008024973A2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008024973A3 (en) | 2008-07-03 |
| CN101506976A (zh) | 2009-08-12 |
| CN101506976B (zh) | 2012-08-08 |
| JP2010502130A (ja) | 2010-01-21 |
| KR101109283B1 (ko) | 2012-01-31 |
| WO2008024973A2 (en) | 2008-02-28 |
| EP2057682A2 (de) | 2009-05-13 |
| EP2057682B1 (de) | 2012-04-25 |
| KR20090051234A (ko) | 2009-05-21 |
| TW200820414A (en) | 2008-05-01 |
| US20080049365A1 (en) | 2008-02-28 |
| US7724485B2 (en) | 2010-05-25 |
| JP5074500B2 (ja) | 2012-11-14 |
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