ATE549367T1 - Uv-durchlässige polyedrische silsesquioxanpolymere - Google Patents

Uv-durchlässige polyedrische silsesquioxanpolymere

Info

Publication number
ATE549367T1
ATE549367T1 AT05814653T AT05814653T ATE549367T1 AT E549367 T1 ATE549367 T1 AT E549367T1 AT 05814653 T AT05814653 T AT 05814653T AT 05814653 T AT05814653 T AT 05814653T AT E549367 T1 ATE549367 T1 AT E549367T1
Authority
AT
Austria
Prior art keywords
polyhedral
functional groups
reactive functional
silicon atoms
transmitted
Prior art date
Application number
AT05814653T
Other languages
English (en)
Inventor
Norihiro Takamura
Ken-Ichi Shinotani
Richard M Laine
Lisa Viculis
Original Assignee
Panasonic Corp
Univ Michigan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Univ Michigan filed Critical Panasonic Corp
Application granted granted Critical
Publication of ATE549367T1 publication Critical patent/ATE549367T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/045Polysiloxanes containing less than 25 silicon atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/06Preparatory processes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/805Coatings
    • H10F39/8057Optical shielding
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/806Optical elements or arrangements associated with the image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/30Coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/30Coatings
    • H10F77/306Coatings for devices having potential barriers
    • H10F77/331Coatings for devices having potential barriers for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H10F77/334Coatings for devices having potential barriers for filtering or shielding light, e.g. multicolour filters for photodetectors for shielding light, e.g. light blocking layers or cold shields for infrared detectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476Organic materials comprising silicon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Silicon Polymers (AREA)
  • Rolling Contact Bearings (AREA)
AT05814653T 2004-12-07 2005-12-05 Uv-durchlässige polyedrische silsesquioxanpolymere ATE549367T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US63382104P 2004-12-07 2004-12-07
US11/075,042 US7915369B2 (en) 2004-12-07 2005-03-08 Ultraviolet transmissive polyhedral silsesquioxane polymers
PCT/JP2005/022719 WO2006062219A1 (en) 2004-12-07 2005-12-05 Ultraviolet transmissive polyhedral silsesquioxane polymers

Publications (1)

Publication Number Publication Date
ATE549367T1 true ATE549367T1 (de) 2012-03-15

Family

ID=36097005

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05814653T ATE549367T1 (de) 2004-12-07 2005-12-05 Uv-durchlässige polyedrische silsesquioxanpolymere

Country Status (6)

Country Link
US (2) US7915369B2 (de)
EP (2) EP2287231B1 (de)
JP (1) JP4664976B2 (de)
KR (1) KR100944740B1 (de)
AT (1) ATE549367T1 (de)
WO (1) WO2006062219A1 (de)

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EP2277948B1 (de) * 2004-11-02 2015-02-18 Bridgestone Corporation Polyeder-modifizierte Polymere
JP4826160B2 (ja) * 2005-07-28 2011-11-30 ナガセケムテックス株式会社 光素子封止用樹脂組成物
JP2007112977A (ja) * 2005-09-26 2007-05-10 Fujifilm Corp 絶縁膜形成用組成物、絶縁膜およびその製造方法
JP2007284652A (ja) * 2006-03-20 2007-11-01 Fujifilm Corp 組成物、膜、およびその製造方法
KR20090083330A (ko) * 2006-08-17 2009-08-03 유니버시티 오브 유타 리써치 파운데이션 덴드리머 및 그의 제조 및 사용 방법
JP2008074963A (ja) * 2006-09-21 2008-04-03 Fujifilm Corp 組成物、膜、およびその製造方法
WO2008069193A1 (ja) * 2006-12-04 2008-06-12 Panasonic Corporation 光ヘッド、光情報記録再生装置および光情報システム装置
KR101340995B1 (ko) * 2006-12-28 2013-12-13 엘지디스플레이 주식회사 액정표시소자용 박막 트랜지스터
JP2008201832A (ja) * 2007-02-16 2008-09-04 Shin Etsu Chem Co Ltd シロキサン重合体とその製造方法、該重合体を含有する多孔質膜形成用塗布液ならびに多孔質膜と、該多孔質膜を用いた半導体装置
JP4451457B2 (ja) * 2007-02-26 2010-04-14 富士通株式会社 絶縁膜材料及びその製造方法、多層配線及びその製造方法、並びに、半導体装置の製造方法
JP4996946B2 (ja) * 2007-03-02 2012-08-08 富士フイルム株式会社 反射防止膜形成用組成物、反射防止膜および光学デバイス
EP3042909B1 (de) * 2007-04-17 2018-08-01 Kaneka Corporation Modifiziertes polyhedrales polysiloxanprodukt und zusammensetzung, in der das modifizierte produkt verwendet wird
WO2009002660A2 (en) * 2007-06-15 2008-12-31 Mayaterials, Inc. Multi-functional silsesquioxanes for novel coating applications
US7868198B2 (en) * 2007-06-15 2011-01-11 Laine Richard M Multi-functional silsesquioxanes for novel coating applications
US7732553B2 (en) * 2008-02-28 2010-06-08 The Regents Of The University Of California Method of producing encapsulation resins
JP2011515513A (ja) * 2008-03-04 2011-05-19 エージェンシー フォー サイエンス,テクノロジー アンド リサーチ 低収縮多官能基化ssq樹脂
JP5401118B2 (ja) * 2008-12-10 2014-01-29 富士フイルム株式会社 組成物
CN102918110B (zh) 2010-05-28 2015-08-12 株式会社钟化 聚硅氧烷类组合物、固化物及光学器件
US9698320B2 (en) * 2010-09-22 2017-07-04 Kaneka Corporation Modified product of polyhedral structure polysiloxane, polyhedral structure polysiloxane composition, cured product, and optical semiconductor device
JP5694716B2 (ja) * 2010-09-22 2015-04-01 株式会社カネカ 多面体構造ポリシロキサン変性体およびこれから得られる組成物
JP5821761B2 (ja) * 2011-04-20 2015-11-24 セントラル硝子株式会社 シロキサン化合物およびその硬化物
US20130241404A1 (en) * 2012-03-14 2013-09-19 Peter Guschl Encapsulant compositions and methods for lighting devices
US20130241390A1 (en) * 2012-03-14 2013-09-19 Peter Guschl Metal-containing encapsulant compositions and methods
KR102016348B1 (ko) 2013-02-28 2019-08-30 주식회사 동진쎄미켐 광학소자 봉지용 수지 조성물
JP6337336B2 (ja) * 2013-03-26 2018-06-06 Jnc株式会社 アルコキシシリル基含有シルセスキオキサンおよびその組成物
KR102114141B1 (ko) * 2013-12-24 2020-05-22 엘지디스플레이 주식회사 하드 코팅 필름 및 이를 이용하는 표시 장치
WO2015114939A1 (ja) * 2014-01-31 2015-08-06 信越化学工業株式会社 オルガノポリシロキサン化合物及びその製造方法並びに付加硬化型シリコーン組成物
US10899937B2 (en) 2014-12-22 2021-01-26 U.S.A. As Represented By The Administrator Of The National Aeronautics And Space Administration Hydrogen-bonding surfaces for ice mitigation
CN118630073B (zh) * 2024-08-13 2024-12-10 比亚迪股份有限公司 一种电池

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US5330734A (en) 1993-03-09 1994-07-19 Exxon Research And Engineering Company Silica pillared micas
US5618878A (en) 1995-04-07 1997-04-08 Dow Corning Corporation Hydrogen silsesquioxane resin coating composition
US5939576A (en) * 1998-01-05 1999-08-17 The United States Of America As Represented By The Secretary Of The Air Force Method of functionalizing polycyclic silicones and the compounds so formed
US6911518B2 (en) * 1999-12-23 2005-06-28 Hybrid Plastics, Llc Polyhedral oligomeric -silsesquioxanes, -silicates and -siloxanes bearing ring-strained olefinic functionalities
US7261992B2 (en) 2000-12-21 2007-08-28 International Business Machines Corporation Fluorinated silsesquioxane polymers and use thereof in lithographic photoresist compositions
GR1004403B (el) 2002-05-30 2003-12-19 "����������", ���������� ����������������� Υλικα λιθογραφιας με βαση πολυμερη που περιεχουν πολυεδρικες ολιγομερεις σιλεναμισοξανες
US7037592B2 (en) 2003-02-25 2006-05-02 Dow Coming Corporation Hybrid composite of silicone and organic resins
JP4734832B2 (ja) 2003-05-14 2011-07-27 ナガセケムテックス株式会社 光素子用封止材
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US7576169B2 (en) * 2003-10-23 2009-08-18 The Regents Of The University Of Michigan Facile synthesis of polyhedral silsesquioxane anions and use thereof

Also Published As

Publication number Publication date
EP1833880B1 (de) 2012-03-14
JP2008523165A (ja) 2008-07-03
US20060122351A1 (en) 2006-06-08
KR20070093089A (ko) 2007-09-17
EP1833880A1 (de) 2007-09-19
WO2006062219A1 (en) 2006-06-15
US7915369B2 (en) 2011-03-29
KR100944740B1 (ko) 2010-03-05
EP2287231A2 (de) 2011-02-23
US20110251357A1 (en) 2011-10-13
EP2287231A3 (de) 2011-05-18
JP4664976B2 (ja) 2011-04-06
EP2287231B1 (de) 2012-06-06

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