ATE548851T1 - Festkörperbilderfassungsvorrichtung, ansteuerverfahren für festkörperbilderfassungsvorrichtung und bilderfassungsvorrichtung - Google Patents

Festkörperbilderfassungsvorrichtung, ansteuerverfahren für festkörperbilderfassungsvorrichtung und bilderfassungsvorrichtung

Info

Publication number
ATE548851T1
ATE548851T1 AT10000189T AT10000189T ATE548851T1 AT E548851 T1 ATE548851 T1 AT E548851T1 AT 10000189 T AT10000189 T AT 10000189T AT 10000189 T AT10000189 T AT 10000189T AT E548851 T1 ATE548851 T1 AT E548851T1
Authority
AT
Austria
Prior art keywords
image capture
capture device
solid state
state image
exposure
Prior art date
Application number
AT10000189T
Other languages
English (en)
Inventor
Keiji Mabuchi
Takeshi Yanagita
Yorito Sakano
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Application granted granted Critical
Publication of ATE548851T1 publication Critical patent/ATE548851T1/de

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/70Circuitry for compensating brightness variation in the scene
    • H04N23/73Circuitry for compensating brightness variation in the scene by influencing the exposure time
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50Control of the SSIS exposure
    • H04N25/53Control of the integration time
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers
    • H01L27/14654Blooming suppression
    • H01L27/14656Overflow drain structures
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/62Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels
    • H04N25/621Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels for the control of blooming
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
AT10000189T 2009-01-28 2010-01-11 Festkörperbilderfassungsvorrichtung, ansteuerverfahren für festkörperbilderfassungsvorrichtung und bilderfassungsvorrichtung ATE548851T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009016265A JP5359315B2 (ja) 2009-01-28 2009-01-28 固体撮像装置、固体撮像装置の駆動方法および撮像装置

Publications (1)

Publication Number Publication Date
ATE548851T1 true ATE548851T1 (de) 2012-03-15

Family

ID=42026253

Family Applications (1)

Application Number Title Priority Date Filing Date
AT10000189T ATE548851T1 (de) 2009-01-28 2010-01-11 Festkörperbilderfassungsvorrichtung, ansteuerverfahren für festkörperbilderfassungsvorrichtung und bilderfassungsvorrichtung

Country Status (7)

Country Link
US (2) US8553124B2 (de)
EP (1) EP2214406B1 (de)
JP (1) JP5359315B2 (de)
KR (1) KR101666225B1 (de)
CN (1) CN101835001B (de)
AT (1) ATE548851T1 (de)
TW (1) TWI422221B (de)

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JP5530284B2 (ja) * 2010-07-22 2014-06-25 パナソニック株式会社 固体撮像装置及び撮像装置
CN102487436A (zh) * 2010-12-01 2012-06-06 英属开曼群岛商恒景科技股份有限公司 感测像素阵列及感测装置
JP5377549B2 (ja) * 2011-03-03 2013-12-25 株式会社東芝 固体撮像装置
KR101241553B1 (ko) * 2011-04-13 2013-03-11 엘지이노텍 주식회사 Wdr 픽셀 어레이, 이를 포함하는 wdr 이미징 장치 및 그 구동방법
KR101251744B1 (ko) * 2011-04-13 2013-04-05 엘지이노텍 주식회사 Wdr 픽셀 어레이, 이를 포함하는 wdr 이미징 장치 및 그 구동방법
JP5801602B2 (ja) * 2011-05-12 2015-10-28 ピクストロニクス,インコーポレイテッド 画像表示装置
TWI505453B (zh) * 2011-07-12 2015-10-21 Sony Corp 固態成像裝置,用於驅動其之方法,用於製造其之方法,及電子裝置
US8742311B2 (en) * 2012-02-27 2014-06-03 Omnivision Technologies, Inc. Enhanced pixel cell architecture for an image sensor having a direct output from a buried channel source follower transistor to a bit line
JP2014063889A (ja) * 2012-09-21 2014-04-10 Sony Corp 固体撮像素子および方法、並びに、電子機器
JP6132500B2 (ja) 2012-09-24 2017-05-24 キヤノン株式会社 撮像装置、撮像装置の駆動方法、および撮像システム。
JP2015099989A (ja) * 2013-11-18 2015-05-28 キヤノン株式会社 撮像装置
JP2015213274A (ja) * 2014-05-07 2015-11-26 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法、及び、電子機器
US9531976B2 (en) * 2014-05-29 2016-12-27 Semiconductor Components Industries, Llc Systems and methods for operating image sensor pixels having different sensitivities and shared charge storage regions
JP6395627B2 (ja) * 2015-02-03 2018-09-26 オリンパス株式会社 撮像装置、撮像装置の制御方法
CN113099139B (zh) * 2015-09-30 2024-06-21 株式会社尼康 摄像元件及电子相机
JP2017183563A (ja) * 2016-03-31 2017-10-05 ソニー株式会社 撮像装置、駆動方法、および、電子機器
CN106091912B (zh) * 2016-06-21 2018-05-25 威海华菱光电股份有限公司 膜厚检测装置
US10880503B2 (en) * 2016-10-03 2020-12-29 Sony Semiconductor Solutions Corporation Solid-state image pickup device and image pickup method, and electronic apparatus
US11050966B2 (en) * 2017-04-12 2021-06-29 Brillnics Singapore Pte. Ltd. Solid-state imaging device, method for driving solid-state imaging device, and electronic apparatus
WO2018221261A1 (ja) * 2017-06-02 2018-12-06 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置、及び電子機器
US10404928B2 (en) * 2017-07-06 2019-09-03 Himax Imaging Limited Image sensor and a method of operating the same
JP7114833B2 (ja) * 2018-01-22 2022-08-09 ブリルニクスジャパン株式会社 固体撮像装置、固体撮像装置の駆動方法、および電子機器
CN112585955B (zh) * 2018-08-22 2024-07-12 吉加焦特技术公司 分体式读出图像传感器
US11330218B2 (en) 2018-08-22 2022-05-10 Gigajot Technology, Inc. Split-readout image sensor
WO2020129435A1 (ja) * 2018-12-18 2020-06-25 ソニーセミコンダクタソリューションズ株式会社 イメージセンサ、記録装置、リセット方法
CN116686301A (zh) 2020-12-15 2023-09-01 Ams传感器比利时有限公司 光学传感器和包括其的电子设备

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JP3589901B2 (ja) * 1998-06-03 2004-11-17 Necエレクトロニクス株式会社 固体撮像装置およびその駆動方法
JP3951879B2 (ja) * 2002-10-04 2007-08-01 ソニー株式会社 固体撮像素子及びその駆動方法
US7489352B2 (en) * 2002-11-15 2009-02-10 Micron Technology, Inc. Wide dynamic range pinned photodiode active pixel sensor (APS)
US7196304B2 (en) 2004-01-29 2007-03-27 Micron Technology, Inc. Row driver for selectively supplying operating power to imager pixel
CN100444620C (zh) * 2004-12-27 2008-12-17 索尼株式会社 固态成像装置驱动方法、固态成像装置以及成像设备
JP4325557B2 (ja) 2005-01-04 2009-09-02 ソニー株式会社 撮像装置および撮像方法
JP4459064B2 (ja) * 2005-01-14 2010-04-28 キヤノン株式会社 固体撮像装置、その制御方法及びカメラ
JP2008028945A (ja) * 2006-07-25 2008-02-07 Sanyo Electric Co Ltd 撮像装置
JP4935486B2 (ja) * 2007-04-23 2012-05-23 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法、固体撮像装置の信号処理方法および撮像装置
JP5300306B2 (ja) * 2007-05-31 2013-09-25 キヤノン株式会社 画像処理装置、その制御方法、及びプログラム
KR101465667B1 (ko) * 2008-03-25 2014-11-26 삼성전자주식회사 Cmos 영상 센서 및 그 동작 방법
JP5039649B2 (ja) * 2008-06-30 2012-10-03 富士フイルム株式会社 撮像装置及び撮像装置の撮影制御方法

Also Published As

Publication number Publication date
KR101666225B1 (ko) 2016-10-13
JP5359315B2 (ja) 2013-12-04
CN101835001A (zh) 2010-09-15
US20130342728A1 (en) 2013-12-26
US9088726B2 (en) 2015-07-21
CN101835001B (zh) 2012-08-22
TW201103321A (en) 2011-01-16
US8553124B2 (en) 2013-10-08
JP2010177838A (ja) 2010-08-12
TWI422221B (zh) 2014-01-01
EP2214406A1 (de) 2010-08-04
EP2214406B1 (de) 2012-03-07
US20100188541A1 (en) 2010-07-29
KR20100087634A (ko) 2010-08-05

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