ATE548851T1 - Festkörperbilderfassungsvorrichtung, ansteuerverfahren für festkörperbilderfassungsvorrichtung und bilderfassungsvorrichtung - Google Patents
Festkörperbilderfassungsvorrichtung, ansteuerverfahren für festkörperbilderfassungsvorrichtung und bilderfassungsvorrichtungInfo
- Publication number
- ATE548851T1 ATE548851T1 AT10000189T AT10000189T ATE548851T1 AT E548851 T1 ATE548851 T1 AT E548851T1 AT 10000189 T AT10000189 T AT 10000189T AT 10000189 T AT10000189 T AT 10000189T AT E548851 T1 ATE548851 T1 AT E548851T1
- Authority
- AT
- Austria
- Prior art keywords
- image capture
- capture device
- solid state
- state image
- exposure
- Prior art date
Links
- 239000007787 solid Substances 0.000 title 2
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/70—Circuitry for compensating brightness variation in the scene
- H04N23/73—Circuitry for compensating brightness variation in the scene by influencing the exposure time
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/53—Control of the integration time
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14654—Blooming suppression
- H01L27/14656—Overflow drain structures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/62—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels
- H04N25/621—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels for the control of blooming
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009016265A JP5359315B2 (ja) | 2009-01-28 | 2009-01-28 | 固体撮像装置、固体撮像装置の駆動方法および撮像装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE548851T1 true ATE548851T1 (de) | 2012-03-15 |
Family
ID=42026253
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT10000189T ATE548851T1 (de) | 2009-01-28 | 2010-01-11 | Festkörperbilderfassungsvorrichtung, ansteuerverfahren für festkörperbilderfassungsvorrichtung und bilderfassungsvorrichtung |
Country Status (7)
Country | Link |
---|---|
US (2) | US8553124B2 (de) |
EP (1) | EP2214406B1 (de) |
JP (1) | JP5359315B2 (de) |
KR (1) | KR101666225B1 (de) |
CN (1) | CN101835001B (de) |
AT (1) | ATE548851T1 (de) |
TW (1) | TWI422221B (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5530284B2 (ja) * | 2010-07-22 | 2014-06-25 | パナソニック株式会社 | 固体撮像装置及び撮像装置 |
CN102487436A (zh) * | 2010-12-01 | 2012-06-06 | 英属开曼群岛商恒景科技股份有限公司 | 感测像素阵列及感测装置 |
JP5377549B2 (ja) * | 2011-03-03 | 2013-12-25 | 株式会社東芝 | 固体撮像装置 |
KR101241553B1 (ko) * | 2011-04-13 | 2013-03-11 | 엘지이노텍 주식회사 | Wdr 픽셀 어레이, 이를 포함하는 wdr 이미징 장치 및 그 구동방법 |
KR101251744B1 (ko) * | 2011-04-13 | 2013-04-05 | 엘지이노텍 주식회사 | Wdr 픽셀 어레이, 이를 포함하는 wdr 이미징 장치 및 그 구동방법 |
JP5801602B2 (ja) * | 2011-05-12 | 2015-10-28 | ピクストロニクス,インコーポレイテッド | 画像表示装置 |
TWI505453B (zh) * | 2011-07-12 | 2015-10-21 | Sony Corp | 固態成像裝置,用於驅動其之方法,用於製造其之方法,及電子裝置 |
US8742311B2 (en) * | 2012-02-27 | 2014-06-03 | Omnivision Technologies, Inc. | Enhanced pixel cell architecture for an image sensor having a direct output from a buried channel source follower transistor to a bit line |
JP2014063889A (ja) * | 2012-09-21 | 2014-04-10 | Sony Corp | 固体撮像素子および方法、並びに、電子機器 |
JP6132500B2 (ja) | 2012-09-24 | 2017-05-24 | キヤノン株式会社 | 撮像装置、撮像装置の駆動方法、および撮像システム。 |
JP2015099989A (ja) * | 2013-11-18 | 2015-05-28 | キヤノン株式会社 | 撮像装置 |
JP2015213274A (ja) * | 2014-05-07 | 2015-11-26 | ソニー株式会社 | 固体撮像装置、固体撮像装置の駆動方法、及び、電子機器 |
US9531976B2 (en) * | 2014-05-29 | 2016-12-27 | Semiconductor Components Industries, Llc | Systems and methods for operating image sensor pixels having different sensitivities and shared charge storage regions |
JP6395627B2 (ja) * | 2015-02-03 | 2018-09-26 | オリンパス株式会社 | 撮像装置、撮像装置の制御方法 |
CN113099139B (zh) * | 2015-09-30 | 2024-06-21 | 株式会社尼康 | 摄像元件及电子相机 |
JP2017183563A (ja) * | 2016-03-31 | 2017-10-05 | ソニー株式会社 | 撮像装置、駆動方法、および、電子機器 |
CN106091912B (zh) * | 2016-06-21 | 2018-05-25 | 威海华菱光电股份有限公司 | 膜厚检测装置 |
US10880503B2 (en) * | 2016-10-03 | 2020-12-29 | Sony Semiconductor Solutions Corporation | Solid-state image pickup device and image pickup method, and electronic apparatus |
US11050966B2 (en) * | 2017-04-12 | 2021-06-29 | Brillnics Singapore Pte. Ltd. | Solid-state imaging device, method for driving solid-state imaging device, and electronic apparatus |
WO2018221261A1 (ja) * | 2017-06-02 | 2018-12-06 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置、及び電子機器 |
US10404928B2 (en) * | 2017-07-06 | 2019-09-03 | Himax Imaging Limited | Image sensor and a method of operating the same |
JP7114833B2 (ja) * | 2018-01-22 | 2022-08-09 | ブリルニクスジャパン株式会社 | 固体撮像装置、固体撮像装置の駆動方法、および電子機器 |
CN112585955B (zh) * | 2018-08-22 | 2024-07-12 | 吉加焦特技术公司 | 分体式读出图像传感器 |
US11330218B2 (en) | 2018-08-22 | 2022-05-10 | Gigajot Technology, Inc. | Split-readout image sensor |
WO2020129435A1 (ja) * | 2018-12-18 | 2020-06-25 | ソニーセミコンダクタソリューションズ株式会社 | イメージセンサ、記録装置、リセット方法 |
CN116686301A (zh) | 2020-12-15 | 2023-09-01 | Ams传感器比利时有限公司 | 光学传感器和包括其的电子设备 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3589901B2 (ja) * | 1998-06-03 | 2004-11-17 | Necエレクトロニクス株式会社 | 固体撮像装置およびその駆動方法 |
JP3951879B2 (ja) * | 2002-10-04 | 2007-08-01 | ソニー株式会社 | 固体撮像素子及びその駆動方法 |
US7489352B2 (en) * | 2002-11-15 | 2009-02-10 | Micron Technology, Inc. | Wide dynamic range pinned photodiode active pixel sensor (APS) |
US7196304B2 (en) | 2004-01-29 | 2007-03-27 | Micron Technology, Inc. | Row driver for selectively supplying operating power to imager pixel |
CN100444620C (zh) * | 2004-12-27 | 2008-12-17 | 索尼株式会社 | 固态成像装置驱动方法、固态成像装置以及成像设备 |
JP4325557B2 (ja) | 2005-01-04 | 2009-09-02 | ソニー株式会社 | 撮像装置および撮像方法 |
JP4459064B2 (ja) * | 2005-01-14 | 2010-04-28 | キヤノン株式会社 | 固体撮像装置、その制御方法及びカメラ |
JP2008028945A (ja) * | 2006-07-25 | 2008-02-07 | Sanyo Electric Co Ltd | 撮像装置 |
JP4935486B2 (ja) * | 2007-04-23 | 2012-05-23 | ソニー株式会社 | 固体撮像装置、固体撮像装置の駆動方法、固体撮像装置の信号処理方法および撮像装置 |
JP5300306B2 (ja) * | 2007-05-31 | 2013-09-25 | キヤノン株式会社 | 画像処理装置、その制御方法、及びプログラム |
KR101465667B1 (ko) * | 2008-03-25 | 2014-11-26 | 삼성전자주식회사 | Cmos 영상 센서 및 그 동작 방법 |
JP5039649B2 (ja) * | 2008-06-30 | 2012-10-03 | 富士フイルム株式会社 | 撮像装置及び撮像装置の撮影制御方法 |
-
2009
- 2009-01-28 JP JP2009016265A patent/JP5359315B2/ja not_active Expired - Fee Related
-
2010
- 2010-01-11 EP EP10000189A patent/EP2214406B1/de not_active Not-in-force
- 2010-01-11 AT AT10000189T patent/ATE548851T1/de active
- 2010-01-11 TW TW099100583A patent/TWI422221B/zh active
- 2010-01-14 KR KR1020100003357A patent/KR101666225B1/ko active IP Right Grant
- 2010-01-20 US US12/690,537 patent/US8553124B2/en active Active
- 2010-01-28 CN CN2010101058213A patent/CN101835001B/zh active Active
-
2013
- 2013-08-27 US US14/011,402 patent/US9088726B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR101666225B1 (ko) | 2016-10-13 |
JP5359315B2 (ja) | 2013-12-04 |
CN101835001A (zh) | 2010-09-15 |
US20130342728A1 (en) | 2013-12-26 |
US9088726B2 (en) | 2015-07-21 |
CN101835001B (zh) | 2012-08-22 |
TW201103321A (en) | 2011-01-16 |
US8553124B2 (en) | 2013-10-08 |
JP2010177838A (ja) | 2010-08-12 |
TWI422221B (zh) | 2014-01-01 |
EP2214406A1 (de) | 2010-08-04 |
EP2214406B1 (de) | 2012-03-07 |
US20100188541A1 (en) | 2010-07-29 |
KR20100087634A (ko) | 2010-08-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE548851T1 (de) | Festkörperbilderfassungsvorrichtung, ansteuerverfahren für festkörperbilderfassungsvorrichtung und bilderfassungsvorrichtung | |
DE602006018678D1 (de) | Bildaufnahmevorrichtung und Bildaufnahmeverfahren | |
CN106559622B (zh) | 具有闪烁抑制和高动态范围的成像系统 | |
JP2009165051A5 (de) | ||
WO2006098955A3 (en) | Bar code reading device with global electronic shutter control | |
WO2009034978A1 (ja) | イメージセンサ | |
RU2009137360A (ru) | Устройство для съемки изображения | |
EP2550554A4 (de) | Härtbare schwarze zusammensetzung, lichtabschirmender farbfilter für eine festkörperabbildungsvorrichtung und verfahren zu seiner herstellung, festkörperabbildungsvorrichtung, linse auf waferebene und kameramodul | |
CN103685999A (zh) | 固态图像传感器、用于固态图像传感器的控制方法以及电子装置 | |
TW200703630A (en) | Optical sensor, solid-state image pickup device, and operation method of the solid-state image pickup device | |
KR20120103751A (ko) | 촬상장치 및 고체 촬상소자의 구동방법 | |
JP2015198361A5 (de) | ||
EP2180514A3 (de) | Festkörperabbildungsvorrichtung, Verfahren zur Ansteuerung eines Festkörperabbildungssensors, Abbildungsvorrichtung und elektronische Vorrichtung | |
JP2006197382A5 (de) | ||
EP2214407A3 (de) | Festkörperbilderfassungsvorrichtung, Ansteuerungsverfahren dafür und elektronische Vorrichtung | |
JP2011188354A5 (de) | ||
JP2008066937A5 (de) | ||
JP2007267228A5 (de) | ||
ATE533295T1 (de) | Ableseverfahren für eine cmos- bildgebungsvorrichtung mit verringertem dunkelstrom | |
EP1924079A3 (de) | Festkörperabbildungsvorrichtung | |
EP2334057A3 (de) | Festkörperabbildungsvorrichtung und Kamerasystem | |
JP2014143498A5 (de) | ||
JP2012074864A5 (de) | ||
JP2015169883A5 (de) | ||
JP2011188084A5 (de) |