ATE545960T1 - Verpackungsverfahren für einen lichtemittierenden halbleiter-chip - Google Patents
Verpackungsverfahren für einen lichtemittierenden halbleiter-chipInfo
- Publication number
- ATE545960T1 ATE545960T1 AT04106419T AT04106419T ATE545960T1 AT E545960 T1 ATE545960 T1 AT E545960T1 AT 04106419 T AT04106419 T AT 04106419T AT 04106419 T AT04106419 T AT 04106419T AT E545960 T1 ATE545960 T1 AT E545960T1
- Authority
- AT
- Austria
- Prior art keywords
- needle
- light
- semiconductor chip
- emitting semiconductor
- packaging method
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 238000004806 packaging method and process Methods 0.000 title 1
- 239000013536 elastomeric material Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
Landscapes
- Led Device Packages (AREA)
- Infusion, Injection, And Reservoir Apparatuses (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/737,433 US7087465B2 (en) | 2003-12-15 | 2003-12-15 | Method of packaging a semiconductor light emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE545960T1 true ATE545960T1 (de) | 2012-03-15 |
Family
ID=34523146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04106419T ATE545960T1 (de) | 2003-12-15 | 2004-12-09 | Verpackungsverfahren für einen lichtemittierenden halbleiter-chip |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7087465B2 (de) |
| EP (1) | EP1544925B1 (de) |
| JP (1) | JP4777641B2 (de) |
| AT (1) | ATE545960T1 (de) |
| TW (1) | TWI435466B (de) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100307605B1 (ko) * | 1997-08-26 | 2001-10-19 | 가나이 쓰도무 | 자기헤드지지기구 |
| US8545629B2 (en) | 2001-12-24 | 2013-10-01 | Crystal Is, Inc. | Method and apparatus for producing large, single-crystals of aluminum nitride |
| JP4634810B2 (ja) * | 2005-01-20 | 2011-02-16 | 信越化学工業株式会社 | シリコーン封止型led |
| JP2006310710A (ja) * | 2005-05-02 | 2006-11-09 | Sony Corp | 半導体発光素子 |
| KR100629496B1 (ko) * | 2005-08-08 | 2006-09-28 | 삼성전자주식회사 | Led 패키지 및 그 제조방법 |
| JP5513704B2 (ja) * | 2005-08-22 | 2014-06-04 | 株式会社朝日ラバー | レンズ体 |
| DE102006020529A1 (de) * | 2005-08-30 | 2007-03-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| CN101331249B (zh) | 2005-12-02 | 2012-12-19 | 晶体公司 | 掺杂的氮化铝晶体及其制造方法 |
| JP4881001B2 (ja) * | 2005-12-29 | 2012-02-22 | シチズン電子株式会社 | 発光装置 |
| US8174032B2 (en) * | 2006-03-16 | 2012-05-08 | Light Engines Corporation | Semiconductor white light sources |
| US9034103B2 (en) | 2006-03-30 | 2015-05-19 | Crystal Is, Inc. | Aluminum nitride bulk crystals having high transparency to ultraviolet light and methods of forming them |
| US9771666B2 (en) | 2007-01-17 | 2017-09-26 | Crystal Is, Inc. | Defect reduction in seeded aluminum nitride crystal growth |
| WO2008088838A1 (en) | 2007-01-17 | 2008-07-24 | Crystal Is, Inc. | Defect reduction in seeded aluminum nitride crystal growth |
| US8080833B2 (en) | 2007-01-26 | 2011-12-20 | Crystal Is, Inc. | Thick pseudomorphic nitride epitaxial layers |
| DE102007025749A1 (de) * | 2007-06-01 | 2008-12-11 | Wacker Chemie Ag | Leuchtkörper-Silicon-Formteil |
| KR101454608B1 (ko) * | 2007-11-27 | 2014-10-28 | 엘지디스플레이 주식회사 | 표시장치 |
| DE102008025491A1 (de) | 2008-05-28 | 2009-12-03 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und Leiterplatte |
| US8283769B2 (en) * | 2009-10-14 | 2012-10-09 | Stmicroelectronics, Inc. | Modular low stress package technology |
| US8597984B2 (en) | 2009-10-14 | 2013-12-03 | Stmicroelectronics, Inc. | Modular low stress package technology |
| US8853843B2 (en) | 2009-10-14 | 2014-10-07 | Stmicroelectronics, Inc. | Modular low stress package technology |
| CN103038400B (zh) | 2010-06-30 | 2016-06-22 | 晶体公司 | 使用热梯度控制的大块氮化铝单晶的生长 |
| US8962359B2 (en) | 2011-07-19 | 2015-02-24 | Crystal Is, Inc. | Photon extraction from nitride ultraviolet light-emitting devices |
| US9006006B2 (en) * | 2011-11-29 | 2015-04-14 | Sharp Kabushiki Kaisha | Manufacturing method for light-emitting device comprising multi-step cured silicon resin |
| KR20150119179A (ko) | 2013-02-11 | 2015-10-23 | 코닌클리케 필립스 엔.브이. | 파장 변환 재료의 기밀 밀봉을 가지는 led 모듈 |
| US9565782B2 (en) | 2013-02-15 | 2017-02-07 | Ecosense Lighting Inc. | Field replaceable power supply cartridge |
| US20150280057A1 (en) | 2013-03-15 | 2015-10-01 | James R. Grandusky | Methods of forming planar contacts to pseudomorphic electronic and optoelectronic devices |
| US11306897B2 (en) | 2015-02-09 | 2022-04-19 | Ecosense Lighting Inc. | Lighting systems generating partially-collimated light emissions |
| US9869450B2 (en) | 2015-02-09 | 2018-01-16 | Ecosense Lighting Inc. | Lighting systems having a truncated parabolic- or hyperbolic-conical light reflector, or a total internal reflection lens; and having another light reflector |
| US9651227B2 (en) | 2015-03-03 | 2017-05-16 | Ecosense Lighting Inc. | Low-profile lighting system having pivotable lighting enclosure |
| US9651216B2 (en) | 2015-03-03 | 2017-05-16 | Ecosense Lighting Inc. | Lighting systems including asymmetric lens modules for selectable light distribution |
| US9746159B1 (en) | 2015-03-03 | 2017-08-29 | Ecosense Lighting Inc. | Lighting system having a sealing system |
| US9568665B2 (en) | 2015-03-03 | 2017-02-14 | Ecosense Lighting Inc. | Lighting systems including lens modules for selectable light distribution |
| USD785218S1 (en) | 2015-07-06 | 2017-04-25 | Ecosense Lighting Inc. | LED luminaire having a mounting system |
| US9651232B1 (en) | 2015-08-03 | 2017-05-16 | Ecosense Lighting Inc. | Lighting system having a mounting device |
| WO2017131719A1 (en) * | 2016-01-28 | 2017-08-03 | Ecosense Lighting Inc. | Zoned optical cup |
| US10729043B1 (en) * | 2019-04-17 | 2020-07-28 | The Boeing Company | Vacuum cap seal installation |
| US11032976B1 (en) | 2020-03-16 | 2021-06-15 | Hgci, Inc. | Light fixture for indoor grow application and components thereof |
| USD933881S1 (en) | 2020-03-16 | 2021-10-19 | Hgci, Inc. | Light fixture having heat sink |
| USD933872S1 (en) | 2020-03-16 | 2021-10-19 | Hgci, Inc. | Light fixture |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4425015A (en) * | 1980-05-29 | 1984-01-10 | Texas Instruments Incorporated | Attachable, circuit-terminating, circuit board edge member |
| JPH05308185A (ja) * | 1991-10-24 | 1993-11-19 | Risho Kogyo Co Ltd | 半田マスキング方法 |
| US5477611A (en) * | 1993-09-20 | 1995-12-26 | Tessera, Inc. | Method of forming interface between die and chip carrier |
| US5663106A (en) * | 1994-05-19 | 1997-09-02 | Tessera, Inc. | Method of encapsulating die and chip carrier |
| US5518964A (en) * | 1994-07-07 | 1996-05-21 | Tessera, Inc. | Microelectronic mounting with multiple lead deformation and bonding |
| US5922252A (en) * | 1996-03-11 | 1999-07-13 | Acushnet Company | Method for making a liquid golf ball center core |
| US6407461B1 (en) * | 1997-06-27 | 2002-06-18 | International Business Machines Corporation | Injection molded integrated circuit chip assembly |
| US5981312A (en) * | 1997-06-27 | 1999-11-09 | International Business Machines Corporation | Method for injection molded flip chip encapsulation |
| US6080605A (en) * | 1998-10-06 | 2000-06-27 | Tessera, Inc. | Methods of encapsulating a semiconductor chip using a settable encapsulant |
| US5998242A (en) * | 1997-10-27 | 1999-12-07 | Lsi Logic Corporation | Vacuum assisted underfill process and apparatus for semiconductor package fabrication |
| DE19755734A1 (de) * | 1997-12-15 | 1999-06-24 | Siemens Ag | Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes |
| US6329224B1 (en) * | 1998-04-28 | 2001-12-11 | Tessera, Inc. | Encapsulation of microelectronic assemblies |
| WO2000054321A1 (en) * | 1999-03-10 | 2000-09-14 | Tessera, Inc. | Microelectronic joining processes |
| JP3700482B2 (ja) * | 1999-07-23 | 2005-09-28 | 松下電工株式会社 | 光源装置 |
| US6187613B1 (en) * | 1999-11-04 | 2001-02-13 | Industrial Technology Research Institute | Process for underfill encapsulating flip chip driven by pressure |
| US6602740B1 (en) * | 1999-11-24 | 2003-08-05 | Tessera, Inc. | Encapsulation of microelectronic assemblies |
| EP1187226B1 (de) * | 2000-09-01 | 2012-12-26 | Citizen Electronics Co., Ltd. | Oberflächenmontierbare LED und Herstellungsverfahren dafür |
| TW507500B (en) * | 2001-01-09 | 2002-10-21 | Sumitomo Rubber Ind | Electrode plate for plasma display panel and manufacturing method thereof |
| JP2002314143A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
| US6608391B1 (en) * | 2001-12-19 | 2003-08-19 | Orient Semiconductor Electronics Limited | Preparation method of underfill for flip chip package and the device |
-
2003
- 2003-12-15 US US10/737,433 patent/US7087465B2/en not_active Expired - Lifetime
-
2004
- 2004-12-09 AT AT04106419T patent/ATE545960T1/de active
- 2004-12-09 EP EP04106419A patent/EP1544925B1/de not_active Expired - Lifetime
- 2004-12-10 TW TW093138489A patent/TWI435466B/zh not_active IP Right Cessation
- 2004-12-15 JP JP2004362723A patent/JP4777641B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US20050130336A1 (en) | 2005-06-16 |
| US7087465B2 (en) | 2006-08-08 |
| JP4777641B2 (ja) | 2011-09-21 |
| JP2005183965A (ja) | 2005-07-07 |
| TWI435466B (zh) | 2014-04-21 |
| EP1544925A3 (de) | 2010-07-28 |
| EP1544925B1 (de) | 2012-02-15 |
| TW200525787A (en) | 2005-08-01 |
| EP1544925A2 (de) | 2005-06-22 |
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