ATE545960T1 - Verpackungsverfahren für einen lichtemittierenden halbleiter-chip - Google Patents

Verpackungsverfahren für einen lichtemittierenden halbleiter-chip

Info

Publication number
ATE545960T1
ATE545960T1 AT04106419T AT04106419T ATE545960T1 AT E545960 T1 ATE545960 T1 AT E545960T1 AT 04106419 T AT04106419 T AT 04106419T AT 04106419 T AT04106419 T AT 04106419T AT E545960 T1 ATE545960 T1 AT E545960T1
Authority
AT
Austria
Prior art keywords
needle
light
semiconductor chip
emitting semiconductor
packaging method
Prior art date
Application number
AT04106419T
Other languages
English (en)
Inventor
William Collins
Original Assignee
Philips Lumileds Lighting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Lumileds Lighting Co filed Critical Philips Lumileds Lighting Co
Application granted granted Critical
Publication of ATE545960T1 publication Critical patent/ATE545960T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations

Landscapes

  • Led Device Packages (AREA)
  • Infusion, Injection, And Reservoir Apparatuses (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
AT04106419T 2003-12-15 2004-12-09 Verpackungsverfahren für einen lichtemittierenden halbleiter-chip ATE545960T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/737,433 US7087465B2 (en) 2003-12-15 2003-12-15 Method of packaging a semiconductor light emitting device

Publications (1)

Publication Number Publication Date
ATE545960T1 true ATE545960T1 (de) 2012-03-15

Family

ID=34523146

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04106419T ATE545960T1 (de) 2003-12-15 2004-12-09 Verpackungsverfahren für einen lichtemittierenden halbleiter-chip

Country Status (5)

Country Link
US (1) US7087465B2 (de)
EP (1) EP1544925B1 (de)
JP (1) JP4777641B2 (de)
AT (1) ATE545960T1 (de)
TW (1) TWI435466B (de)

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Also Published As

Publication number Publication date
US20050130336A1 (en) 2005-06-16
US7087465B2 (en) 2006-08-08
JP4777641B2 (ja) 2011-09-21
JP2005183965A (ja) 2005-07-07
TWI435466B (zh) 2014-04-21
EP1544925A3 (de) 2010-07-28
EP1544925B1 (de) 2012-02-15
TW200525787A (en) 2005-08-01
EP1544925A2 (de) 2005-06-22

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