ATE545323T1 - Datentransportmodul - Google Patents

Datentransportmodul

Info

Publication number
ATE545323T1
ATE545323T1 AT06752509T AT06752509T ATE545323T1 AT E545323 T1 ATE545323 T1 AT E545323T1 AT 06752509 T AT06752509 T AT 06752509T AT 06752509 T AT06752509 T AT 06752509T AT E545323 T1 ATE545323 T1 AT E545323T1
Authority
AT
Austria
Prior art keywords
data transport
transport module
board
coupled
received
Prior art date
Application number
AT06752509T
Other languages
English (en)
Inventor
Edoardo Campini
David Formisano
Marwan Khoury
Bradley Herrin
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE545323T1 publication Critical patent/ATE545323T1/de

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1461Slidable card holders; Card stiffeners; Control or display means therefor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04QSELECTING
    • H04Q1/00Details of selecting apparatus or arrangements
    • H04Q1/02Constructional details
    • H04Q1/03Power distribution arrangements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04QSELECTING
    • H04Q1/00Details of selecting apparatus or arrangements
    • H04Q1/02Constructional details
    • H04Q1/15Backplane arrangements
    • H04Q1/155Backplane arrangements characterised by connection features
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04QSELECTING
    • H04Q2201/00Constructional details of selecting arrangements
    • H04Q2201/10Housing details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04QSELECTING
    • H04Q2201/00Constructional details of selecting arrangements
    • H04Q2201/12Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Communication Control (AREA)
  • Information Transfer Systems (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Data Exchanges In Wide-Area Networks (AREA)
AT06752509T 2005-05-18 2006-05-02 Datentransportmodul ATE545323T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/131,858 US8498309B2 (en) 2005-05-18 2005-05-18 Data transport module
PCT/US2006/018243 WO2006124515A2 (en) 2005-05-18 2006-05-02 Data transport module

Publications (1)

Publication Number Publication Date
ATE545323T1 true ATE545323T1 (de) 2012-02-15

Family

ID=37116188

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06752509T ATE545323T1 (de) 2005-05-18 2006-05-02 Datentransportmodul

Country Status (7)

Country Link
US (1) US8498309B2 (de)
EP (1) EP1884148B1 (de)
JP (1) JP4665031B2 (de)
CN (1) CN101176396B (de)
AT (1) ATE545323T1 (de)
TW (1) TWI345709B (de)
WO (1) WO2006124515A2 (de)

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US8498309B2 (en) 2005-05-18 2013-07-30 Intel Corporation Data transport module
US7558849B2 (en) * 2005-08-10 2009-07-07 Intel Corporation Hardware management module
US8610310B2 (en) 2008-02-25 2013-12-17 Tivo Inc. Wireless ethernet system
US9710418B2 (en) * 2009-01-16 2017-07-18 Dell Products L.P. System and method for security configuration
US8047853B2 (en) * 2009-03-06 2011-11-01 Ge Intelligent Platforms, Inc. Printed circuit board with an adaptable connector module
US8737076B2 (en) * 2009-05-12 2014-05-27 Telect, Inc. Power distribution module form factor
JP5601090B2 (ja) * 2010-08-26 2014-10-08 住友電気工業株式会社 通信装置
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US8842664B2 (en) * 2011-09-27 2014-09-23 Znyx Networks, Inc. Chassis management modules for advanced telecom computing architecture shelves, and methods for using the same
US8812764B2 (en) 2011-10-28 2014-08-19 Sumitomo Electric Industries, Ltd. Apparatus installing devices controlled by MDIO or SPI protocol and method to control the same
US8711681B2 (en) * 2012-02-08 2014-04-29 Radisys Corporation Switch redundancy in systems with dual-star backplanes
CN102710423A (zh) * 2012-05-14 2012-10-03 中兴通讯股份有限公司 一种atca背板
CN103580451B (zh) * 2012-08-08 2016-06-01 群光电能科技股份有限公司 一种组合式电源装置及具有组合式电源装置的电源系统
CN103677161B (zh) * 2012-09-21 2017-07-21 英业达科技有限公司 服务器机柜
CN104239264B (zh) * 2013-12-27 2018-01-09 邦彦技术股份有限公司 基于atca架构的装置及其时钟信号同步的方法
US9311760B2 (en) 2014-05-12 2016-04-12 Unmanned Innovation, Inc. Unmanned aerial vehicle authorization and geofence envelope determination
WO2016025044A2 (en) 2014-05-12 2016-02-18 Unmanned Innovation, Inc. Distributed unmanned aerial vehicle architecture
CN104536920A (zh) * 2014-12-30 2015-04-22 宁波江东波莫纳电子科技有限公司 一种计算机数据传输的控制系统
US9380728B1 (en) * 2014-12-30 2016-06-28 Birchbridge Incorporated Configurable drawer-based computing system and related methods
WO2017058232A1 (en) * 2015-10-01 2017-04-06 Hewlett Packard Enterprise Development Lp Removable module
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Also Published As

Publication number Publication date
EP1884148B1 (de) 2012-02-08
JP2008541299A (ja) 2008-11-20
TWI345709B (en) 2011-07-21
US8498309B2 (en) 2013-07-30
EP1884148A2 (de) 2008-02-06
TW200707217A (en) 2007-02-16
JP4665031B2 (ja) 2011-04-06
CN101176396B (zh) 2011-11-02
US20060262781A1 (en) 2006-11-23
WO2006124515A2 (en) 2006-11-23
CN101176396A (zh) 2008-05-07
WO2006124515A3 (en) 2007-10-25

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