ATE536669T1 - Optischer transponder mit passiver wärmeübertragung - Google Patents

Optischer transponder mit passiver wärmeübertragung

Info

Publication number
ATE536669T1
ATE536669T1 AT06785215T AT06785215T ATE536669T1 AT E536669 T1 ATE536669 T1 AT E536669T1 AT 06785215 T AT06785215 T AT 06785215T AT 06785215 T AT06785215 T AT 06785215T AT E536669 T1 ATE536669 T1 AT E536669T1
Authority
AT
Austria
Prior art keywords
optical transponder
heat
transponder module
heat transfer
passive heat
Prior art date
Application number
AT06785215T
Other languages
German (de)
English (en)
Inventor
Michael Ahrens
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE536669T1 publication Critical patent/ATE536669T1/de

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3897—Connectors fixed to housings, casing, frames or circuit boards

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Optical Communication System (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
AT06785215T 2005-06-20 2006-06-20 Optischer transponder mit passiver wärmeübertragung ATE536669T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/157,325 US7229221B2 (en) 2005-06-20 2005-06-20 Optical transponder with passive heat transfer
PCT/US2006/024037 WO2007002124A1 (en) 2005-06-20 2006-06-20 Optical transponder with passive heat transfer

Publications (1)

Publication Number Publication Date
ATE536669T1 true ATE536669T1 (de) 2011-12-15

Family

ID=37102515

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06785215T ATE536669T1 (de) 2005-06-20 2006-06-20 Optischer transponder mit passiver wärmeübertragung

Country Status (6)

Country Link
US (1) US7229221B2 (ja)
EP (1) EP1894327B1 (ja)
JP (1) JP4528343B2 (ja)
CN (1) CN1901421A (ja)
AT (1) ATE536669T1 (ja)
WO (1) WO2007002124A1 (ja)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7229221B2 (en) 2005-06-20 2007-06-12 Intel Corporation Optical transponder with passive heat transfer
US8718479B2 (en) * 2007-02-16 2014-05-06 Tyco Electronics Services Gmbh Fiber optic cable assembly for optical transceiver
US7764504B2 (en) * 2007-05-16 2010-07-27 Tyco Electronics Corporation Heat transfer system for a receptacle assembly
US7949211B1 (en) 2010-02-26 2011-05-24 Corning Incorporated Modular active board subassemblies and printed wiring boards comprising the same
US8879262B2 (en) * 2010-03-29 2014-11-04 Telefonaktiebolaget L M Ericsson (Publ) Cooling device for pluggable module, assembly of the cooling device and the pluggable module
CN101872042B (zh) 2010-05-27 2012-07-04 华为技术有限公司 光模块和光通信系统
CN102438426B (zh) * 2010-08-20 2016-08-24 住友电气工业株式会社 具有从tosa到金属壳体的有效传热路径的光收发器
CN103091798A (zh) * 2011-11-08 2013-05-08 鸿富锦精密工业（深圳）有限公司 连接器模组
CN103676027B (zh) * 2012-09-14 2016-01-27 泰科电子(上海)有限公司 连接器
CN102914835B (zh) * 2012-11-20 2014-12-10 索尔思光电（成都）有限公司 一种sfp光模块
CN105874368B (zh) * 2013-11-12 2017-07-07 莫列斯有限公司 具有散热构造的连接器系统
US9391407B1 (en) * 2015-06-12 2016-07-12 Tyco Electronics Corporation Electrical connector assembly having stepped surface
US10765032B2 (en) * 2015-11-09 2020-09-01 Hewlett Packard Enterprise Development Lp Floating liquid cooled heat transfer solution
US10025033B2 (en) 2016-03-01 2018-07-17 Advanced Semiconductor Engineering, Inc. Optical fiber structure, optical communication apparatus and manufacturing process for manufacturing the same
US10241264B2 (en) 2016-07-01 2019-03-26 Advanced Semiconductor Engineering, Inc. Semiconductor device packages
CN107046206B (zh) * 2017-01-23 2021-07-20 富士康(昆山)电脑接插件有限公司 电连接器
WO2018200022A1 (en) * 2017-04-28 2018-11-01 Intel Corporation Coreless package architecture for multi-chip opto-electronics
JP2019083299A (ja) * 2017-11-01 2019-05-30 富士通コンポーネント株式会社 光エンジン及び光モジュール
DE112018008124T5 (de) * 2018-11-08 2021-07-22 Hewlett Packard Enterprise Development Lp Thermische schnittstelleneinrichtung für gedruckte pci express m.2-schaltungsanordnungen
CN112444920A (zh) * 2019-08-27 2021-03-05 成都优博创通信技术股份有限公司 一种光模块组件及光通信设备
CN111061022B (zh) * 2020-01-08 2021-08-20 青岛海信宽带多媒体技术有限公司 一种光模块
US11199669B1 (en) * 2020-09-24 2021-12-14 Hewlett Packard Enterprise Development Lp Modular faceplate optical sub-assembly

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2522805Y2 (ja) * 1989-07-24 1997-01-16 日本電気株式会社 光通信装置
US6712527B1 (en) * 2000-01-12 2004-03-30 International Business Machines Corporation Fiber optic connections and method for using same
US6663294B2 (en) * 2001-08-29 2003-12-16 Silicon Bandwidth, Inc. Optoelectronic packaging assembly
US6704488B2 (en) * 2001-10-01 2004-03-09 Guy P. Lavallee Optical, optoelectronic and electronic packaging platform, module using the platform, and methods for producing the platform and the module
US6773532B2 (en) * 2002-02-27 2004-08-10 Jds Uniphase Corporation Method for improving heat dissipation in optical transmitter
JP3922152B2 (ja) * 2002-09-27 2007-05-30 住友電気工業株式会社 光モジュール
US7327022B2 (en) * 2002-12-30 2008-02-05 General Electric Company Assembly, contact and coupling interconnection for optoelectronics
JP2005005483A (ja) * 2003-06-12 2005-01-06 Citizen Electronics Co Ltd 高輝度発光素子
US7112885B2 (en) * 2003-07-07 2006-09-26 Board Of Regents, The University Of Texas System System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
US7229221B2 (en) 2005-06-20 2007-06-12 Intel Corporation Optical transponder with passive heat transfer

Also Published As

Publication number Publication date
CN1901421A (zh) 2007-01-24
EP1894327B1 (en) 2011-12-07
WO2007002124A1 (en) 2007-01-04
US20060285806A1 (en) 2006-12-21
JP4528343B2 (ja) 2010-08-18
EP1894327A1 (en) 2008-03-05
JP2008544700A (ja) 2008-12-04
US7229221B2 (en) 2007-06-12

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