ATE535832T1 - Optische vorrichtung mit chipniveau- präzisionsausrichtung - Google Patents
Optische vorrichtung mit chipniveau- präzisionsausrichtungInfo
- Publication number
- ATE535832T1 ATE535832T1 AT01931923T AT01931923T ATE535832T1 AT E535832 T1 ATE535832 T1 AT E535832T1 AT 01931923 T AT01931923 T AT 01931923T AT 01931923 T AT01931923 T AT 01931923T AT E535832 T1 ATE535832 T1 AT E535832T1
- Authority
- AT
- Austria
- Prior art keywords
- substrate
- optical
- optical device
- pads
- active optical
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
- G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
- G02B6/4243—Mounting of the optical light guide into a groove
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4244—Mounting of the optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Mechanical Coupling Of Light Guides (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/578,216 US6741778B1 (en) | 2000-05-23 | 2000-05-23 | Optical device with chip level precision alignment |
PCT/GB2001/002296 WO2001090793A1 (en) | 2000-05-23 | 2001-05-23 | Optical device with chip level precision alignment |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE535832T1 true ATE535832T1 (de) | 2011-12-15 |
Family
ID=24311905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT01931923T ATE535832T1 (de) | 2000-05-23 | 2001-05-23 | Optische vorrichtung mit chipniveau- präzisionsausrichtung |
Country Status (9)
Country | Link |
---|---|
US (1) | US6741778B1 (de) |
EP (1) | EP1285297B1 (de) |
JP (1) | JP2003534567A (de) |
KR (1) | KR100481023B1 (de) |
CN (1) | CN1187633C (de) |
AT (1) | ATE535832T1 (de) |
AU (1) | AU2001258610A1 (de) |
HK (1) | HK1055470A1 (de) |
WO (1) | WO2001090793A1 (de) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2815140B1 (fr) * | 2000-10-11 | 2003-07-25 | Commissariat Energie Atomique | Procede et dispositif d'alignement passif de guides de lumiere et de composants optoelectriques et systeme optique utilisant ce dispositif |
JP2002202440A (ja) * | 2000-12-28 | 2002-07-19 | Japan Aviation Electronics Industry Ltd | 光モジュールの実装構造及び実装方法 |
TW523111U (en) * | 2002-02-26 | 2003-03-01 | Ind Tech Res Inst | Passive alignment packaging structure of photoelectric device and fiber connector |
US6955480B2 (en) * | 2002-06-17 | 2005-10-18 | Agilent Technologies, Inc. | Actively aligned optoelectronic device |
US7221829B2 (en) * | 2003-02-24 | 2007-05-22 | Ngk Spark Plug Co., Ltd. | Substrate assembly for supporting optical component and method of producing the same |
CN100426381C (zh) * | 2003-05-12 | 2008-10-15 | 新科实业有限公司 | 悬架挠性电缆和头组部件挠性电路之间的改进电连接 |
US7203387B2 (en) * | 2003-09-10 | 2007-04-10 | Agency For Science, Technology And Research | VLSI-photonic heterogeneous integration by wafer bonding |
FR2860600A1 (fr) * | 2003-10-07 | 2005-04-08 | Framatome Connectors Int | Module optoelectronique et procede de fabrication associe |
US7404680B2 (en) | 2004-05-31 | 2008-07-29 | Ngk Spark Plug Co., Ltd. | Optical module, optical module substrate and optical coupling structure |
JP4558400B2 (ja) * | 2004-07-23 | 2010-10-06 | 新光電気工業株式会社 | 半導体装置 |
CN100412580C (zh) * | 2005-08-31 | 2008-08-20 | 财团法人工业技术研究院 | 光电转换基板 |
US7344318B2 (en) * | 2006-03-22 | 2008-03-18 | Intel Corporation | Optical interconnect with passive optical alignment |
KR100858823B1 (ko) * | 2007-05-30 | 2008-09-17 | 삼성에스디아이 주식회사 | 유기 발광 표시 장치 |
JP2009014749A (ja) * | 2007-06-29 | 2009-01-22 | Ntt Electornics Corp | テープファイバ、光ファイバアレイ及び光モジュール |
JP5102550B2 (ja) * | 2007-07-13 | 2012-12-19 | 富士通コンポーネント株式会社 | 光導波路保持部材及び光トランシーバ |
US7382954B1 (en) * | 2007-10-26 | 2008-06-03 | International Business Machines Corporation | Methods for passive micrometer-range alignment of components using removable reference structures |
WO2009107908A1 (en) * | 2008-02-26 | 2009-09-03 | Icu Research And Industrial Cooperation Group | A optical printed circuit board and a optical module connected to the optical printed circuit board |
DE112008003858B4 (de) * | 2008-05-09 | 2019-11-21 | Hewlett Packard Enterprise Development Lp | System und Verfahren zum Einrichten einer optischen Verbindung |
DE102008052244A1 (de) * | 2008-10-18 | 2010-04-22 | Carl Freudenberg Kg | Flexible Leiterplatte |
KR101326879B1 (ko) * | 2010-04-05 | 2013-11-13 | 한국전자통신연구원 | 광 커넥터 및 그를 구비하는 광학장치 |
KR101432114B1 (ko) * | 2010-11-15 | 2014-08-22 | 한국전자통신연구원 | 광전소자 칩 및 그를 구비하는 광학장치 |
JP2012108294A (ja) * | 2010-11-17 | 2012-06-07 | Sumitomo Electric Ind Ltd | 光素子アレイ部品及びその製造方法並びに光モジュールの製造方法 |
JP5674525B2 (ja) * | 2011-03-29 | 2015-02-25 | 日東電工株式会社 | 光電気混載基板の製法 |
JP2013092758A (ja) * | 2011-10-04 | 2013-05-16 | Citizen Holdings Co Ltd | 光デバイス及び光デバイスの製造方法 |
CN103185926A (zh) * | 2011-12-29 | 2013-07-03 | 鸿富锦精密工业(深圳)有限公司 | 光纤耦合连接器 |
US10094994B2 (en) | 2012-04-25 | 2018-10-09 | Hewlett Packard Enterprise Development Lp | Electrical/optical connector |
US20150098680A1 (en) * | 2012-07-27 | 2015-04-09 | Kevin B. Leigh | Optically connecting a chip package to an optical connector |
DE102012106982A1 (de) * | 2012-07-31 | 2014-02-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Leuchtmittels |
CN103676024A (zh) * | 2012-08-31 | 2014-03-26 | 鸿富锦精密工业(深圳)有限公司 | 光纤连接器 |
US9134490B2 (en) * | 2012-12-06 | 2015-09-15 | Laxense Inc. | Passive alignment multichannel parallel optical system |
JP2014182202A (ja) * | 2013-03-18 | 2014-09-29 | Fujitsu Ltd | 電子機器および光コネクタ |
US20140286612A1 (en) * | 2013-03-20 | 2014-09-25 | All Best Precision Technology Co., Ltd. | Coupling device |
CN103257414B (zh) * | 2013-05-07 | 2015-08-12 | 苏州旭创科技有限公司 | 用于宽带高速传输的并行光收发组件 |
CN103278894A (zh) * | 2013-06-14 | 2013-09-04 | 洛合镭信光电科技(上海)有限公司 | 耦合组件及应用其的光纤阵列模块、光收发引擎模块 |
JP6379489B2 (ja) * | 2014-01-06 | 2018-08-29 | 富士通株式会社 | 光コネクタハウジングの実装方法、光コネクタハウジング、及びこれを用いた光モジュール |
US9417411B2 (en) | 2014-02-21 | 2016-08-16 | Aurrion, Inc. | Optical and thermal interface for photonic integrated circuits |
GB2525657B (en) * | 2014-05-01 | 2018-01-31 | Xyratex Tech Limited | An optical connector assembly, an optical printed circuit board assembly, an insert, and a method of manufacturing an optical connector assembly |
US10852492B1 (en) * | 2014-10-29 | 2020-12-01 | Acacia Communications, Inc. | Techniques to combine two integrated photonic substrates |
US10222566B1 (en) * | 2015-01-08 | 2019-03-05 | Acacia Communications, Inc. | Optoelectronic package with pluggable fiber assembly |
KR102356288B1 (ko) * | 2015-03-03 | 2022-02-03 | 한국전자통신연구원 | 광 결합 장치 |
CN105182483B (zh) * | 2015-10-27 | 2017-01-25 | 上海交通大学 | 一种特种光纤与反射型光学芯片耦合装置 |
JP7006024B2 (ja) * | 2017-08-30 | 2022-01-24 | 富士電機株式会社 | 半導体装置及びその製造方法 |
DE102018105846A1 (de) * | 2018-03-14 | 2019-09-19 | Olympus Winter & Ibe Gmbh | Optisches System für ein Endoskop und Verfahren zum Fixieren einer distalen optischen Baugruppe an einer proximalen optischen Baugruppe eines optischen Systems für ein Endoskop |
CN109445043B (zh) * | 2018-12-26 | 2020-09-15 | 上海先方半导体有限公司 | 一种线缆的封装结构 |
CN110261974B (zh) * | 2019-07-05 | 2024-05-10 | 上海先方半导体有限公司 | 一种光互连模块以及包含光互连模块的系统 |
US11287656B2 (en) | 2019-12-02 | 2022-03-29 | Facebook Technologies, Llc | Aligning a collimator assembly with LED arrays |
CN114859479A (zh) * | 2022-04-27 | 2022-08-05 | 深圳市骏生科技有限公司 | 光芯片与尾纤耦合的装置及耦合工艺 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5179609A (en) | 1991-08-30 | 1993-01-12 | At&T Bell Laboratories | Optical assembly including fiber attachment |
EP0562211A1 (de) | 1992-03-25 | 1993-09-29 | International Business Machines Corporation | Selbstausrichtende Faserkoppler |
US5337398A (en) | 1992-11-30 | 1994-08-09 | At&T Bell Laboratories | Single in-line optical package |
US5420954A (en) | 1993-05-24 | 1995-05-30 | Photonics Research Incorporated | Parallel optical interconnect |
US5591941A (en) | 1993-10-28 | 1997-01-07 | International Business Machines Corporation | Solder ball interconnected assembly |
US5499312A (en) | 1993-11-09 | 1996-03-12 | Hewlett-Packard Company | Passive alignment and packaging of optoelectronic components to optical waveguides using flip-chip bonding technology |
US5535296A (en) | 1994-09-28 | 1996-07-09 | Optobahn Corporation | Integrated optoelectronic coupling and connector |
US5790730A (en) | 1994-11-10 | 1998-08-04 | Kravitz; Stanley H. | Package for integrated optic circuit and method |
JP2655112B2 (ja) | 1994-12-22 | 1997-09-17 | 日本電気株式会社 | 光モジュールの実装方法および構造 |
US5812717A (en) * | 1996-01-18 | 1998-09-22 | Methode Electronics, Inc. | Optical package with alignment means and method of assembling an optical package |
US5692083A (en) * | 1996-03-13 | 1997-11-25 | The Whitaker Corporation | In-line unitary optical device mount and package therefor |
US5818107A (en) | 1997-01-17 | 1998-10-06 | International Business Machines Corporation | Chip stacking by edge metallization |
WO1998045741A1 (en) * | 1997-04-08 | 1998-10-15 | Hitachi, Ltd. | Optical module, method for manufacturing optical module, and optical transmission device |
US5857049A (en) | 1997-05-05 | 1999-01-05 | Lucent Technologies, Inc., | Precision alignment of optoelectronic devices |
-
2000
- 2000-05-23 US US09/578,216 patent/US6741778B1/en not_active Expired - Fee Related
-
2001
- 2001-05-23 AU AU2001258610A patent/AU2001258610A1/en not_active Abandoned
- 2001-05-23 WO PCT/GB2001/002296 patent/WO2001090793A1/en active IP Right Grant
- 2001-05-23 KR KR10-2002-7015697A patent/KR100481023B1/ko not_active IP Right Cessation
- 2001-05-23 AT AT01931923T patent/ATE535832T1/de active
- 2001-05-23 JP JP2001586502A patent/JP2003534567A/ja active Pending
- 2001-05-23 EP EP01931923A patent/EP1285297B1/de not_active Expired - Lifetime
- 2001-05-23 CN CNB018099270A patent/CN1187633C/zh not_active Expired - Fee Related
-
2003
- 2003-10-28 HK HK03107753A patent/HK1055470A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20030003745A (ko) | 2003-01-10 |
KR100481023B1 (ko) | 2005-04-07 |
CN1430732A (zh) | 2003-07-16 |
JP2003534567A (ja) | 2003-11-18 |
WO2001090793A1 (en) | 2001-11-29 |
EP1285297A1 (de) | 2003-02-26 |
US6741778B1 (en) | 2004-05-25 |
HK1055470A1 (en) | 2004-01-09 |
EP1285297B1 (de) | 2011-11-30 |
AU2001258610A1 (en) | 2001-12-03 |
CN1187633C (zh) | 2005-02-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE535832T1 (de) | Optische vorrichtung mit chipniveau- präzisionsausrichtung | |
US5345529A (en) | Method for assembly of an optical fiber connective device | |
US7914211B2 (en) | Optical assemblies | |
CN101253433B (zh) | 光波导膜及其制造方法、包含它的光电混载膜及电子设备 | |
US7223023B2 (en) | Optoelectronic transmission and/or reception arrangements | |
EP1548475B1 (de) | Optische Halbleitermodul und Verfahren zu dessen Herstellung | |
TW200719776A (en) | Circuit board with optical component embedded therein | |
EP1418462A3 (de) | Optische Wellenleitervorrichtung, Herstellungsverfahren und optisches Kommunikationsgerät | |
WO2019239839A1 (ja) | 光ファイバ接続部品および光デバイスの作製方法 | |
US6524017B2 (en) | Arrangement consisting of a photodiode and an optical fiber | |
CN101241039B (zh) | 一种测试双面芯片光电性能的方法及组件 | |
SE0100367D0 (sv) | Method and device for passive alignment | |
US6693304B2 (en) | Laminated lead frame, and optical communication module and method of manufacturing the same | |
ATE518159T1 (de) | Verfahren zum koppeln von optischen elementen an opto-elektronische vorrichtungen | |
JPH06308519A (ja) | フレキシブル電気光混載配線板 | |
TW200631109A (en) | Method and device for wafer scale packaging of optical devices using a scribe and break process | |
EP1491926A1 (de) | Optische einrichtung und verfahren zu ihrer herstellung | |
KR19990061766A (ko) | 광섬유 및 광도파로 소자 접속 구조 | |
JP6507725B2 (ja) | 光通信装置、光通信モジュール、及び光通信装置の製造方法 | |
CN203259693U (zh) | 用于宽带高速传输的并行光收发组件 | |
KR20140111810A (ko) | 광 패키지 | |
JP3920264B2 (ja) | 光半導体モジュールの製造方法 | |
CN112098768A (zh) | 硅光芯片的测试方法及设备 | |
JP2000196112A (ja) | 受光モジュ―ル | |
TW200730906A (en) | Optical device |