ATE522637T1 - Verfahren zur herstellung eines sputtertargets - Google Patents

Verfahren zur herstellung eines sputtertargets

Info

Publication number
ATE522637T1
ATE522637T1 AT04713497T AT04713497T ATE522637T1 AT E522637 T1 ATE522637 T1 AT E522637T1 AT 04713497 T AT04713497 T AT 04713497T AT 04713497 T AT04713497 T AT 04713497T AT E522637 T1 ATE522637 T1 AT E522637T1
Authority
AT
Austria
Prior art keywords
substrate
target
sputtering target
yielding
coated layer
Prior art date
Application number
AT04713497T
Other languages
English (en)
Inventor
Maher Boulos
Jerzy Jurewicz
Original Assignee
Tekna Plasma Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tekna Plasma Systems Inc filed Critical Tekna Plasma Systems Inc
Application granted granted Critical
Publication of ATE522637T1 publication Critical patent/ATE522637T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/134—Plasma spraying
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/18—After-treatment
    • C23C4/185—Separation of the coating from the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3491—Manufacturing of targets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T50/00—Aeronautics or air transport
    • Y02T50/60—Efficient propulsion technologies, e.g. for aircraft

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Steroid Compounds (AREA)
  • Oxygen, Ozone, And Oxides In General (AREA)
AT04713497T 2003-02-24 2004-02-23 Verfahren zur herstellung eines sputtertargets ATE522637T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US44886703P 2003-02-24 2003-02-24
PCT/CA2004/000251 WO2004074540A1 (en) 2003-02-24 2004-02-23 Process and apparatus for the maufacture of a sputtering target

Publications (1)

Publication Number Publication Date
ATE522637T1 true ATE522637T1 (de) 2011-09-15

Family

ID=32908664

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04713497T ATE522637T1 (de) 2003-02-24 2004-02-23 Verfahren zur herstellung eines sputtertargets

Country Status (8)

Country Link
US (1) US7964247B2 (de)
EP (1) EP1597407B1 (de)
JP (1) JP4637819B2 (de)
AT (1) ATE522637T1 (de)
CA (1) CA2556786C (de)
DK (1) DK1597407T3 (de)
ES (1) ES2371070T3 (de)
WO (1) WO2004074540A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101368262B (zh) * 2005-05-05 2012-06-06 H.C.施塔克有限公司 向表面施加涂层的方法
EP1880035B1 (de) 2005-05-05 2021-01-20 Höganäs Germany GmbH Verfahren zur beschichtung der oberfläche eines sustrats und beschichteter artikel
US7654010B2 (en) * 2006-02-23 2010-02-02 Tokyo Electron Limited Substrate processing system, substrate processing method, and storage medium
US20080078268A1 (en) 2006-10-03 2008-04-03 H.C. Starck Inc. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof
US20080145688A1 (en) 2006-12-13 2008-06-19 H.C. Starck Inc. Method of joining tantalum clade steel structures
US8748785B2 (en) * 2007-01-18 2014-06-10 Amastan Llc Microwave plasma apparatus and method for materials processing
US8197894B2 (en) 2007-05-04 2012-06-12 H.C. Starck Gmbh Methods of forming sputtering targets
FR2916676B1 (fr) * 2007-06-01 2011-04-15 Goss Int Montataire Sa Machine d'impression et procede correspondant.
US20090255808A1 (en) * 2008-04-11 2009-10-15 Seagate Technology Llc Target for efficient use of precious deposition material
US8246903B2 (en) 2008-09-09 2012-08-21 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
US8043655B2 (en) 2008-10-06 2011-10-25 H.C. Starck, Inc. Low-energy method of manufacturing bulk metallic structures with submicron grain sizes
FR2944295B1 (fr) * 2009-04-10 2014-08-15 Saint Gobain Coating Solutions Cible a base de molybdene et procede d'elaboration par projection thermique d'une cible
FR2944293B1 (fr) * 2009-04-10 2012-05-18 Saint Gobain Coating Solutions Procede d'elaboration par projection thermique d'une cible
JP5987150B2 (ja) * 2010-03-04 2016-09-07 イマジニアリング株式会社 被膜形成装置
US8241930B2 (en) * 2011-05-31 2012-08-14 Primestar Solar, Inc. Methods of forming a window layer in a cadmium telluride based thin film photovoltaic device
US9120183B2 (en) 2011-09-29 2015-09-01 H.C. Starck Inc. Methods of manufacturing large-area sputtering targets
US10167556B2 (en) 2014-03-14 2019-01-01 The Board Of Trustees Of The University Of Illinois Apparatus and method for depositing a coating on a substrate at atmospheric pressure
CN104762599A (zh) * 2015-04-15 2015-07-08 京东方科技集团股份有限公司 蒸镀方法和蒸镀装置
EP3597789B1 (de) * 2017-03-15 2022-08-24 Canon Optron Inc. Hydrophiler dampfabscheidungsfilm und dampfabscheidungsmaterial
CN109440049B (zh) * 2017-11-27 2020-12-01 常州大学 一种电弧喷涂与激光重熔复合制备非晶铝涂层的方法
BE1026683B1 (nl) * 2018-10-05 2020-05-07 Soleras Advanced Coatings Bvba Sputterdoel
JP2022523357A (ja) * 2019-02-22 2022-04-22 エリコン サーフェス ソリューションズ アーゲー、 プフェフィコン 物理的気相成長（ｐｖｄ）用ターゲットの製造方法
TWI752655B (zh) * 2020-09-25 2022-01-11 光洋應用材料科技股份有限公司 鐵鉑基靶材及其製法
CN112962058A (zh) * 2021-02-02 2021-06-15 广州市尤特新材料有限公司 一种制备氮化钛薄膜及其磁控溅射靶材的方法
CA3123218A1 (en) * 2021-06-25 2022-12-25 The Governing Council Of The University Of Toronto Processes and systems for thermal spray deposition for production of heat transfer devices

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1147331A (en) 1965-02-26 1969-04-02 Hawker Siddeley Dynamics Ltd Improvements in or relating to the application of ceramic or glass surface-coatings
GB1410169A (en) * 1971-06-17 1975-10-15 Johnson Matthey Co Ltd Method of making composite layered structures by spraying
US4120930A (en) * 1974-08-08 1978-10-17 Lemelson Jerome H Method of coating a composite mold
JPS62161945A (ja) * 1985-08-20 1987-07-17 Toyo Soda Mfg Co Ltd セラミックス系スパッタリングタ−ゲットの製造法
KR920003562B1 (ko) * 1986-03-31 1992-05-04 가부시끼가이샤 도시바 내마모성 표면층을 형성한 비철금속의 기계부품
US5356674A (en) * 1989-05-04 1994-10-18 Deutsche Forschungsanstalt Fuer Luft-Raumfahrt E.V. Process for applying ceramic coatings using a plasma jet carrying a free form non-metallic element
US4934049A (en) * 1989-07-07 1990-06-19 Medtronic, Inc. Method for fabrication of a medical electrode
DE4115663A1 (de) * 1991-05-14 1992-11-19 Leybold Ag Verfahren zur herstellung eines targets, insbesondere eines rohrtargets einer sputtervorrichtung
JPH0586465A (ja) * 1991-06-28 1993-04-06 Mitsubishi Materials Corp スパツタリング用ターゲツト及びその製造方法
JPH06346232A (ja) * 1993-06-11 1994-12-20 Asahi Glass Co Ltd スパッタリング用ターゲットおよびその製造方法
US5709783A (en) * 1993-11-18 1998-01-20 Mcdonnell Douglas Corporation Preparation of sputtering targets
US5744777A (en) * 1994-12-09 1998-04-28 Northwestern University Small particle plasma spray apparatus, method and coated article
DE69633631T2 (de) * 1995-08-23 2005-10-20 Asahi Glass Ceramics Co., Ltd. Target, verfahren zu dessen herstellung und herstellung hochrefraktiver filme
JPH11269639A (ja) * 1998-03-24 1999-10-05 Sumitomo Metal Mining Co Ltd スパッタリングターゲットの再生方法
US20050208218A1 (en) * 1999-08-21 2005-09-22 Ibadex Llc. Method for depositing boron-rich coatings
JP2004520484A (ja) * 2001-01-17 2004-07-08 ナムローゼ・フェンノートシャップ・ベーカート・ソシエテ・アノニム 光触媒系スパッタリングターゲットと製造方法およびその用途
US7175802B2 (en) * 2001-09-17 2007-02-13 Heraeus, Inc. Refurbishing spent sputtering targets
BE1014736A5 (fr) 2002-03-29 2004-03-02 Alloys For Technical Applic S Procede de fabrication et de recharge de cibles pour pulverisation cathodique.

Also Published As

Publication number Publication date
ES2371070T3 (es) 2011-12-27
WO2004074540A1 (en) 2004-09-02
EP1597407A1 (de) 2005-11-23
EP1597407B1 (de) 2011-08-31
CA2556786A1 (en) 2004-09-02
JP2006518806A (ja) 2006-08-17
JP4637819B2 (ja) 2011-02-23
US7964247B2 (en) 2011-06-21
US20060233965A1 (en) 2006-10-19
CA2556786C (en) 2012-07-24
DK1597407T3 (da) 2011-09-26

Similar Documents

Publication Publication Date Title
ATE522637T1 (de) Verfahren zur herstellung eines sputtertargets
ATE528421T1 (de) Verfahren zur herstellung von gruppe-iii- metallnitrid-materialien
WO2002043124A3 (fr) Procede de fabrication d'un substrat contenant une couche mince sur un support et substrat obtenu par ce procede
WO2006019565A3 (en) Method and system for coating internal surfaces of prefabricated process piping in the field
MXPA04004205A (es) Metodo para aplicar o reparar recubrimientos de barrera termica.
ATE223514T1 (de) Organisches substrat mit optischen schichten hergestellt mittels magnetron-zerstäubung und verfahren zu seiner herstellung
WO2005121397A3 (en) Controlled vapor deposition of multilayered coatings adhered by an oxide layer
WO2004005193A3 (en) Fabrication and activation processes for nanostructure composite field emission cathodes
WO2005114692A3 (en) In-situ process chamber preparation methods for plasma ion implantation systems
WO2001036704A3 (en) Method and apparatus for forming carbonaceous film
TW200628619A (en) Vacuum coating system
WO2002084702A3 (en) Sputtering deposition apparatus and method for depositing surface films
ATE486617T1 (de) Verfahren zur herstellung einer medizinischen implantatskomponente und derartige komponente
SG163532A1 (en) System and method for restoring or regenerating an article
KR970003431A (ko) 개선된 질화 티타늄 함유 방지층을 형성하기 위한 연속적인 방법
WO2001042522A3 (en) Sputtering target and methods of making same
DE60319721D1 (de) Verfahren zur herstellung eines formteils mit einer eine nutzmikrostruktur tragenden gekrümmten hauptfläche
SG139761A1 (en) A method and apparatus for providing a substrate coating having a predetermined resistivity, and uses therefor
ATE308629T1 (de) Verfahren zur herstellung eines pvd al2o3 beschichteten schneidwerkzeugs
ATE286153T1 (de) Vakuumbehandlungsanlage und verfahren zur herstellung von werkstücken
DE60230277D1 (de) Verfahren zur Metallisierung eines Kunststofftanks und verfahren zur Metallisierung einer Kunststoffpalette
DE50311895D1 (de) Verfahren zur abscheidung von metallfreien kohlenstoffschichten
ATE538489T1 (de) Verfahren zur herstellung magnetron- sputterbeschichteter substrate und anlage hierfür
US8721845B2 (en) Coated article and method for making same
WO2005059197A3 (de) Verfahren und vorrichtung zum magnetronsputtern

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 1597407

Country of ref document: EP