ATE520147T1 - Einseitige werkstückbearbeitung - Google Patents

Einseitige werkstückbearbeitung

Info

Publication number
ATE520147T1
ATE520147T1 AT07757232T AT07757232T ATE520147T1 AT E520147 T1 ATE520147 T1 AT E520147T1 AT 07757232 T AT07757232 T AT 07757232T AT 07757232 T AT07757232 T AT 07757232T AT E520147 T1 ATE520147 T1 AT E520147T1
Authority
AT
Austria
Prior art keywords
workpiece
rotor
head
end point
bowl
Prior art date
Application number
AT07757232T
Other languages
English (en)
Inventor
Jason Rye
Daniel Woodruff
Kyle Hanson
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/359,969 external-priority patent/US8082932B2/en
Application filed by Semitool Inc filed Critical Semitool Inc
Application granted granted Critical
Publication of ATE520147T1 publication Critical patent/ATE520147T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Press Drives And Press Lines (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Threshing Machine Elements (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AT07757232T 2006-02-22 2007-02-20 Einseitige werkstückbearbeitung ATE520147T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/359,969 US8082932B2 (en) 2004-03-12 2006-02-22 Single side workpiece processing
US11/619,515 US20070110895A1 (en) 2005-03-08 2007-01-03 Single side workpiece processing
PCT/US2007/062448 WO2007101018A2 (en) 2006-02-22 2007-02-20 Single side workpiece processing

Publications (1)

Publication Number Publication Date
ATE520147T1 true ATE520147T1 (de) 2011-08-15

Family

ID=38459718

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07757232T ATE520147T1 (de) 2006-02-22 2007-02-20 Einseitige werkstückbearbeitung

Country Status (8)

Country Link
US (1) US20070110895A1 (de)
EP (1) EP1986793B1 (de)
JP (1) JP2009527929A (de)
KR (1) KR101390907B1 (de)
AT (1) ATE520147T1 (de)
SG (1) SG180066A1 (de)
TW (1) TWI343617B (de)
WO (1) WO2007101018A2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7938942B2 (en) * 2004-03-12 2011-05-10 Applied Materials, Inc. Single side workpiece processing
US8298338B2 (en) * 2007-12-26 2012-10-30 Samsung Electronics Co., Ltd. Chemical vapor deposition apparatus
JP5430873B2 (ja) * 2008-04-16 2014-03-05 株式会社Ｓｏｋｕｄｏ 基板洗浄装置およびそれを備えた基板処理装置
US8681472B2 (en) * 2008-06-20 2014-03-25 Varian Semiconductor Equipment Associates, Inc. Platen ground pin for connecting substrate to ground
US8033771B1 (en) * 2008-12-11 2011-10-11 Novellus Systems, Inc. Minimum contact area wafer clamping with gas flow for rapid wafer cooling
JP5546472B2 (ja) * 2010-03-24 2014-07-09 東京エレクトロン株式会社 液処理装置、液処理方法及びその液処理方法を実行させるためのプログラムを記録した記録媒体
US9799537B2 (en) 2010-12-03 2017-10-24 Applied Materials, Inc. Processing assembly for semiconductor workpiece and methods of processing same
US8541309B2 (en) 2010-12-03 2013-09-24 Applied Materials, Inc. Processing assembly for semiconductor workpiece and methods of processing same
US9657397B2 (en) * 2013-12-31 2017-05-23 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
US9597701B2 (en) * 2013-12-31 2017-03-21 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
US9881788B2 (en) * 2014-05-22 2018-01-30 Lam Research Corporation Back side deposition apparatus and applications
US10167552B2 (en) * 2015-02-05 2019-01-01 Lam Research Ag Spin chuck with rotating gas showerhead
US10851457B2 (en) 2017-08-31 2020-12-01 Lam Research Corporation PECVD deposition system for deposition on selective side of the substrate
KR102695104B1 (ko) 2019-08-16 2024-08-14 램 리써치 코포레이션 웨이퍼 내에서 차동 보우를 보상하기 위한 공간적으로 튜닝 가능한 증착 방법 및 장치
CN112736017B (zh) * 2020-12-30 2023-03-24 上海至纯洁净系统科技股份有限公司 一种用于单晶圆片背面清洁机构及其使用方法
CN113161266B (zh) * 2021-04-20 2025-08-22 常州亿晶光电科技有限公司 硅片刻蚀装置

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US4510176A (en) * 1983-09-26 1985-04-09 At&T Bell Laboratories Removal of coating from periphery of a semiconductor wafer
JPH06103687B2 (ja) * 1988-08-12 1994-12-14 大日本スクリーン製造株式会社 回転式表面処理方法および回転式表面処理における処理終点検出方法、ならびに回転式表面処理装置
JP3388628B2 (ja) * 1994-03-24 2003-03-24 東京応化工業株式会社 回転式薬液処理装置
JP3099054B2 (ja) * 1994-09-09 2000-10-16 東京エレクトロン株式会社 塗布装置及びその方法
US5762751A (en) * 1995-08-17 1998-06-09 Semitool, Inc. Semiconductor processor with wafer face protection
TW359854B (en) * 1996-06-21 1999-06-01 Tokyo Electron Ltd Processing apparatus and processing method
US6004828A (en) * 1997-09-30 1999-12-21 Semitool, Inc, Semiconductor processing workpiece support with sensory subsystem for detection of wafers or other semiconductor workpieces
AT405655B (de) * 1997-03-26 1999-10-25 Sez Semiconduct Equip Zubehoer Verfahren und vorrichtung zum einseitigen bearbeiten scheibenförmiger gegenstände
US6027602A (en) * 1997-08-29 2000-02-22 Techpoint Pacific Singapore Pte. Ltd. Wet processing apparatus
AT407586B (de) * 1997-05-23 2001-04-25 Sez Semiconduct Equip Zubehoer Anordnung zum behandeln scheibenförmiger gegenstände, insbesondere von siliziumwafern
AT411304B (de) * 1997-06-18 2003-11-25 Sez Ag Träger für scheibenförmige gegenstände, insbesondere silizium-wafer
DE19755694C2 (de) * 1997-12-16 2000-05-31 Sez Semiconduct Equip Zubehoer Handhabungsvorrichtung für dünne, scheibenförmige Gegenstände
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US6492284B2 (en) * 1999-01-22 2002-12-10 Semitool, Inc. Reactor for processing a workpiece using sonic energy
JP4219562B2 (ja) * 1999-04-13 2009-02-04 セミトゥール・インコーポレイテッド ワークピースを電気化学的に処理するためのシステム
EP1052682B1 (de) * 1999-04-28 2002-01-09 SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG Vorrichtung und Verfahren zur Flüssigkeitsbehandlung von scheibenförmigen Gegenständen
US6536454B2 (en) * 2000-07-07 2003-03-25 Sez Ag Device for treating a disc-shaped object
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US6558964B2 (en) * 2000-12-27 2003-05-06 Lam Research Corporation Method and apparatus for monitoring a semiconductor wafer during a spin drying operation
JP3912652B2 (ja) 2001-06-29 2007-05-09 株式会社Ｓｕｍｃｏ 半導体ウェーハの片面エッチング方法およびその装置
AT411335B (de) * 2002-03-06 2003-12-29 Sez Ag Verfahren zum nassbehandeln von scheibenförmigen gegenständen
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JP4125148B2 (ja) * 2003-02-03 2008-07-30 株式会社荏原製作所 基板処理装置
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Also Published As

Publication number Publication date
TW200739787A (en) 2007-10-16
SG180066A1 (en) 2012-05-30
EP1986793B1 (de) 2011-08-10
US20070110895A1 (en) 2007-05-17
WO2007101018A2 (en) 2007-09-07
KR101390907B1 (ko) 2014-05-26
KR20080100370A (ko) 2008-11-17
EP1986793A2 (de) 2008-11-05
WO2007101018A3 (en) 2008-07-17
EP1986793A4 (de) 2010-04-07
JP2009527929A (ja) 2009-07-30
TWI343617B (en) 2011-06-11

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