ATE518615T1 - Verfahren zum bonden von flächen mittels eines klebstoffes, der mit laser gehartet wird - Google Patents

Verfahren zum bonden von flächen mittels eines klebstoffes, der mit laser gehartet wird

Info

Publication number
ATE518615T1
ATE518615T1 AT06744034T AT06744034T ATE518615T1 AT E518615 T1 ATE518615 T1 AT E518615T1 AT 06744034 T AT06744034 T AT 06744034T AT 06744034 T AT06744034 T AT 06744034T AT E518615 T1 ATE518615 T1 AT E518615T1
Authority
AT
Austria
Prior art keywords
laser
curable adhesive
bonding surfaces
heat
adhesive
Prior art date
Application number
AT06744034T
Other languages
English (en)
Inventor
Changhai Wang
Duncan Hand
Fabrice Bardin
Original Assignee
Univ Heriot Watt
Imec
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Heriot Watt, Imec filed Critical Univ Heriot Watt
Application granted granted Critical
Publication of ATE518615T1 publication Critical patent/ATE518615T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1696—Laser beams making use of masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/032—Gluing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Micromachines (AREA)
  • Semiconductor Lasers (AREA)
  • Laser Beam Processing (AREA)
AT06744034T 2005-05-27 2006-05-30 Verfahren zum bonden von flächen mittels eines klebstoffes, der mit laser gehartet wird ATE518615T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0510873.3A GB0510873D0 (en) 2005-05-27 2005-05-27 Laser assisted bonding of surfaces
PCT/GB2006/001971 WO2006126015A1 (en) 2005-05-27 2006-05-30 Laser assisted system and method for bonding of surfaces ; microcavity for packaging mems devices

Publications (1)

Publication Number Publication Date
ATE518615T1 true ATE518615T1 (de) 2011-08-15

Family

ID=34834766

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06744034T ATE518615T1 (de) 2005-05-27 2006-05-30 Verfahren zum bonden von flächen mittels eines klebstoffes, der mit laser gehartet wird

Country Status (5)

Country Link
US (1) US20110061884A1 (de)
EP (1) EP1907160B1 (de)
AT (1) ATE518615T1 (de)
GB (1) GB0510873D0 (de)
WO (1) WO2006126015A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2480270T3 (es) * 2010-01-18 2014-07-25 Homag Holzbearbeitungssysteme Ag Dispositivo y procedimiento para el revestimiento de piezas de trabajo
SG184064A1 (en) * 2010-03-15 2012-10-30 Agency Science Tech & Res A process for forming a laminated structure
KR20130118491A (ko) * 2012-04-20 2013-10-30 삼성디스플레이 주식회사 레이저 실링 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
EP2747129A1 (de) * 2012-12-18 2014-06-25 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Härten eines wärmehärtbaren Werkstoffs in einer eingebetteten Härtezone
US9416003B2 (en) * 2014-02-24 2016-08-16 Freescale Semiconductor, Inc. Semiconductor die with high pressure cavity
DE102015202575A1 (de) * 2015-02-12 2016-08-18 Robert Bosch Gmbh Vorrichtung zum Bearbeiten eines Substrats
US9832867B2 (en) * 2015-11-23 2017-11-28 Medtronic, Inc. Embedded metallic structures in glass
CN108746996A (zh) * 2018-08-10 2018-11-06 深圳市联华材料技术有限公司 一种基于激光射线的材料粘合方法和装置
KR102182781B1 (ko) * 2019-01-04 2020-11-25 주식회사 프로텍 레이저 본딩 장치용 마스크 교체 유닛
KR20200136698A (ko) * 2019-05-28 2020-12-08 코닝 인코포레이티드 유리 라미네이트 제조 방법 및 장치
US20210398936A1 (en) * 2020-06-23 2021-12-23 Amkor Technology Singapore Holding Pte. Ltd. Laser bonded devices, laser bonding tools, and related methods

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3741916C2 (de) * 1987-12-10 1996-07-18 Resma Gmbh Fuegetechnik Indust Verfahren zum Aushärten von Klebstoffen auf Kunststoffbasis
JPH05241168A (ja) * 1992-02-27 1993-09-21 Nec Kagoshima Ltd 液晶パネルの製造方法
JPH05290490A (ja) * 1992-04-10 1993-11-05 Fujitsu Ltd 磁気ヘッドの製造方法
US6072148A (en) * 1996-12-10 2000-06-06 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Device for producing connections between two respective contact elements by means of laser energy
US6624003B1 (en) * 2002-02-06 2003-09-23 Teravicta Technologies, Inc. Integrated MEMS device and package
US6908791B2 (en) * 2002-04-29 2005-06-21 Texas Instruments Incorporated MEMS device wafer-level package
FR2850390B1 (fr) * 2003-01-24 2006-07-14 Soitec Silicon On Insulator Procede d'elimination d'une zone peripherique de colle lors de la fabrication d'un substrat composite

Also Published As

Publication number Publication date
US20110061884A1 (en) 2011-03-17
WO2006126015A1 (en) 2006-11-30
EP1907160A1 (de) 2008-04-09
GB0510873D0 (en) 2005-07-06
EP1907160B1 (de) 2011-08-03

Similar Documents

Publication Publication Date Title
ATE518615T1 (de) Verfahren zum bonden von flächen mittels eines klebstoffes, der mit laser gehartet wird
WO2007073482A3 (en) Method and apparatus for processing multiphoton curable photoreactive compositions
TW200624967A (en) Apparatus for applying a photo curing resin and method of applying a photosetting
ATE465512T1 (de) Vorrichtung und verfahren zum verbinden von wafern
ATE440922T1 (de) Verfahren zum assemblieren von substraten mit wärmebehandlungen bei niedrigen temperaturen
DK1657072T3 (da) Fremgangsmåde til tilvejebringelse af et billede ved hjælp af laser
SG131773A1 (en) Method of dividing a non-metal substrate
EP2070685A4 (de) Zwischenglied zur laserverbindung und dieses verwendende verbindungsverfahren
TW200634395A (en) Binding method and binding device
TWI618166B (zh) 劃刻設備
WO2008094758A8 (en) Method of bonding perfluoroelastomeric materials to a surface
BRPI1014238A2 (pt) Estrutura de assento e método para sua formação, usando um adesivo aquecido a laser
DE602006021063D1 (de) Verfahren zur verbesserung der glashaftung
DE602005016716D1 (de) Laserdekontaminierung der oberfläche eines formteils
WO2008149745A1 (ja) 接着方法並びにそれを用いて作製したバイオケミカルチップ及び光学部品
TW200735991A (en) Method and apparatus for bonding electronic elements to substrate using laser beam
DE502006002726D1 (de) Gerät und verfahren zum herstellen eines geräts
ATE401368T1 (de) Verfahren zum zusammenfügen von zwei substraten mittels kleben und verfahren zum auseinandernehmen der geklebten anordnung mittels migration
BRPI0519266A2 (pt) mÉtodo de superfÍcies de vedaÇço
DE502006004196D1 (de) Lasermarkierung nahe der oberfläche bei innenbearbeiteten transparenten körpern
DE60210335D1 (de) Verfahren zur reparatur von beschichteten substratoberflächen
SG101504A1 (en) Method for bonding members, and disc manufacturing method and device
DK1078965T3 (da) Termoaktiverbar trykfølsom klæbefolie og fremgangsmåde til fremstilling af strukturelle klæbeforbindelser
SE9900622D0 (sv) Förfaringssätt för sammanfogning av ett undre substrat med ett övre substrat medelst lim
WO2013166499A3 (en) Method of curing by laser an adhesive bond between two or more panels

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties