ATE517962T1 - Trockenes, thermisches zwischenlagematerial - Google Patents

Trockenes, thermisches zwischenlagematerial

Info

Publication number
ATE517962T1
ATE517962T1 AT02770509T AT02770509T ATE517962T1 AT E517962 T1 ATE517962 T1 AT E517962T1 AT 02770509 T AT02770509 T AT 02770509T AT 02770509 T AT02770509 T AT 02770509T AT E517962 T1 ATE517962 T1 AT E517962T1
Authority
AT
Austria
Prior art keywords
compound
providing
heat transfer
intermediate material
compound includes
Prior art date
Application number
AT02770509T
Other languages
English (en)
Inventor
Prakash Khatri
Original Assignee
Aos Thermal Compounds Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aos Thermal Compounds Llc filed Critical Aos Thermal Compounds Llc
Application granted granted Critical
Publication of ATE517962T1 publication Critical patent/ATE517962T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737Organic materials with or without a thermoconductive filler
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Drying Of Solid Materials (AREA)
  • Glass Compositions (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AT02770509T 2001-09-14 2002-09-13 Trockenes, thermisches zwischenlagematerial ATE517962T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/951,501 US6610635B2 (en) 2000-09-14 2001-09-14 Dry thermal interface material
PCT/US2002/029044 WO2003024724A2 (en) 2001-09-14 2002-09-13 Dry thermal interface material

Publications (1)

Publication Number Publication Date
ATE517962T1 true ATE517962T1 (de) 2011-08-15

Family

ID=25491753

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02770509T ATE517962T1 (de) 2001-09-14 2002-09-13 Trockenes, thermisches zwischenlagematerial

Country Status (9)

Country Link
US (2) US6610635B2 (de)
EP (1) EP1425364B1 (de)
JP (1) JP4546086B2 (de)
KR (1) KR100919798B1 (de)
CN (1) CN100345931C (de)
AT (1) ATE517962T1 (de)
AU (1) AU2002335746A1 (de)
ES (1) ES2370482T3 (de)
WO (1) WO2003024724A2 (de)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6610635B2 (en) * 2000-09-14 2003-08-26 Aos Thermal Compounds Dry thermal interface material
DE10157671A1 (de) * 2001-11-24 2003-06-05 Merck Patent Gmbh Optimierter Einsatz von PCM in Kühlvorrichtungen
US7473995B2 (en) * 2002-03-25 2009-01-06 Intel Corporation Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
US7846778B2 (en) * 2002-02-08 2010-12-07 Intel Corporation Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
US6841867B2 (en) * 2002-12-30 2005-01-11 Intel Corporation Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials
US20050016714A1 (en) * 2003-07-09 2005-01-27 Chung Deborah D.L. Thermal paste for improving thermal contacts
US20050049350A1 (en) * 2003-08-25 2005-03-03 Sandeep Tonapi Thin bond-line silicone adhesive composition and method for preparing the same
US7150914B2 (en) * 2003-10-14 2006-12-19 Advanced Energy Technology Inc. Heat spreader for emissive display device
US7160619B2 (en) * 2003-10-14 2007-01-09 Advanced Energy Technology Inc. Heat spreader for emissive display device
US7180173B2 (en) * 2003-11-20 2007-02-20 Taiwan Semiconductor Manufacturing Co. Ltd. Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC)
US20050257532A1 (en) * 2004-03-11 2005-11-24 Masami Ikeda Module for cooling semiconductor device
WO2005108530A1 (en) * 2004-04-30 2005-11-17 The Lubrizol Corporation Metal forming lubricant composition containing boron nitride
US7269015B2 (en) * 2005-02-01 2007-09-11 Tyco Electronics Corporation Heat sink interface insert
US20070031684A1 (en) 2005-08-03 2007-02-08 Anderson Jeffrey T Thermally conductive grease
CN1916105A (zh) * 2005-08-19 2007-02-21 鸿富锦精密工业(深圳)有限公司 散热膏及其制备方法
CN1978583A (zh) * 2005-12-09 2007-06-13 富准精密工业(深圳)有限公司 热介面材料
TWI291480B (en) * 2005-12-20 2007-12-21 Ind Tech Res Inst Composition for thermal interface materials
US20080004191A1 (en) * 2006-06-29 2008-01-03 Polymatech Co., Ltd. Thermal conductive grease
US20080166552A1 (en) * 2006-11-06 2008-07-10 Arlon, Inc. Silicone based compositions for thermal interface materials
DE102007028275A1 (de) * 2007-06-15 2008-12-18 Vacuumschmelze Gmbh & Co. Kg Hartlotfolie auf Eisen-Basis sowie Verfahren zum Hartlöten
US8013024B2 (en) * 2007-06-29 2011-09-06 Deborah D. L. Chung High-performance interface materials for improving thermal contacts
US9795059B2 (en) 2007-11-05 2017-10-17 Laird Technologies, Inc. Thermal interface materials with thin film or metallization
US8445102B2 (en) * 2007-11-05 2013-05-21 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US8545987B2 (en) * 2007-11-05 2013-10-01 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US20090184283A1 (en) * 2008-01-18 2009-07-23 Deborah Duen Ling Chung Antioxidants for phase change ability and thermal stability enhancement
US7998791B2 (en) * 2008-02-01 2011-08-16 National Semiconductor Corporation Panel level methods and systems for packaging integrated circuits with integrated heat sinks
TWM351450U (en) * 2008-07-24 2009-02-21 Yi-Min Lin Integrated circuit having porous ceramic heat dissipation plate
US7816785B2 (en) * 2009-01-22 2010-10-19 International Business Machines Corporation Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
US8199506B2 (en) * 2009-08-17 2012-06-12 Seagate Technology, Llc Solid state data storage assembly
FR2956277A1 (fr) * 2010-02-09 2011-08-12 Peugeot Citroen Automobiles Sa Circuit imprime a elements de connexion couples thermiquement par l'arriere par un joint thermo-conducteur
US9260645B2 (en) * 2010-02-23 2016-02-16 Laird Technologies, Inc. Thermal interface materials including thermally reversible gels
US9771508B2 (en) 2010-02-23 2017-09-26 Laird Technologies, Inc. Thermal interface materials including thermally reversible gels
US10087351B2 (en) 2010-02-23 2018-10-02 Laird Technologies, Inc. Materials including thermally reversible gels
US8647752B2 (en) * 2010-06-16 2014-02-11 Laird Technologies, Inc. Thermal interface material assemblies, and related methods
US9316447B2 (en) 2012-03-22 2016-04-19 Koninklijke Philips N.V. Thermal interface material
US9085719B2 (en) 2013-03-18 2015-07-21 International Business Machines Corporation Thermally reversible thermal interface materials with improved moisture resistance
DE102013207043B4 (de) 2013-04-18 2020-02-27 Infineon Technologies Ag Halbleitermodulanordnung und Verfahren zur Montage eines Halbleitermoduls an einem Kühlkörper
US20150136359A1 (en) * 2013-11-19 2015-05-21 Newtech Enterprise Limited Flexible heat transfer assembly
KR20160094385A (ko) 2013-12-05 2016-08-09 허니웰 인터내셔날 인코포레이티드 조절된 pH를 갖는 주석(II) 메탄술포네이트 용액
BR112016029690A2 (pt) 2014-07-07 2017-08-22 Honeywell Int Inc material de interface térmica, e componente eletrônico
MY183994A (en) 2014-12-05 2021-03-17 Honeywell Int Inc High performance thermal interface materials with low thermal impedance
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
EP3426746B1 (de) 2016-03-08 2021-07-14 Honeywell International Inc. Phasenwechselmaterial
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
CN106496633B (zh) * 2016-11-07 2018-12-11 复旦大学 高热导率聚苯乙烯氮化硼复合材料及其制备方法
KR102166470B1 (ko) 2017-05-16 2020-10-16 주식회사 엘지화학 수지 조성물
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
JP6848816B2 (ja) * 2017-10-30 2021-03-24 住友金属鉱山株式会社 熱伝導性グリース
US10741471B2 (en) 2018-01-19 2020-08-11 Laird Technologies, Inc. Highly compliant non-silicone putties and thermal interface materials including the same
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
KR102162493B1 (ko) 2018-03-28 2020-10-07 주식회사 엘지화학 수지 조성물
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
US20230392008A1 (en) 2020-09-30 2023-12-07 Kyocera Corporation Grease composition and electronic component using same
JP7494700B2 (ja) 2020-10-23 2024-06-04 住友金属鉱山株式会社 熱伝導性グリース

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3669884A (en) 1970-06-29 1972-06-13 Gen Electric Methyl alkyl silicone grease containing zinc naphthenate
WO1982003086A1 (en) * 1981-03-03 1982-09-16 Lochner Kaspar Pasty damping agent,method for preparing and using same
US4738737A (en) 1986-06-02 1988-04-19 Combustion Engineering, Inc. Method of using a high temperature ultrasonic couplant material
US4803100A (en) 1987-10-21 1989-02-07 International Business Machines Corporation Suspension and use thereof
US5167851A (en) 1991-04-22 1992-12-01 Thermoset Plastics, Inc. Hydrophilic thermally conductive grease
US5250209A (en) 1991-04-22 1993-10-05 Thermoset Plastics, Inc. Thermal coupling with water-washable thermally conductive grease
US5194480A (en) 1991-05-24 1993-03-16 W. R. Grace & Co.-Conn. Thermally conductive elastomer
US5213868A (en) 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
EP0956590A1 (de) 1996-04-29 1999-11-17 Parker-Hannifin Corporation Anpassungsfähiges thermisches zwischenlagematerial für elektronischen komponenten
US6286212B1 (en) * 1996-05-29 2001-09-11 Manford L. Eaton Thermally conductive material and method of using the same
US6143076A (en) 1996-06-21 2000-11-07 Thermalloy Inc. Applicator head
US6059116A (en) 1996-06-21 2000-05-09 Thermalloy, Inc. Heat sink packaging devices
US5904796A (en) 1996-12-05 1999-05-18 Power Devices, Inc. Adhesive thermal interface and method of making the same
US6114429A (en) 1997-08-06 2000-09-05 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone composition
EP0906945A1 (de) 1997-10-03 1999-04-07 American Oil and Supply LLC Versprühbares thermisches Fett
TW358565U (en) 1997-12-01 1999-05-11 Hon Hai Prec Ind Co Ltd Protection back lid for heat transfer dielectric plate
JP2938428B1 (ja) * 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性グリース組成物
JP2000044977A (ja) * 1998-08-04 2000-02-15 Kyodo Yushi Co Ltd グリース組成物
JP2000109373A (ja) * 1998-10-02 2000-04-18 Shin Etsu Chem Co Ltd 放熱用シリコーングリース組成物及びそれを使用した半導体装置
JP2000169873A (ja) * 1998-12-02 2000-06-20 Shin Etsu Chem Co Ltd シリコーングリース組成物
CN1206892C (zh) 1998-12-15 2005-06-15 帕克-汉尼芬有限公司 相变热界面材料的施涂方法
JP2001168246A (ja) * 1999-11-30 2001-06-22 Three M Innovative Properties Co 熱伝導性シート及びその製造方法
US6475962B1 (en) * 2000-09-14 2002-11-05 Aos Thermal Compounds, Llc Dry thermal grease
US6610635B2 (en) * 2000-09-14 2003-08-26 Aos Thermal Compounds Dry thermal interface material
JP2003027080A (ja) * 2001-07-11 2003-01-29 Hitachi Ltd 熱伝導性グリース、その実装方法、電子部品の冷却方法、電子装置及び情報処理装置

Also Published As

Publication number Publication date
EP1425364A2 (de) 2004-06-09
WO2003024724A2 (en) 2003-03-27
US6900163B2 (en) 2005-05-31
US20040018945A1 (en) 2004-01-29
KR20040062538A (ko) 2004-07-07
CN1697870A (zh) 2005-11-16
ES2370482T3 (es) 2011-12-16
US20020086801A1 (en) 2002-07-04
US6610635B2 (en) 2003-08-26
JP2005502776A (ja) 2005-01-27
WO2003024724A3 (en) 2003-05-30
EP1425364B1 (de) 2011-07-27
KR100919798B1 (ko) 2009-10-01
JP4546086B2 (ja) 2010-09-15
WO2003024724B1 (en) 2003-09-04
CN100345931C (zh) 2007-10-31
AU2002335746A1 (en) 2003-04-01

Similar Documents

Publication Publication Date Title
ATE517962T1 (de) Trockenes, thermisches zwischenlagematerial
US6475962B1 (en) Dry thermal grease
CA2471629A1 (en) Improved thermal interface material
WO2000045099A3 (en) Cooling system for downhole tools
AU2002340453A1 (en) Device and method for package warp compensation in an integrated heat spreader
TW332963B (en) Thermal interface material
KR20070118099A (ko) 전열시트, 방열구조체 및 전열시트의 사용방법
TW200634263A (en) Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
CA2476202A1 (en) Systems and methods for modifying an ice-to-object interface
DE60235647D1 (de) Hochleitungseinsätze verwendende wärmeableitende komponente
WO2004095575A3 (en) Electronic assembly with fluid cooling and associated methods
TW200702353A (en) Epoxy resin composition and curing product thereof
EP1821586A4 (de) Leiterplatte und leiterplatten-herstellungsverfahren
ATE356541T1 (de) Elektronisches leistungssystem mit passiver kühlung
CN106102418A (zh) 基于均热板的液冷vpx机箱高效散热装置及方法
GB0320063D0 (en) Heat sink with angled heat pipe
CN1558881A (zh) 用于金属或陶瓷的接合剂以及由其接合金属或陶瓷的方法
NO20070743L (no) Baererfolie foe en pergefolie.
CN204555412U (zh) 半导体制冷器散热结构
JP2002324993A (ja) 電子機器装置
WO2007106209A3 (en) Thermally conductive grease and methods and devices in which said grease is used
CN107573446A (zh) 氮化硼纳米片与聚丙烯酸凝胶复合热界面材料及制备方法
KR960019424A (ko) 전계 방출 디바이스 어셈블리의 복사 냉각 장치 및 방법
CN214518259U (zh) 一种陶瓷线路板激光切割装置
TW200512900A (en) High heat dissipation chip module and substrate thereof

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties